ATE79984T1 - Selbstheizende und selbstloetende sammelschiene. - Google Patents
Selbstheizende und selbstloetende sammelschiene.Info
- Publication number
- ATE79984T1 ATE79984T1 AT86304394T AT86304394T ATE79984T1 AT E79984 T1 ATE79984 T1 AT E79984T1 AT 86304394 T AT86304394 T AT 86304394T AT 86304394 T AT86304394 T AT 86304394T AT E79984 T1 ATE79984 T1 AT E79984T1
- Authority
- AT
- Austria
- Prior art keywords
- heating
- self
- bus bar
- soldering
- incidental
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/02—Open installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
- Connecting Device With Holders (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- General Induction Heating (AREA)
- Resistance Heating (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/745,936 US4795870A (en) | 1985-06-18 | 1985-06-18 | Conductive member having integrated self-regulating heaters |
| EP86304394A EP0206620B1 (de) | 1985-06-18 | 1986-06-09 | Selbstheizende und selbstlötende Sammelschiene |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE79984T1 true ATE79984T1 (de) | 1992-09-15 |
Family
ID=24998863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT86304394T ATE79984T1 (de) | 1985-06-18 | 1986-06-09 | Selbstheizende und selbstloetende sammelschiene. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4795870A (de) |
| EP (1) | EP0206620B1 (de) |
| JP (1) | JPH0646526B2 (de) |
| AT (1) | ATE79984T1 (de) |
| CA (1) | CA1264360A (de) |
| DE (1) | DE3686518T2 (de) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5093545A (en) * | 1988-09-09 | 1992-03-03 | Metcal, Inc. | Method, system and composition for soldering by induction heating |
| US5032703A (en) * | 1988-11-29 | 1991-07-16 | Amp Incorporated | Self regulating temperature heater carrier strip |
| US5010233A (en) * | 1988-11-29 | 1991-04-23 | Amp Incorporated | Self regulating temperature heater as an integral part of a printed circuit board |
| US5103071A (en) * | 1988-11-29 | 1992-04-07 | Amp Incorporated | Surface mount technology breakaway self regulating temperature heater |
| US4995838A (en) * | 1988-11-29 | 1991-02-26 | Amp Incorporated | Electrical terminal and method of making same |
| US4987283A (en) * | 1988-12-21 | 1991-01-22 | Amp Incorporated | Methods of terminating and sealing electrical conductor means |
| US5059756A (en) * | 1988-11-29 | 1991-10-22 | Amp Incorporated | Self regulating temperature heater with thermally conductive extensions |
| US5064978A (en) * | 1989-06-30 | 1991-11-12 | Amp Incorporated | Assembly with self-regulating temperature heater perform for terminating conductors and insulating the termination |
| US5004887A (en) * | 1989-07-24 | 1991-04-02 | Amp Incorporated | Heating apparatus having Curie effect heater |
| US5421752A (en) * | 1989-07-31 | 1995-06-06 | The Whitaker Corporation | Method of making a pin grid array and terminal for use therein |
| US5007574A (en) * | 1989-09-14 | 1991-04-16 | Metcal, Inc. | Desoldering device |
| US4983804A (en) * | 1989-12-21 | 1991-01-08 | At&T Bell Laboratories | Localized soldering by inductive heating |
| EP0492492B1 (de) * | 1990-12-21 | 1996-05-08 | The Whitaker Corporation | Verfahren für die Befestigung eines Verbinders an einem Stromkreiselement sowie Lötanschlussrahmen dazu |
| US5087804A (en) * | 1990-12-28 | 1992-02-11 | Metcal, Inc. | Self-regulating heater with integral induction coil and method of manufacture thereof |
| US5310975A (en) * | 1992-12-23 | 1994-05-10 | General Electric Company | Method and apparatus for the continuous field annealing of amorphous metal transformer cores |
| US5288959A (en) * | 1993-04-30 | 1994-02-22 | The Whitaker Corporation | Device for electrically interconnecting opposed contact arrays |
| US5279028A (en) * | 1993-04-30 | 1994-01-18 | The Whitaker Corporation | Method of making a pin grid array and terminal for use therein |
