AU2158701A - Method for producing conductive patterns - Google Patents

Method for producing conductive patterns

Info

Publication number
AU2158701A
AU2158701A AU21587/01A AU2158701A AU2158701A AU 2158701 A AU2158701 A AU 2158701A AU 21587/01 A AU21587/01 A AU 21587/01A AU 2158701 A AU2158701 A AU 2158701A AU 2158701 A AU2158701 A AU 2158701A
Authority
AU
Australia
Prior art keywords
conductive patterns
producing conductive
producing
patterns
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU21587/01A
Inventor
Wolfgang Beier
Uwe Filor
Gunther Rohrs
Wolfgang Scheel
Martin Stork
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STORK GmbH
Original Assignee
STORK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STORK GmbH filed Critical STORK GmbH
Publication of AU2158701A publication Critical patent/AU2158701A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/06—Lithographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Methods (AREA)
AU21587/01A 1999-11-17 2000-11-15 Method for producing conductive patterns Abandoned AU2158701A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1999155214 DE19955214B4 (en) 1999-11-17 1999-11-17 Method for producing conductor structures
DE19955214 1999-11-17
PCT/EP2000/011272 WO2001037623A1 (en) 1999-11-17 2000-11-15 Method for producing conductive patterns

Publications (1)

Publication Number Publication Date
AU2158701A true AU2158701A (en) 2001-05-30

Family

ID=7929292

Family Applications (1)

Application Number Title Priority Date Filing Date
AU21587/01A Abandoned AU2158701A (en) 1999-11-17 2000-11-15 Method for producing conductive patterns

Country Status (3)

Country Link
AU (1) AU2158701A (en)
DE (1) DE19955214B4 (en)
WO (1) WO2001037623A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US20040003734A1 (en) * 2002-07-02 2004-01-08 Shively J. Thomas Method and apparatus for printing using an electrically conductive ink
PT1699637E (en) * 2003-08-01 2015-02-25 Manroland Web Systems Gmbh Method for further printing with electrical conductivity
DE10335230A1 (en) * 2003-08-01 2005-02-17 Man Roland Druckmaschinen Ag Process for the production of RFID labels
CN106376182A (en) * 2016-11-11 2017-02-01 西安大为印制电路板厂 Method and device for producing double face and multilayer circuit boards via hole wall gluing method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2501768A1 (en) * 1975-01-17 1976-07-22 Ruf Kg Wilhelm Printed circuit application device - uses offset printer to transfer silver onto flexible insulating surface
DE3201065A1 (en) * 1982-01-15 1983-07-28 Schwarzwälder Elektronik-Werke GmbH, 7730 Villingen-Schwenningen Method of printing printed circuit boards
US4458590A (en) * 1982-09-30 1984-07-10 Harris Graphics Corporation Printing press with plate cylinder skew and throw off
FR2535651B1 (en) * 1982-11-08 1986-07-25 Atn OFFSET ROTARY PRINTER WITH VARIABLE FORMAT
DE3727214A1 (en) * 1987-08-14 1989-02-23 Lohmann Therapie Syst Lts TAMPON PRINTING DEVICE FOR TRANSMITTING DEFINED QUANTITIES OF PRINTING MEDIUM PER AREA UNIT
DE4012279A1 (en) * 1990-04-17 1991-10-24 Laser Optronic Printing blocks prodn. from aluminium - by oxidising block prior to working with laser beam to avoid vaporised metal deposits
DE4020215A1 (en) * 1990-06-25 1992-01-09 Alt Peter Screen printing device for circuit board - conveys board between two vertical facing printers which simultaneously print both sides
JP2729880B2 (en) * 1992-09-07 1998-03-18 富士写真フイルム株式会社 No fountain solution photosensitive lithographic printing plate
CN1083126C (en) * 1993-10-29 2002-04-17 索尼公司 Method of and apparatus for printing a cassette accommodating a recording medium or a cassette accommodating case and a cassette accommodating a recordding medium
DE4401362C2 (en) * 1994-01-18 1997-12-11 Roland Man Druckmasch Process and rotary printing machine for indirect gravure printing
DE4430801C2 (en) * 1994-08-30 2003-04-17 Metronic Ag Printing device for printing plastic cards
US5622652A (en) * 1995-06-07 1997-04-22 Img Group Limited Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid
US5713288A (en) * 1995-08-03 1998-02-03 Frazzitta; Joseph R. Method and apparatus for use in offset printing
DE19710520C1 (en) * 1997-03-14 1998-09-17 Roland Man Druckmasch Printing machine with an imaging device
DE19955223C2 (en) * 1999-11-17 2002-09-12 Stork Gmbh Printing device for simultaneous printing on both sides of sheet-shaped rigid or flexible substrates or substrate webs

Also Published As

Publication number Publication date
DE19955214B4 (en) 2006-05-11
WO2001037623A1 (en) 2001-05-25
DE19955214A1 (en) 2001-06-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase