AU2001283529A1 - Apparatus and method for chemical mechanical polishing of substrates - Google Patents

Apparatus and method for chemical mechanical polishing of substrates

Info

Publication number
AU2001283529A1
AU2001283529A1 AU2001283529A AU8352901A AU2001283529A1 AU 2001283529 A1 AU2001283529 A1 AU 2001283529A1 AU 2001283529 A AU2001283529 A AU 2001283529A AU 8352901 A AU8352901 A AU 8352901A AU 2001283529 A1 AU2001283529 A1 AU 2001283529A1
Authority
AU
Australia
Prior art keywords
substrates
mechanical polishing
chemical mechanical
polishing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001283529A
Inventor
Jason Melvin
Hilario L. Oh
Nam P. Suh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Massachusetts Institute of Technology
ASML US Inc
Original Assignee
ASML US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/628,563 external-priority patent/US6984168B1/en
Application filed by ASML US Inc filed Critical ASML US Inc
Publication of AU2001283529A1 publication Critical patent/AU2001283529A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001283529A 2000-07-31 2001-07-31 Apparatus and method for chemical mechanical polishing of substrates Abandoned AU2001283529A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/628,563 US6984168B1 (en) 1999-07-28 2000-07-31 Apparatus and method for chemical mechanical polishing of substrates
US09628563 2000-07-31
US25901600P 2000-12-29 2000-12-29
US60259016 2000-12-29
PCT/US2001/041513 WO2002009906A1 (en) 2000-07-31 2001-07-31 Apparatus and method for chemical mechanical polishing of substrates

Publications (1)

Publication Number Publication Date
AU2001283529A1 true AU2001283529A1 (en) 2002-02-13

Family

ID=49356551

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001283529A Abandoned AU2001283529A1 (en) 2000-07-31 2001-07-31 Apparatus and method for chemical mechanical polishing of substrates

Country Status (8)

Country Link
EP (1) EP1307320B1 (en)
JP (1) JP2004505456A (en)
KR (1) KR20030029119A (en)
CN (1) CN1460042A (en)
AU (1) AU2001283529A1 (en)
DE (1) DE60127269D1 (en)
TW (1) TW577785B (en)
WO (1) WO2002009906A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
CN100524638C (en) * 2005-06-28 2009-08-05 斗山Mecatec株式会社 Multi-fluid supplying equipment for loading tool of semiconductor wafer polishing system
WO2013149961A1 (en) * 2012-04-02 2013-10-10 Asml Netherlands B.V. Particulate contamination measurement method and apparatus
JP6938262B2 (en) * 2017-07-24 2021-09-22 株式会社ディスコ Wafer processing method
CN107703881B (en) * 2017-09-11 2023-08-04 中国工程物理研究院机械制造工艺研究所 Device for automatically calibrating thickness of magnetorheological polishing ribbon
TWI840511B (en) * 2019-02-28 2024-05-01 美商應用材料股份有限公司 Retainer for chemical mechanical polishing carrier head
KR102339948B1 (en) * 2019-07-02 2021-12-17 (주)미래컴퍼니 Polishing system and polishing method
CN115816298A (en) * 2022-12-29 2023-03-21 西安奕斯伟材料科技有限公司 Fixed disc, polishing equipment and polishing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
DE19651761A1 (en) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Method and device for polishing semiconductor wafers
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6068549A (en) * 1999-06-28 2000-05-30 Mitsubishi Materials Corporation Structure and method for three chamber CMP polishing head
US6206768B1 (en) * 1999-07-29 2001-03-27 Chartered Semiconductor Manufacturing, Ltd. Adjustable and extended guide rings

Also Published As

Publication number Publication date
KR20030029119A (en) 2003-04-11
WO2002009906A1 (en) 2002-02-07
JP2004505456A (en) 2004-02-19
TW577785B (en) 2004-03-01
DE60127269D1 (en) 2007-04-26
CN1460042A (en) 2003-12-03
EP1307320B1 (en) 2007-03-14
EP1307320A1 (en) 2003-05-07
EP1307320A4 (en) 2004-12-01

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