| US5357084A (en) * | 1993-11-15 | 1994-10-18 | The Whitaker Corporation | Device for electrically interconnecting contact arrays |
| WO2000022883A1 (en) * | 1998-10-10 | 2000-04-20 | Trucco Horacio Andres | Matrix-inductor soldering apparatus and soldering process |
| US6271507B2 (en) * | 1999-10-08 | 2001-08-07 | Molex Incorporated | Apparatus and method for bonding conductors |
| DE102007025690A1 (de) * | 2007-06-01 | 2008-12-04 | Hpf Gmbh | Verfahren und Anordnung zum Erwärmen eines Mediums in einem lang gestreckten Behältnis, insbesondere in einer schlauchförmigen Flüssigkeitszuleitung |
| US9190375B2 (en) | 2014-04-09 | 2015-11-17 | GlobalFoundries, Inc. | Solder bump reflow by induction heating |
| US9878039B1 (en) | 2016-09-01 | 2018-01-30 | International Business Machines Corporation | Microcapsule having a microcapsule shell material that is rupturable via a retro-dimerization reaction |
| US10328535B2 (en) | 2016-11-07 | 2019-06-25 | International Business Machines Corporation | Self-heating solder flux material |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2926231A (en) * | 1958-04-11 | 1960-02-23 | Robert B Mcdowell | Method and apparatus for soldering |
| US3218384A (en) * | 1962-03-29 | 1965-11-16 | Int Nickel Co | Temperature-responsive transmission line conductor for de-icing |
| GB1076772A (en) * | 1963-03-15 | 1967-07-19 | Central Electr Generat Board | Improvements in or relating to electrical conductors for alternating current |
| US4185632A (en) * | 1970-08-13 | 1980-01-29 | Shaw Robert F | Surgical instrument having self-regulated electrical skin-depth heating of its cutting edge and method of using the same |
| US4001490A (en) * | 1974-06-19 | 1977-01-04 | Amp Incorporated | Strip bus bar for terminal posts |
| US4091813A (en) * | 1975-03-14 | 1978-05-30 | Robert F. Shaw | Surgical instrument having self-regulated electrical proximity heating of its cutting edge and method of using the same |
| SE422956B (sv) * | 1977-11-16 | 1982-04-05 | Asea Ab | Induktiv vermningsugn |
| US4292489A (en) * | 1978-12-01 | 1981-09-29 | The Continental Group, Inc. | Tab heating and applying apparatus |
| US4258241A (en) * | 1979-03-28 | 1981-03-24 | Park-Ohio Industries, Inc. | Slot furnace for inductively heating axially spaced areas of a workpiece |
| DE2916349C2 (de) * | 1979-04-23 | 1983-06-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen einer oder mehrerer Kontaktverbindungen zwischen einem lackisolierten Draht und einem oder mehreren Kontaktteilen eines elektrischen Bauteiles |
| CH647908A5 (de) * | 1979-06-05 | 1985-02-15 | Siemens Ag Albis | Verfahren und anordnung zum kontaktieren der leiterbahnen von leiterplatten mit kontaktstiften. |
| US4256945A (en) * | 1979-08-31 | 1981-03-17 | Iris Associates | Alternating current electrically resistive heating element having intrinsic temperature control |
| US4323748A (en) * | 1980-04-11 | 1982-04-06 | American Can Company | Power transfer system |
| JPS60500166A (ja) * | 1982-12-01 | 1985-02-07 | メトカル インコ−ポレ−テツド | 薄層でない溶融性の |
| JPS60118370A (ja) * | 1983-11-30 | 1985-06-25 | Toshiba Corp | 半田付け方法 |
-
1985
- 1985-06-18 US US06/745,936 patent/US4795870A/en not_active Expired - Lifetime
-
1986
- 1986-06-06 CA CA000511062A patent/CA1264360A/en not_active Expired - Fee Related
- 1986-06-09 AT AT86304394T patent/ATE79984T1/de not_active IP Right Cessation
- 1986-06-09 DE DE8686304394T patent/DE3686518T2/de not_active Expired - Fee Related
- 1986-06-09 EP EP86304394A patent/EP0206620B1/de not_active Expired - Lifetime
- 1986-06-18 JP JP61140414A patent/JPH0646526B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0206620A3 (en) | 1988-06-22 |
| EP0206620B1 (de) | 1992-08-26 |
| US4795870A (en) | 1989-01-03 |
| CA1264360A (en) | 1990-01-09 |
| JPS61292808A (ja) | 1986-12-23 |
| JPH0646526B2 (ja) | 1994-06-15 |
| DE3686518T2 (de) | 1993-03-25 |
| EP0206620A2 (de) | 1986-12-30 |
| DE3686518D1 (de) | 1992-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |