AU2001247326A1 - Single-sided wiring substrate, display module comprising the same and method of connecting the same - Google Patents
Single-sided wiring substrate, display module comprising the same and method of connecting the sameInfo
- Publication number
- AU2001247326A1 AU2001247326A1 AU2001247326A AU4732601A AU2001247326A1 AU 2001247326 A1 AU2001247326 A1 AU 2001247326A1 AU 2001247326 A AU2001247326 A AU 2001247326A AU 4732601 A AU4732601 A AU 4732601A AU 2001247326 A1 AU2001247326 A1 AU 2001247326A1
- Authority
- AU
- Australia
- Prior art keywords
- same
- display module
- wiring substrate
- sided wiring
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-120878 | 2000-04-21 | ||
JP2000120878A JP2001308491A (ja) | 2000-04-21 | 2000-04-21 | 片面配線基板、該片面配線基板を含む表示モジュール及び該片面配線基板の接続方法 |
PCT/US2001/007460 WO2001082662A1 (en) | 2000-04-21 | 2001-03-08 | Single-sided wiring substrate, display module comprising the same and method of connecting the same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001247326A1 true AU2001247326A1 (en) | 2001-11-07 |
Family
ID=18631621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001247326A Abandoned AU2001247326A1 (en) | 2000-04-21 | 2001-03-08 | Single-sided wiring substrate, display module comprising the same and method of connecting the same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2001308491A (ja) |
AU (1) | AU2001247326A1 (ja) |
WO (1) | WO2001082662A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7772501B2 (en) | 2006-04-25 | 2010-08-10 | Molex Incorporated | Flexible printed circuit board |
JP2008227183A (ja) * | 2007-03-13 | 2008-09-25 | Fujitsu Ltd | プリント基板ユニットおよびプリント配線板 |
CN108605412A (zh) * | 2016-03-29 | 2018-09-28 | 积水保力马科技株式会社 | 柔性电路基板以及柔性电路基板的制造方法 |
US10986726B2 (en) | 2017-05-15 | 2021-04-20 | Lg Innotek Co., Ltd. | Flexible circuit board for all-in-one chip on film, chip package including same, and electronic device including same |
KR102438206B1 (ko) | 2017-12-22 | 2022-08-31 | 엘지이노텍 주식회사 | 지문 인식 모듈 및 이를 포함하는 전자 디바이스 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61203695A (ja) * | 1985-03-06 | 1986-09-09 | シャープ株式会社 | 片面配線基板の部品実装方式 |
JP3424272B2 (ja) * | 1993-08-25 | 2003-07-07 | 株式会社デンソー | 配線回路基板接続用フレキシブル基板 |
JPH08186336A (ja) * | 1994-12-28 | 1996-07-16 | Mitsubishi Electric Corp | 回路基板、駆動回路モジュール及びそれを用いた液晶表示装置並びにそれらの製造方法 |
-
2000
- 2000-04-21 JP JP2000120878A patent/JP2001308491A/ja active Pending
-
2001
- 2001-03-08 WO PCT/US2001/007460 patent/WO2001082662A1/en not_active Application Discontinuation
- 2001-03-08 AU AU2001247326A patent/AU2001247326A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2001308491A (ja) | 2001-11-02 |
WO2001082662A1 (en) | 2001-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001252557A1 (en) | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure | |
AU2003256092A1 (en) | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same | |
AU2001238500A1 (en) | Electronic advertising device and method of using the same | |
AU6731700A (en) | Adhesive agent, method for connecting wiring terminals and wiring structure | |
EP1187166B8 (en) | Plasma display panel and method for manufacturing the same | |
AU2003227244A1 (en) | Circuit module and method for manufacturing the same | |
AU2003241801A1 (en) | Composite multi-layer substrate and module using the substrate | |
AU2002356199A1 (en) | Interconnect chassis and module | |
AU2001269499A1 (en) | Electronic poster system | |
AU3896500A (en) | Multi-layer substrates and fabrication processes | |
EP1271649A3 (en) | Multi-die module and method thereof | |
AU2002343879A1 (en) | Module structure and module comprising it | |
AU2001287125A1 (en) | Multi-axis connectors and electronic devices incorporating same | |
AU1945101A (en) | Heat-relaxable substrates and arrays | |
EP1041715B8 (en) | Electronic component | |
EP1326306A3 (en) | Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member | |
AU4233100A (en) | Electronic display | |
EP1227360A3 (en) | Method and device for connecting display panel substrates | |
AU2001279628A1 (en) | Separation module and method for producing the same | |
AU2001247326A1 (en) | Single-sided wiring substrate, display module comprising the same and method of connecting the same | |
AU1472001A (en) | Optical circuit element and method of producing the same | |
AU2399001A (en) | Multilayer printed wiring board and method of manufacturing the same | |
AU2001273948A1 (en) | Photovoltaic module and method for the production thereof | |
AU2002230468A1 (en) | Methods and system for attaching substrates using solder structures | |
AU2002334941A1 (en) | Testing circuits on substrates |