AU2001251528A1 - Magnetron sputtering source with improved target utilization and deposition rate - Google Patents
Magnetron sputtering source with improved target utilization and deposition rateInfo
- Publication number
- AU2001251528A1 AU2001251528A1 AU2001251528A AU5152801A AU2001251528A1 AU 2001251528 A1 AU2001251528 A1 AU 2001251528A1 AU 2001251528 A AU2001251528 A AU 2001251528A AU 5152801 A AU5152801 A AU 5152801A AU 2001251528 A1 AU2001251528 A1 AU 2001251528A1
- Authority
- AU
- Australia
- Prior art keywords
- magnetron sputtering
- deposition rate
- sputtering source
- improved target
- target utilization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19590600P | 2000-04-10 | 2000-04-10 | |
US60195906 | 2000-04-10 | ||
PCT/US2001/011780 WO2001077405A1 (en) | 2000-04-10 | 2001-04-10 | Magnetron sputtering source with improved target utilization and deposition rate |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001251528A1 true AU2001251528A1 (en) | 2001-10-23 |
Family
ID=22723300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001251528A Abandoned AU2001251528A1 (en) | 2000-04-10 | 2001-04-10 | Magnetron sputtering source with improved target utilization and deposition rate |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001251528A1 (en) |
WO (1) | WO2001077405A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4401539A (en) * | 1981-01-30 | 1983-08-30 | Hitachi, Ltd. | Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure |
JPS63109165A (en) * | 1986-10-27 | 1988-05-13 | Nec Corp | Magnetron type sputtering device |
JPH076061B2 (en) * | 1988-06-24 | 1995-01-25 | 日本真空技術株式会社 | Magnetron sputtering equipment |
US5328585A (en) * | 1992-12-11 | 1994-07-12 | Photran Corporation | Linear planar-magnetron sputtering apparatus with reciprocating magnet-array |
US5800687A (en) * | 1996-04-13 | 1998-09-01 | Singulus Technologies Gmbh | Device for masking or covering substrates |
-
2001
- 2001-04-10 AU AU2001251528A patent/AU2001251528A1/en not_active Abandoned
- 2001-04-10 WO PCT/US2001/011780 patent/WO2001077405A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2001077405A1 (en) | 2001-10-18 |
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