AU2001264035A1 - Flexible, insulating and heat-stable composite materials - Google Patents

Flexible, insulating and heat-stable composite materials

Info

Publication number
AU2001264035A1
AU2001264035A1 AU2001264035A AU6403501A AU2001264035A1 AU 2001264035 A1 AU2001264035 A1 AU 2001264035A1 AU 2001264035 A AU2001264035 A AU 2001264035A AU 6403501 A AU6403501 A AU 6403501A AU 2001264035 A1 AU2001264035 A1 AU 2001264035A1
Authority
AU
Australia
Prior art keywords
composite materials
insulating
heat
flexible
stable composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001264035A
Other languages
English (en)
Inventor
Alain Dubuisson
Daniel Kamenetzky
Sabine Lebourg
Christian Nodin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Von Roll Isola France SA
Original Assignee
Von Roll Isola France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Roll Isola France SA filed Critical Von Roll Isola France SA
Publication of AU2001264035A1 publication Critical patent/AU2001264035A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
AU2001264035A 2000-05-29 2001-05-28 Flexible, insulating and heat-stable composite materials Abandoned AU2001264035A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0006821A FR2809406B1 (fr) 2000-05-29 2000-05-29 Materiaux composites flexibles, isolants et thermiquement stables constitues d'un support impregne d'une resine acrylique
FR0006821 2000-05-29
PCT/FR2001/001636 WO2001092380A1 (fr) 2000-05-29 2001-05-28 Materiaux composites flexibles, isolants et thermiquement stables

Publications (1)

Publication Number Publication Date
AU2001264035A1 true AU2001264035A1 (en) 2001-12-11

Family

ID=8850703

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001264035A Abandoned AU2001264035A1 (en) 2000-05-29 2001-05-28 Flexible, insulating and heat-stable composite materials

Country Status (6)

Country Link
EP (1) EP1290067B1 (de)
AT (1) ATE321091T1 (de)
AU (1) AU2001264035A1 (de)
DE (1) DE60118182T2 (de)
FR (1) FR2809406B1 (de)
WO (1) WO2001092380A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8440312B2 (en) 2009-03-12 2013-05-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US9701802B2 (en) 2009-04-08 2017-07-11 Allnex Ip S.A.R.L. Reinforced UV-A curable composite compositions and methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451529A (en) * 1982-04-09 1984-05-29 Beacon Chemical Company, Inc. Coated polystyrene foams and compositions and processes for the production thereof
US4401962A (en) * 1982-11-02 1983-08-30 Westinghouse Electric Corp. Flexible thermally stable tapes containing a high flash point solventless insulating varnish
US4615950A (en) * 1985-03-15 1986-10-07 M&T Chemicals Inc. Printed circuit boards having improved adhesion between solder mask and metal
JPS62177012A (ja) * 1986-01-30 1987-08-03 Nitto Electric Ind Co Ltd 光硬化性樹脂組成物
JPH0277749A (ja) * 1988-09-13 1990-03-16 Mitsubishi Kasei Corp ソルダーマスクの製造法
US5169571A (en) * 1991-04-16 1992-12-08 The C.A. Lawton Company Mat forming process and apparatus
US5763503A (en) * 1995-06-07 1998-06-09 Esschem, Inc. Radiation-curable, moldable material, methods for curing it and molded articles obtained therefrom
DE19757090A1 (de) * 1997-12-20 1999-04-01 Herberts Gmbh Verfahren zum Verstärken von faserartigem Material

Also Published As

Publication number Publication date
WO2001092380A1 (fr) 2001-12-06
ATE321091T1 (de) 2006-04-15
DE60118182D1 (de) 2006-05-11
FR2809406A1 (fr) 2001-11-30
EP1290067A1 (de) 2003-03-12
FR2809406B1 (fr) 2006-02-17
DE60118182T2 (de) 2007-03-08
EP1290067B1 (de) 2006-03-22

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