AU2001231291A1 - High power capacitors from thin layers of metal powder or metal sponge particles - Google Patents
High power capacitors from thin layers of metal powder or metal sponge particlesInfo
- Publication number
- AU2001231291A1 AU2001231291A1 AU2001231291A AU3129101A AU2001231291A1 AU 2001231291 A1 AU2001231291 A1 AU 2001231291A1 AU 2001231291 A AU2001231291 A AU 2001231291A AU 3129101 A AU3129101 A AU 3129101A AU 2001231291 A1 AU2001231291 A1 AU 2001231291A1
- Authority
- AU
- Australia
- Prior art keywords
- metal
- high power
- thin layers
- power capacitors
- sponge particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
- H01G9/0525—Powder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0805—Capacitors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/84—Electrodes with an enlarged surface, e.g. formed by texturisation being a rough surface, e.g. using hemispherical grains
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17997700P | 2000-02-03 | 2000-02-03 | |
US60179977 | 2000-02-03 | ||
US18113200P | 2000-02-08 | 2000-02-08 | |
US60181132 | 2000-02-08 | ||
PCT/US2001/003528 WO2001057928A1 (en) | 2000-02-03 | 2001-02-02 | High power capacitors from thin layers of metal powder or metal sponge particles |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001231291A1 true AU2001231291A1 (en) | 2001-08-14 |
Family
ID=26875874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001231291A Abandoned AU2001231291A1 (en) | 2000-02-03 | 2001-02-02 | High power capacitors from thin layers of metal powder or metal sponge particles |
Country Status (6)
Country | Link |
---|---|
US (1) | US6914769B2 (en) |
EP (1) | EP1269547A4 (en) |
JP (1) | JP2003522420A (en) |
KR (1) | KR20020092945A (en) |
AU (1) | AU2001231291A1 (en) |
WO (1) | WO2001057928A1 (en) |
Families Citing this family (72)
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---|---|---|---|---|
US7442227B2 (en) * | 2001-10-09 | 2008-10-28 | Washington Unniversity | Tightly agglomerated non-oxide particles and method for producing the same |
US6919233B2 (en) * | 2002-12-31 | 2005-07-19 | Texas Instruments Incorporated | MIM capacitors and methods for fabricating same |
WO2004079760A1 (en) * | 2003-03-03 | 2004-09-16 | Showa Denko K.K. | Chip solid electrolyte capacitor |
US7011737B2 (en) * | 2004-04-02 | 2006-03-14 | The Penn State Research Foundation | Titania nanotube arrays for use as sensors and method of producing |
TWI263472B (en) * | 2004-04-07 | 2006-10-01 | Delta Electronics Inc | Heat dissipation module |
CN1961392A (en) * | 2004-05-31 | 2007-05-09 | 罗姆股份有限公司 | Electrolytic capacitor |
JP4561428B2 (en) * | 2004-07-05 | 2010-10-13 | 住友金属鉱山株式会社 | Porous valve metal thin film, manufacturing method thereof, and thin film capacitor |
JP3875705B2 (en) * | 2004-09-22 | 2007-01-31 | 富士通メディアデバイス株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
JP4947888B2 (en) * | 2004-09-30 | 2012-06-06 | 三洋電機株式会社 | Manufacturing method of solid electrolytic capacitor |
JP4561293B2 (en) * | 2004-10-08 | 2010-10-13 | 住友金属鉱山株式会社 | Thin film capacitor, circuit component having thin film resistor, and manufacturing method thereof |
JP4743507B2 (en) * | 2004-11-29 | 2011-08-10 | 昭和電工株式会社 | Porous anode body for solid electrolytic capacitor, method for producing the same, and solid electrolytic capacitor |
US7099143B1 (en) * | 2005-05-24 | 2006-08-29 | Avx Corporation | Wet electrolytic capacitors |
KR100649092B1 (en) * | 2005-11-02 | 2006-11-27 | 한국과학기술연구원 | Metal oxide supercapacitor having metal oxide electrode coated onto the titanium dioxide ultrafine and its fabrication method |
IL173121A (en) * | 2006-01-12 | 2011-07-31 | Dina Katsir | Electrodes, membranes, printing plate precursors and other articles including multi-strata porous coatings |
US20070207267A1 (en) * | 2006-02-08 | 2007-09-06 | Laube David P | Disposable liners for etch chambers and etch chamber components |
EP2013888A2 (en) * | 2006-04-26 | 2009-01-14 | Basf Se | Method for the production of a coating of a porous, electrically conductive support material with a dielectric, and production of capacitors having high capacity density with the aid of said method |
JP4665854B2 (en) * | 2006-07-12 | 2011-04-06 | 住友金属鉱山株式会社 | Valve metal composite electrode foil and manufacturing method thereof |
JP5124578B2 (en) * | 2006-08-16 | 2013-01-23 | ハー.ツェー.スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング | Semi-finished product having structured sintered active surface and method for producing the same |
JP4665866B2 (en) * | 2006-08-18 | 2011-04-06 | 住友金属鉱山株式会社 | Manufacturing method of valve metal composite electrode foil |
JP4665889B2 (en) * | 2006-11-07 | 2011-04-06 | 住友金属鉱山株式会社 | Manufacturing method of valve metal composite electrode foil |
US20080253958A1 (en) * | 2006-11-15 | 2008-10-16 | Mccracken Colin G | Production of high-purity titanium monoxide and capacitor production therefrom |
US20080112879A1 (en) * | 2006-11-15 | 2008-05-15 | Mccracken Colin G | Production of high-purity titanium monoxide and capacitor production therefrom |
US20080123251A1 (en) * | 2006-11-28 | 2008-05-29 | Randall Michael S | Capacitor device |
KR100779263B1 (en) * | 2007-02-06 | 2007-11-27 | 오영주 | Metal electrolytic capacitor and method manufacturing thereof |
US7649730B2 (en) * | 2007-03-20 | 2010-01-19 | Avx Corporation | Wet electrolytic capacitor containing a plurality of thin powder-formed anodes |
US8154850B2 (en) | 2007-05-11 | 2012-04-10 | Paratek Microwave, Inc. | Systems and methods for a thin film capacitor having a composite high-k thin film stack |
US20090122460A1 (en) * | 2007-11-12 | 2009-05-14 | Alexander Gschwandtner | Semiconductor Device and Method for Producing the Same |
JP5105479B2 (en) * | 2008-02-13 | 2012-12-26 | Necトーキン株式会社 | Solid electrolytic capacitor |
CN101978447B (en) * | 2008-03-20 | 2013-02-13 | 维莎斯普拉格公司 | Electrophoretically deposited cathode capacitor |
CN102017034B (en) * | 2008-04-22 | 2016-01-27 | 东洋铝株式会社 | For the electrode material of aluminium electrolytic capacitor and the method for this electrode material of manufacture |
KR20120089778A (en) * | 2008-09-04 | 2012-08-13 | 비쉐이 스프라그, 인코포레이티드 | Bulk capacitor and method |
US8351186B2 (en) * | 2008-10-10 | 2013-01-08 | Panasonic Corporation | Electrode foil for capacitor, manufacturing method therefor, and solid electrolytic capacitor using the electrode foil |
US8223473B2 (en) | 2009-03-23 | 2012-07-17 | Avx Corporation | Electrolytic capacitor containing a liquid electrolyte |
JPWO2011043059A1 (en) * | 2009-10-09 | 2013-03-04 | パナソニック株式会社 | Electrode foil and capacitor using the same |
US9123470B2 (en) | 2009-12-18 | 2015-09-01 | Cardiac Pacemakers, Inc. | Implantable energy storage device including a connection post to connect multiple electrodes |
US9269498B2 (en) | 2009-12-18 | 2016-02-23 | Cardiac Pacemakers, Inc. | Sintered capacitor electrode including multiple thicknesses |
US9129749B2 (en) | 2009-12-18 | 2015-09-08 | Cardiac Pacemakers, Inc. | Sintered electrodes to store energy in an implantable medical device |
US8873220B2 (en) | 2009-12-18 | 2014-10-28 | Cardiac Pacemakers, Inc. | Systems and methods to connect sintered aluminum electrodes of an energy storage device |
US8725252B2 (en) * | 2009-12-18 | 2014-05-13 | Cardiac Pacemakers, Inc. | Electric energy storage device electrode including an overcurrent protector |
US8619408B2 (en) | 2009-12-18 | 2013-12-31 | Cardiac Pacemakers, Inc. | Sintered capacitor electrode including a folded connection |
US9275801B2 (en) * | 2010-03-19 | 2016-03-01 | Cardiac Pacemakers, Inc. | Systems and methods for enhanced dielectric properties for electrolytic capacitors |
JP4942837B2 (en) * | 2010-06-30 | 2012-05-30 | 三洋電機株式会社 | Solid electrolytic capacitor |
US9065144B2 (en) | 2010-08-12 | 2015-06-23 | Cardiac Pacemakers, Inc. | Electrode including a 3D framework formed of fluorinated carbon |
US9083048B2 (en) | 2010-08-12 | 2015-07-14 | Cardiac Pacemakers, Inc. | Carbon monofluoride impregnated current collector including a 3D framework |
JPWO2012161158A1 (en) | 2011-05-26 | 2014-07-31 | 東洋アルミニウム株式会社 | Electrode material for aluminum electrolytic capacitor and method for producing the same |
JP5769528B2 (en) | 2011-07-15 | 2015-08-26 | 東洋アルミニウム株式会社 | Electrode material for aluminum electrolytic capacitor and method for producing the same |
JP5890023B2 (en) * | 2011-08-11 | 2016-03-22 | カーディアック ペースメイカーズ, インコーポレイテッド | Apparatus and system including sintered capacitor electrode with three-dimensional frame structure and method of forming the apparatus |
EP2583945A1 (en) * | 2011-10-19 | 2013-04-24 | Imec | MIMCAP structure comprising doped rutile titanium oxide and method of forming |
KR102071841B1 (en) | 2011-12-21 | 2020-01-31 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | Interconnected corrugated carbon-based network |
KR102079032B1 (en) * | 2012-02-10 | 2020-02-19 | 도요 알루미늄 가부시키가이샤 | Method for manufacturing electrode material for aluminium electrolytic capacitor |
CA2866250C (en) | 2012-03-05 | 2021-05-04 | Maher F. El-Kady | Capacitor with electrodes made of an interconnected corrugated carbon-based network |
US9715966B2 (en) * | 2014-04-23 | 2017-07-25 | Richard Down Newberry | Supercapacitor with extreme energy storage capacity |
US9905367B2 (en) | 2014-05-15 | 2018-02-27 | Case Western Reserve University | Metallic glass-alloys for capacitor anodes |
US10211495B2 (en) | 2014-06-16 | 2019-02-19 | The Regents Of The University Of California | Hybrid electrochemical cell |
CN104391013A (en) * | 2014-10-30 | 2015-03-04 | 中国电子科技集团公司第四十八研究所 | Nitrogen-doped titanium dioxide nanotube hydrogen sensor and preparation method thereof |
WO2016081638A1 (en) | 2014-11-18 | 2016-05-26 | The Regents Of The University Of California | Porous interconnected corrugated carbon-based network (iccn) composite |
US10290430B2 (en) | 2014-11-24 | 2019-05-14 | Avx Corporation | Wet Electrolytic Capacitor for an Implantable Medical Device |
US10115527B2 (en) | 2015-03-09 | 2018-10-30 | Blackberry Limited | Thin film dielectric stack |
CA3006997A1 (en) | 2015-12-22 | 2017-06-29 | The Regents Of The University Of California | Cellular graphene films |
AU2017209117B2 (en) | 2016-01-22 | 2021-10-21 | The Regents Of The University Of California | High-voltage devices |
US10923295B2 (en) | 2016-03-01 | 2021-02-16 | Maxwell Technologies, Inc. | Compositions and methods for energy storage device electrodes |
CA3018568A1 (en) | 2016-03-23 | 2017-09-28 | The Regents Of The University Of California | Devices and methods for high voltage and solar applications |
IL261928B2 (en) | 2016-04-01 | 2023-04-01 | Univ California | Direct growth of polyaniline nanotubes on carbon cloth for flexible and high-performance supercapacitors |
US10297658B2 (en) | 2016-06-16 | 2019-05-21 | Blackberry Limited | Method and apparatus for a thin film dielectric stack |
US11097951B2 (en) | 2016-06-24 | 2021-08-24 | The Regents Of The University Of California | Production of carbon-based oxide and reduced carbon-based oxide on a large scale |
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JP7277965B2 (en) | 2017-07-14 | 2023-05-19 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | A Simple Route from Carbon Nanodots to Highly Conductive Porous Graphene for Supercapacitor Applications |
US11189431B2 (en) | 2018-07-16 | 2021-11-30 | Vishay Sprague, Inc. | Low profile wet electrolytic tantalum capacitor |
EP3959026A1 (en) * | 2019-04-29 | 2022-03-02 | Global Advanced Metals USA, Inc. | A ti-zr alloy powder and anode containing the same |
US10938032B1 (en) | 2019-09-27 | 2021-03-02 | The Regents Of The University Of California | Composite graphene energy storage methods, devices, and systems |
US11742149B2 (en) | 2021-11-17 | 2023-08-29 | Vishay Israel Ltd. | Hermetically sealed high energy electrolytic capacitor and capacitor assemblies with improved shock and vibration performance |
CN115132497B (en) * | 2022-08-09 | 2023-06-02 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Capacitor manufacturing method and device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4164005A (en) | 1977-09-02 | 1979-08-07 | Sprague Electric Company | Solid electrolyte capacitor, solderable terminations therefor and method for making |
US4623910A (en) * | 1982-09-24 | 1986-11-18 | Risberg Robert L | Semiconductor device |
KR910005753B1 (en) * | 1986-12-24 | 1991-08-02 | 쇼오와 알루미늄 가부시기가이샤 | Aluminum electrode material for electrolytic capacitor |
EP0468758B1 (en) * | 1990-07-24 | 1997-03-26 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming insulating films, capacitances, and semiconductor devices |
JP2541357B2 (en) | 1990-10-29 | 1996-10-09 | 日本電気株式会社 | Manufacturing method of chip type solid electrolytic capacitor |
JPH05205984A (en) * | 1992-01-27 | 1993-08-13 | Nec Corp | Laminated solid electrolytic capacitor |
JP3802942B2 (en) * | 1994-09-01 | 2006-08-02 | 株式会社ルネサステクノロジ | Semiconductor device, semiconductor memory device, and method of manufacturing semiconductor memory device |
JP3068430B2 (en) | 1995-04-25 | 2000-07-24 | 富山日本電気株式会社 | Solid electrolytic capacitor and method of manufacturing the same |
CZ311698A3 (en) * | 1996-04-03 | 1999-06-16 | Zakrytoe Aktsionernoe Obschestvo "Skb Istra" | Process and apparatus for applying porous coating to cathode foil of electrolytic condenser |
US6226173B1 (en) * | 1999-01-26 | 2001-05-01 | Case Western Reserve University | Directionally-grown capacitor anodes |
-
2001
- 2001-02-02 EP EP01903492A patent/EP1269547A4/en not_active Withdrawn
- 2001-02-02 US US10/182,927 patent/US6914769B2/en not_active Expired - Fee Related
- 2001-02-02 AU AU2001231291A patent/AU2001231291A1/en not_active Abandoned
- 2001-02-02 KR KR1020027010049A patent/KR20020092945A/en not_active Application Discontinuation
- 2001-02-02 JP JP2001557091A patent/JP2003522420A/en active Pending
- 2001-02-02 WO PCT/US2001/003528 patent/WO2001057928A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1269547A4 (en) | 2006-02-01 |
WO2001057928A1 (en) | 2001-08-09 |
JP2003522420A (en) | 2003-07-22 |
US20030169560A1 (en) | 2003-09-11 |
EP1269547A1 (en) | 2003-01-02 |
KR20020092945A (en) | 2002-12-12 |
US6914769B2 (en) | 2005-07-05 |
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