AU1389001A - Method for producing contactable conductor loops for transponders - Google Patents

Method for producing contactable conductor loops for transponders

Info

Publication number
AU1389001A
AU1389001A AU13890/01A AU1389001A AU1389001A AU 1389001 A AU1389001 A AU 1389001A AU 13890/01 A AU13890/01 A AU 13890/01A AU 1389001 A AU1389001 A AU 1389001A AU 1389001 A AU1389001 A AU 1389001A
Authority
AU
Australia
Prior art keywords
transponders
producing
conductor loops
contactable conductor
contactable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU13890/01A
Other languages
English (en)
Inventor
Andreas Plettner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flexchip AG
Original Assignee
Flexchip AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flexchip AG filed Critical Flexchip AG
Publication of AU1389001A publication Critical patent/AU1389001A/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
AU13890/01A 1999-12-22 2000-10-27 Method for producing contactable conductor loops for transponders Abandoned AU1389001A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19962194 1999-12-22
DE19962194A DE19962194A1 (de) 1999-12-22 1999-12-22 Verfahren zur Herstellung von kontaktierbaren Leiterschleifen für Transponder
PCT/EP2000/010597 WO2001046904A1 (de) 1999-12-22 2000-10-27 Verfahren zur herstellung von kontaktierbaren leiterschleifen für transponder

Publications (1)

Publication Number Publication Date
AU1389001A true AU1389001A (en) 2001-07-03

Family

ID=7933924

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13890/01A Abandoned AU1389001A (en) 1999-12-22 2000-10-27 Method for producing contactable conductor loops for transponders

Country Status (3)

Country Link
AU (1) AU1389001A (de)
DE (1) DE19962194A1 (de)
WO (1) WO2001046904A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900536B1 (en) * 2002-04-26 2005-05-31 Celis Semiconductor Corporation Method for producing an electrical circuit
JP3803097B2 (ja) * 2003-10-07 2006-08-02 株式会社日立製作所 無線通信媒体の製造方法
DE10353994A1 (de) * 2003-11-19 2005-06-30 Schott Ag RF-ID-Chip und Verfahren zu dessen Herstellung
KR100841825B1 (ko) * 2004-01-15 2008-06-26 히다치 가세고교 가부시끼가이샤 전자장치의 제조방법
JP4754344B2 (ja) * 2005-12-20 2011-08-24 富士通株式会社 Rfidタグ
DE102009020540B4 (de) 2009-05-08 2012-06-21 Mühlbauer Ag Verfahren und Vorrichtung zum Herstellen einer elektronischen Baugruppe und mit dem Verfahren oder in der Vorrichtung hergestellte elektronische Baugruppe
CN102272909B (zh) 2008-12-13 2015-04-08 米尔鲍尔股份公司 制造电子组装的方法和设备,采用该方法或在该设备中制造的电子组装
DE102010031302A1 (de) * 2010-07-14 2012-01-19 Evonik Goldschmidt Gmbh Halbfabrikat und Verfahren zur Herstellung einer Leuchtdiode

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2577067A1 (fr) * 1985-02-01 1986-08-08 Coupin Patrice Procede de fabrication de condensateurs plans imprimes et circuits imprimes utilisant de tels condensateurs
CH677988A5 (de) * 1986-07-30 1991-07-15 Actron Entwicklungs Ag
EP0698248A1 (de) * 1993-05-14 1996-02-28 AMPHENOL-TUCHEL ELECTRONICS GmbH Kontaktiersystem für chipkarten, sowie leser dafür
DE4428732C1 (de) * 1994-08-15 1996-01-04 Angewandte Digital Elektronik Mehrlagige Chipkartenspulen für kontaktfreie Chipkarten
JP3519491B2 (ja) * 1995-03-31 2004-04-12 株式会社東海理化電機製作所 Icカード
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
DE19538917C2 (de) * 1995-10-19 1997-08-21 Junghans Uhren Gmbh Kontaktlose Chipkarte
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
DE19634371A1 (de) * 1996-08-24 1998-02-26 Grundig Ag Verfahren zur Herstellung flexibler Leiterplatten
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
DE19811578A1 (de) * 1998-03-17 1999-10-14 Siemens Ag Mehrlagige Leiterplatte sowie Verfahren zu deren Herstellung
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders

Also Published As

Publication number Publication date
WO2001046904A1 (de) 2001-06-28
DE19962194A1 (de) 2001-06-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase