ATE75314T1 - Verfahren zur analyse der konzentration eines zusatzstoffes. - Google Patents

Verfahren zur analyse der konzentration eines zusatzstoffes.

Info

Publication number
ATE75314T1
ATE75314T1 AT87102422T AT87102422T ATE75314T1 AT E75314 T1 ATE75314 T1 AT E75314T1 AT 87102422 T AT87102422 T AT 87102422T AT 87102422 T AT87102422 T AT 87102422T AT E75314 T1 ATE75314 T1 AT E75314T1
Authority
AT
Austria
Prior art keywords
additive
applied potential
voltammetric
predetermined sequence
electrode
Prior art date
Application number
AT87102422T
Other languages
English (en)
Inventor
Gordon Fisher
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Application granted granted Critical
Publication of ATE75314T1 publication Critical patent/ATE75314T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • G01N27/423—Coulometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
AT87102422T 1986-04-24 1987-02-20 Verfahren zur analyse der konzentration eines zusatzstoffes. ATE75314T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/855,360 US4917774A (en) 1986-04-24 1986-04-24 Method for analyzing additive concentration
EP87102422A EP0242530B1 (de) 1986-04-24 1987-02-20 Verfahren zur Analyse der Konzentration eines Zusatzstoffes

Publications (1)

Publication Number Publication Date
ATE75314T1 true ATE75314T1 (de) 1992-05-15

Family

ID=25321048

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87102422T ATE75314T1 (de) 1986-04-24 1987-02-20 Verfahren zur analyse der konzentration eines zusatzstoffes.

Country Status (5)

Country Link
US (1) US4917774A (de)
EP (1) EP0242530B1 (de)
JP (1) JPS62273444A (de)
AT (1) ATE75314T1 (de)
DE (1) DE3778416D1 (de)

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US4939924A (en) * 1988-09-26 1990-07-10 Iowa State University Research Foundation, Inc. Pulsed coulometric detection with automatic rejection of background signal in surface-oxide catalyzed anodic detections at gold electrodes in flow-through cells
US5223118A (en) * 1991-03-08 1993-06-29 Shipley Company Inc. Method for analyzing organic additives in an electroplating bath
US5192403A (en) * 1991-05-16 1993-03-09 International Business Machines Corporation Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures
DE69331566T2 (de) * 1992-05-11 2002-10-31 Nippon Telegraph & Telephone Elektrochemisches Nachweisverfahren und Vorrichtung dazu
US5389215A (en) * 1992-11-05 1995-02-14 Nippon Telegraph And Telephone Corporation Electrochemical detection method and apparatus therefor
US5320724A (en) * 1992-11-17 1994-06-14 Hughes Aircraft Company Method of monitoring constituents in plating baths
CA2087801C (en) * 1993-01-21 1996-08-13 Noranda Ipco Inc. Method and apparatus for on-line monitoring the quality of a purified metal sulphate solution
US5980708A (en) * 1997-02-12 1999-11-09 Champagne; Gilles Y. High sensitivity multiple waveform voltammetric instrument
US6270680B1 (en) * 1997-11-07 2001-08-07 Bioquest Amperometric sensor probe for an automatic halogen control system
USRE38931E1 (en) * 1998-05-01 2006-01-10 Semitool, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
JP2002506531A (ja) * 1998-05-01 2002-02-26 セミトウール・インコーポレーテツド 電気メッキ浴中の添加物の測定法
DE69929607T2 (de) 1998-06-30 2006-07-27 Semitool, Inc., Kalispell Metallisierungsstrukturen für mikroelektronische anwendungen und verfahren zur herstellung dieser strukturen
US6508924B1 (en) 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
US6645364B2 (en) 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
DE60113214T2 (de) * 2000-11-02 2006-06-08 Shipley Co., L.L.C., Marlborough Plattierungsbadanalyse
US6592736B2 (en) 2001-07-09 2003-07-15 Semitool, Inc. Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20030201191A1 (en) * 2002-04-29 2003-10-30 Applied Materials, Inc. Electrochemical method for direct organic additives analysis in copper baths
US7144488B2 (en) * 2002-06-05 2006-12-05 Shipley Company, L.L.C. Electrode, electrochemical cell, and method for analysis of electroplating baths
US6709568B2 (en) * 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
EP1540046A4 (de) * 2002-07-19 2007-04-04 Technic Verfahren und vorrichtung zur echtzeit berwachung von technischen elektrolyten
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
DE60336539D1 (de) * 2002-12-20 2011-05-12 Shipley Co Llc Methode zum Elektroplattieren mit Umkehrpulsstrom
JP4303484B2 (ja) 2003-01-21 2009-07-29 大日本スクリーン製造株式会社 メッキ装置
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
JP2004323971A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 改良された浴分析
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
EP1689686A2 (de) * 2003-10-29 2006-08-16 Rheodyne, LLC Dosierungsmotor und kartuschenvorrichtung zur flüssigkeitsabgabe und verfahren
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US8496799B2 (en) * 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
US8529738B2 (en) * 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
WO2006110437A1 (en) * 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
WO2007027907A2 (en) * 2005-09-02 2007-03-08 The Trustees Of Columbia University In The City Of New York A system and method for obtaining anisotropic etching of patterned substrates
WO2008070786A1 (en) * 2006-12-06 2008-06-12 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1064852A (en) * 1975-12-31 1979-10-23 Cominco Ltd. Method for evaluating a system for electrodeposition of metals
GB1531761A (en) * 1976-06-30 1978-11-08 Edt Supplies Ltd Electrochemical detector system
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
DE3030664C2 (de) * 1980-08-13 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Bestimmung der Stromausbeute bei galvanischen Bädern
US4496454A (en) * 1983-10-19 1985-01-29 Hewlett-Packard Company Self cleaning electrochemical detector and cell for flowing stream analysis
US4566949A (en) * 1983-10-19 1986-01-28 Hewlett-Packard Company Method of operating a self cleaning electrochemical detector
FI70648C (fi) * 1983-12-29 1986-09-24 Outokumpu Oy Voltametriskt maetningsfoerfarande och anordning foer dess tillaempning
US4735691A (en) * 1985-12-23 1988-04-05 Allied Corporation Method for operating electrochemical detector cell

Also Published As

Publication number Publication date
EP0242530A3 (en) 1989-05-10
EP0242530B1 (de) 1992-04-22
JPS62273444A (ja) 1987-11-27
EP0242530A2 (de) 1987-10-28
DE3778416D1 (de) 1992-05-27
US4917774A (en) 1990-04-17

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