AU2001222262A1 - Semiconductor device and method for producing the same - Google Patents
Semiconductor device and method for producing the sameInfo
- Publication number
- AU2001222262A1 AU2001222262A1 AU2001222262A AU2226201A AU2001222262A1 AU 2001222262 A1 AU2001222262 A1 AU 2001222262A1 AU 2001222262 A AU2001222262 A AU 2001222262A AU 2226201 A AU2226201 A AU 2226201A AU 2001222262 A1 AU2001222262 A1 AU 2001222262A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- same
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000/4085 | 2000-01-12 | ||
| JP2000004085A JP2001196405A (en) | 2000-01-12 | 2000-01-12 | Semiconductor device and method of manufacturing the same |
| PCT/JP2000/009256 WO2001052315A1 (en) | 2000-01-12 | 2000-12-26 | Semiconductor device and method for producing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001222262A1 true AU2001222262A1 (en) | 2001-07-24 |
Family
ID=18532909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001222262A Abandoned AU2001222262A1 (en) | 2000-01-12 | 2000-12-26 | Semiconductor device and method for producing the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2001196405A (en) |
| AU (1) | AU2001222262A1 (en) |
| TW (1) | TW561810B (en) |
| WO (1) | WO2001052315A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308095A (en) * | 2000-04-19 | 2001-11-02 | Toyo Kohan Co Ltd | Semiconductor device and method of manufacture |
| EP3413340B1 (en) | 2017-06-08 | 2021-11-17 | Brooks Automation (Germany) GmbH | Method for inspecting a container and inspection system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3142723B2 (en) * | 1994-09-21 | 2001-03-07 | シャープ株式会社 | Semiconductor device and manufacturing method thereof |
| JP3351706B2 (en) * | 1997-05-14 | 2002-12-03 | 株式会社東芝 | Semiconductor device and method of manufacturing the same |
| JP3394696B2 (en) * | 1997-10-16 | 2003-04-07 | 松下電器産業株式会社 | Semiconductor device and manufacturing method thereof |
| JP3398319B2 (en) * | 1997-12-16 | 2003-04-21 | 新光電気工業株式会社 | Semiconductor device and manufacturing method thereof |
| KR20010004529A (en) * | 1999-06-29 | 2001-01-15 | 김영환 | wafer level package and method of fabricating the same |
-
2000
- 2000-01-12 JP JP2000004085A patent/JP2001196405A/en active Pending
- 2000-12-26 AU AU2001222262A patent/AU2001222262A1/en not_active Abandoned
- 2000-12-26 WO PCT/JP2000/009256 patent/WO2001052315A1/en active Application Filing
- 2000-12-27 TW TW89127913A patent/TW561810B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW561810B (en) | 2003-11-11 |
| JP2001196405A (en) | 2001-07-19 |
| WO2001052315A1 (en) | 2001-07-19 |
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