ATE89337T1 - Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung. - Google Patents

Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung.

Info

Publication number
ATE89337T1
ATE89337T1 AT88301636T AT88301636T ATE89337T1 AT E89337 T1 ATE89337 T1 AT E89337T1 AT 88301636 T AT88301636 T AT 88301636T AT 88301636 T AT88301636 T AT 88301636T AT E89337 T1 ATE89337 T1 AT E89337T1
Authority
AT
Austria
Prior art keywords
plating bath
stable composition
electric plating
maintaining stable
plated alloy
Prior art date
Application number
AT88301636T
Other languages
German (de)
English (en)
Inventor
Arthur Hughes Graham
Kenneth Bernard Keating
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of ATE89337T1 publication Critical patent/ATE89337T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AT88301636T 1988-02-25 1988-02-25 Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung. ATE89337T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP88301636A EP0329877B1 (fr) 1988-02-25 1988-02-25 Bain de dépôt électrolytique et procédé pour maintenir stable la composition de l'alliage déposé

Publications (1)

Publication Number Publication Date
ATE89337T1 true ATE89337T1 (de) 1993-05-15

Family

ID=8199970

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88301636T ATE89337T1 (de) 1988-02-25 1988-02-25 Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung.

Country Status (4)

Country Link
EP (1) EP0329877B1 (fr)
AT (1) ATE89337T1 (fr)
DE (1) DE3881022T2 (fr)
HK (1) HK1000382A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0335683B1 (fr) * 1988-04-01 1993-10-20 E.I. Du Pont De Nemours And Company Revêtements d'un alliage électroplaqué ayant une composition d'alliage stable

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3206383A (en) * 1964-03-26 1965-09-14 Kappel Mario Electrolyte for use in the galvanic deposition of bright leveling nickel coatings
US3467584A (en) * 1966-10-24 1969-09-16 Ernest H Lyons Jr Plating platinum metals on chromium
US4358352A (en) * 1981-06-22 1982-11-09 Mpd Technology Corporation Electrodeposition of platinum from a cis-diamminedihaloplatinum (II) electrolyte
US4463060A (en) * 1983-11-15 1984-07-31 E. I. Du Pont De Nemours And Company Solderable palladium-nickel coatings and method of making said coatings

Also Published As

Publication number Publication date
DE3881022T2 (de) 1993-10-07
EP0329877B1 (fr) 1993-05-12
DE3881022D1 (de) 1993-06-17
HK1000382A1 (en) 1998-03-13
EP0329877A1 (fr) 1989-08-30

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties