AU1994699A - In-line fib process monitoring with wafer preservation - Google Patents
In-line fib process monitoring with wafer preservationInfo
- Publication number
- AU1994699A AU1994699A AU19946/99A AU1994699A AU1994699A AU 1994699 A AU1994699 A AU 1994699A AU 19946/99 A AU19946/99 A AU 19946/99A AU 1994699 A AU1994699 A AU 1994699A AU 1994699 A AU1994699 A AU 1994699A
- Authority
- AU
- Australia
- Prior art keywords
- preservation
- wafer
- process monitoring
- fib process
- line fib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2255—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident ion beams, e.g. proton beams
- G01N23/2258—Measuring secondary ion emission, e.g. secondary ion mass spectrometry [SIMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30472—Controlling the beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5769697P | 1997-08-27 | 1997-08-27 | |
US60057696 | 1997-08-27 | ||
PCT/US1998/017781 WO1999017103A2 (en) | 1997-08-27 | 1998-08-27 | In-line fib process monitoring with wafer preservation |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1994699A true AU1994699A (en) | 1999-04-23 |
Family
ID=22012197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU19946/99A Abandoned AU1994699A (en) | 1997-08-27 | 1998-08-27 | In-line fib process monitoring with wafer preservation |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU1994699A (en) |
WO (1) | WO1999017103A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2782894A1 (en) | 1998-09-07 | 2000-03-10 | Nufarm Ltd | Preparation of pesticide dip to reduce the incidence of overdosing and underdosing by providing a reservoir containing a replenishment pesticide solution to top-up pesticide dip volume as dip is removed on animals |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4178741B2 (en) | 2000-11-02 | 2008-11-12 | 株式会社日立製作所 | Charged particle beam apparatus and sample preparation apparatus |
JP4200665B2 (en) * | 2001-05-08 | 2008-12-24 | 株式会社日立製作所 | Processing equipment |
JP4302933B2 (en) | 2002-04-22 | 2009-07-29 | 株式会社日立ハイテクノロジーズ | Ion beam filling method and ion beam apparatus |
JP4747952B2 (en) * | 2006-05-31 | 2011-08-17 | 株式会社日立製作所 | Sample processing apparatus and sample processing method |
JP4826680B2 (en) * | 2010-07-30 | 2011-11-30 | 株式会社日立製作所 | Beam member |
JP5024468B2 (en) * | 2011-03-25 | 2012-09-12 | 株式会社日立製作所 | Sample processing equipment |
US9378927B2 (en) * | 2014-09-11 | 2016-06-28 | Fei Company | AutoSlice and view undercut method |
-
1998
- 1998-08-27 WO PCT/US1998/017781 patent/WO1999017103A2/en active Application Filing
- 1998-08-27 AU AU19946/99A patent/AU1994699A/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2782894A1 (en) | 1998-09-07 | 2000-03-10 | Nufarm Ltd | Preparation of pesticide dip to reduce the incidence of overdosing and underdosing by providing a reservoir containing a replenishment pesticide solution to top-up pesticide dip volume as dip is removed on animals |
Also Published As
Publication number | Publication date |
---|---|
WO1999017103A2 (en) | 1999-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |