AU2001234550A1 - Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchipbonding - Google Patents

Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchipbonding

Info

Publication number
AU2001234550A1
AU2001234550A1 AU2001234550A AU3455001A AU2001234550A1 AU 2001234550 A1 AU2001234550 A1 AU 2001234550A1 AU 2001234550 A AU2001234550 A AU 2001234550A AU 3455001 A AU3455001 A AU 3455001A AU 2001234550 A1 AU2001234550 A1 AU 2001234550A1
Authority
AU
Australia
Prior art keywords
flipchipbonding
solvent assisted
bumped wafers
underfilled
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234550A
Inventor
Kevin Y. Chen
Joel A. Gerber
Peter B. Hogerton
Robert L. D. Zenner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority claimed from PCT/US2001/002385 external-priority patent/WO2002033750A1/en
Publication of AU2001234550A1 publication Critical patent/AU2001234550A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
AU2001234550A 2000-10-17 2001-01-25 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchipbonding Abandoned AU2001234550A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9690600A 2000-10-17 2000-10-17
US09690600 2000-10-17
PCT/US2001/002385 WO2002033750A1 (en) 2000-10-17 2001-01-25 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchip bonding

Publications (1)

Publication Number Publication Date
AU2001234550A1 true AU2001234550A1 (en) 2002-04-29

Family

ID=22259663

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234550A Abandoned AU2001234550A1 (en) 2000-10-17 2001-01-25 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchipbonding

Country Status (1)

Country Link
AU (1) AU2001234550A1 (en)

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