ATE93117T1 - Dichtungsstruktur fuer ein elektronisches teil. - Google Patents

Dichtungsstruktur fuer ein elektronisches teil.

Info

Publication number
ATE93117T1
ATE93117T1 AT88106925T AT88106925T ATE93117T1 AT E93117 T1 ATE93117 T1 AT E93117T1 AT 88106925 T AT88106925 T AT 88106925T AT 88106925 T AT88106925 T AT 88106925T AT E93117 T1 ATE93117 T1 AT E93117T1
Authority
AT
Austria
Prior art keywords
resin
casing
filled
sealing structure
electronic part
Prior art date
Application number
AT88106925T
Other languages
English (en)
Inventor
Hideo Nakai
Masakatsu Hosoya
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of ATE93117T1 publication Critical patent/ATE93117T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Glass Compositions (AREA)
  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
AT88106925T 1987-05-07 1988-04-29 Dichtungsstruktur fuer ein elektronisches teil. ATE93117T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1987068783U JPS63178037U (de) 1987-05-07 1987-05-07
EP88106925A EP0289956B1 (de) 1987-05-07 1988-04-29 Dichtungsstruktur für ein elektronisches Teil

Publications (1)

Publication Number Publication Date
ATE93117T1 true ATE93117T1 (de) 1993-08-15

Family

ID=13383675

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88106925T ATE93117T1 (de) 1987-05-07 1988-04-29 Dichtungsstruktur fuer ein elektronisches teil.

Country Status (4)

Country Link
EP (1) EP0289956B1 (de)
JP (1) JPS63178037U (de)
AT (1) ATE93117T1 (de)
DE (1) DE3883059T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH082892Y2 (ja) * 1988-05-20 1996-01-29 株式会社キーエンス 検出スイッチ
JP3435792B2 (ja) * 1994-04-15 2003-08-11 株式会社デンソー シール装置
JP3128387U (ja) 2006-10-25 2007-01-11 船井電機株式会社 電気機器の電源回路部構造
FR2913808B1 (fr) * 2007-03-16 2009-04-24 Siemens Vdo Automotive Sas Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive
JP6299199B2 (ja) * 2013-12-13 2018-03-28 オムロン株式会社 電子機器
JP2015176714A (ja) * 2014-03-14 2015-10-05 オムロン株式会社 電子機器
DE202016101136U1 (de) * 2016-03-03 2017-06-09 Tridonic Gmbh & Co Kg Elektronisches Bauteil

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383565A (en) * 1966-05-13 1968-05-14 Gen Electric Packaging of electrical components
JPS5879628A (ja) * 1981-11-04 1983-05-13 Mitsubishi Heavy Ind Ltd ガスタ−ビン制御装置
JPS60179236A (ja) * 1984-02-27 1985-09-13 Nippon Valqua Ind Ltd 四フツ化エチレン樹脂多孔質体の製造方法
JPS60199032A (ja) * 1984-03-23 1985-10-08 Asahi Organic Chem Ind Co Ltd フツ素樹脂接着体
US4600969A (en) * 1984-07-06 1986-07-15 Hendrickson Max S Protective apparatus for encapsulating electrical circuits
US4552626A (en) * 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics
DE3726357A1 (de) * 1987-08-07 1989-02-16 Siemens Ag Epoxidharzverguss mit geringem schrumpfdruck und hohem isolationswiderstand fuer den verguss von elektrischen bauteilen

Also Published As

Publication number Publication date
EP0289956B1 (de) 1993-08-11
DE3883059T2 (de) 1994-04-07
DE3883059D1 (de) 1993-09-16
EP0289956A3 (en) 1990-03-07
EP0289956A2 (de) 1988-11-09
JPS63178037U (de) 1988-11-17

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties