AU2001253635A1 - Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing - Google Patents

Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing

Info

Publication number
AU2001253635A1
AU2001253635A1 AU2001253635A AU5363501A AU2001253635A1 AU 2001253635 A1 AU2001253635 A1 AU 2001253635A1 AU 2001253635 A AU2001253635 A AU 2001253635A AU 5363501 A AU5363501 A AU 5363501A AU 2001253635 A1 AU2001253635 A1 AU 2001253635A1
Authority
AU
Australia
Prior art keywords
electropolishing
full
electrical contact
wafer surface
making electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253635A
Inventor
Jalal Ashjaee
Bulent M. Basol
Boguslaw A. Nagorski
Homayoun Talieh
Cyprian Uzoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2001253635A1 publication Critical patent/AU2001253635A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
AU2001253635A 2000-05-12 2001-04-18 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Abandoned AU2001253635A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20394400P 2000-05-12 2000-05-12
US60203944 2000-05-12
US09/735,546 US6482307B2 (en) 2000-05-12 2000-12-14 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
US09735546 2000-12-14
PCT/US2001/012578 WO2001088954A2 (en) 2000-05-12 2001-04-18 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing

Publications (1)

Publication Number Publication Date
AU2001253635A1 true AU2001253635A1 (en) 2001-11-26

Family

ID=26899046

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253635A Abandoned AU2001253635A1 (en) 2000-05-12 2001-04-18 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing

Country Status (4)

Country Link
US (1) US6482307B2 (en)
AU (1) AU2001253635A1 (en)
TW (1) TW504796B (en)
WO (1) WO2001088954A2 (en)

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Also Published As

Publication number Publication date
TW504796B (en) 2002-10-01
US6482307B2 (en) 2002-11-19
WO2001088954A2 (en) 2001-11-22
WO2001088954A3 (en) 2002-03-28
US20010035354A1 (en) 2001-11-01

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