ATE66969T1 - Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. - Google Patents
Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.Info
- Publication number
- ATE66969T1 ATE66969T1 AT88100684T AT88100684T ATE66969T1 AT E66969 T1 ATE66969 T1 AT E66969T1 AT 88100684 T AT88100684 T AT 88100684T AT 88100684 T AT88100684 T AT 88100684T AT E66969 T1 ATE66969 T1 AT E66969T1
- Authority
- AT
- Austria
- Prior art keywords
- route
- travel
- electrolyte
- plate
- circuit boards
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3702229 | 1987-01-26 | ||
EP88100684A EP0276725B1 (de) | 1987-01-26 | 1988-01-19 | Galvanisierungseinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten |
DE3823072A DE3823072A1 (de) | 1987-01-26 | 1988-07-07 | Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE66969T1 true ATE66969T1 (de) | 1991-09-15 |
Family
ID=39387448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT88100684T ATE66969T1 (de) | 1987-01-26 | 1988-01-19 | Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. |
Country Status (2)
Country | Link |
---|---|
AT (1) | ATE66969T1 (de) |
DE (1) | DE3823072A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4437848C1 (de) * | 1994-10-22 | 1996-01-18 | Bosch Gmbh Robert | Vorrichtung zur kontinuierlichen Galvanisierung von ebenen Werkstücken und deren Verwendung |
DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
DE10206660C1 (de) * | 2002-02-12 | 2003-07-24 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum Transport von flachem Behandlungsgut in Durchlaufanlagen |
DE102012221012B4 (de) * | 2012-11-16 | 2023-01-19 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur Behandlung von flachem Behandlungsgut |
-
1988
- 1988-01-19 AT AT88100684T patent/ATE66969T1/de not_active IP Right Cessation
- 1988-07-07 DE DE3823072A patent/DE3823072A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
DE3823072A1 (de) | 1990-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REN | Ceased due to non-payment of the annual fee |