ATE554643T1 - Verdampfer und kühlkreis - Google Patents

Verdampfer und kühlkreis

Info

Publication number
ATE554643T1
ATE554643T1 AT09167267T AT09167267T ATE554643T1 AT E554643 T1 ATE554643 T1 AT E554643T1 AT 09167267 T AT09167267 T AT 09167267T AT 09167267 T AT09167267 T AT 09167267T AT E554643 T1 ATE554643 T1 AT E554643T1
Authority
AT
Austria
Prior art keywords
evaporator
cooling circuit
cooling
emitting device
evaporation
Prior art date
Application number
AT09167267T
Other languages
English (en)
Inventor
Francesco Agostini
Berk Yesin
Bruno Agostini
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Application granted granted Critical
Publication of ATE554643T1 publication Critical patent/ATE554643T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT09167267T 2009-08-05 2009-08-05 Verdampfer und kühlkreis ATE554643T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09167267A EP2282624B1 (de) 2009-08-05 2009-08-05 Verdampfer und Kühlkreis

Publications (1)

Publication Number Publication Date
ATE554643T1 true ATE554643T1 (de) 2012-05-15

Family

ID=41697984

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09167267T ATE554643T1 (de) 2009-08-05 2009-08-05 Verdampfer und kühlkreis

Country Status (4)

Country Link
US (1) US8763681B2 (de)
EP (1) EP2282624B1 (de)
CN (1) CN101996964B (de)
AT (1) ATE554643T1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2544518A1 (de) * 2011-07-07 2013-01-09 ABB Research Ltd. Kühlvorrichtung zum Kühlen eines elektronischen Leistungsmaschine
EP2568789B1 (de) 2011-09-06 2014-04-16 ABB Research Ltd. Wärmetauscher
EP2645040B1 (de) * 2012-03-28 2017-06-21 ABB Research Ltd. Wärmetauscher für Traktionsstromrichter
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2013169774A2 (en) 2012-05-07 2013-11-14 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
EP2703763A1 (de) 2012-09-03 2014-03-05 ABB Technology AG Verdampfer mit integriertem Vorwärmer zur Leistungselektronikkühlung
EP2734020B1 (de) * 2012-11-19 2017-07-12 ABB Schweiz AG Kühlanordnung mit einem zweiphasigen Wärmesyphon zum Kühlen einer Mehrzahl elektrischer Vorrichtungen
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
DE102015215558B4 (de) * 2015-08-14 2018-10-18 SCHäFER WERKE GMBH Rohrleitungsdurchführung in einem Schrank für elektronische Komponenten
JP6358240B2 (ja) * 2015-11-19 2018-07-18 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
US10178803B2 (en) * 2016-03-11 2019-01-08 Eaton Intelligent Power Limited Thermosyphon cooling apparatus with isolation of cooled components
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US20170295671A1 (en) * 2016-04-11 2017-10-12 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10353445B2 (en) * 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10260819B2 (en) * 2016-07-26 2019-04-16 Tokitae Llc Thermosiphons for use with temperature-regulated storage devices
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter
US9999157B2 (en) 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
CN106089829B (zh) * 2016-08-23 2018-01-30 成都翼高九天科技有限公司 一种密封性能好能减少泄露的液压系统
CN106194909B (zh) * 2016-08-23 2018-01-30 成都翼高九天科技有限公司 一种自动冷却避免发热的液压系统
WO2018055944A1 (ja) * 2016-09-26 2018-03-29 株式会社デンソー 機器温調装置
US11252847B2 (en) 2017-06-30 2022-02-15 General Electric Company Heat dissipation system and an associated method thereof
JP2019132456A (ja) * 2018-01-29 2019-08-08 株式会社デンソー 車両用サーモサイフォン式冷却装置
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
CN112954989B (zh) * 2021-05-18 2021-09-10 四川斯艾普电子科技有限公司 一种雷达液冷装置
CN114845527B (zh) * 2022-04-29 2024-01-26 北京微焓科技有限公司 相变冷却型机箱及其系统

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
US5195577A (en) 1989-10-26 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Cooling device for power semiconductor switching elements
JP2859927B2 (ja) * 1990-05-16 1999-02-24 株式会社東芝 冷却装置および温度制御装置
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
US6155075A (en) * 1999-03-18 2000-12-05 Lennox Manufacturing Inc. Evaporator with enhanced refrigerant distribution
JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US7775267B2 (en) * 2003-07-08 2010-08-17 Showa Denko K.K. Evaporator
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
WO2005121683A1 (en) * 2004-06-14 2005-12-22 Showa Denko K.K. Heat exchanger
US7443066B2 (en) * 2005-07-29 2008-10-28 General Electric Company Methods and apparatus for cooling wind turbine generators
JP3982545B2 (ja) * 2005-09-22 2007-09-26 ダイキン工業株式会社 空気調和装置
US7753108B2 (en) * 2006-12-01 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Liquid cooling device
US20080230797A1 (en) * 2007-03-21 2008-09-25 Hui-Hung Chang LED module and manufacturing method thereof
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
US20090108969A1 (en) * 2007-10-31 2009-04-30 Los Alamos National Security Apparatus and method for transcranial and nerve magnetic stimulation
US8132424B2 (en) * 2008-09-17 2012-03-13 Integrated Marine Systems, Inc. Ice machines with extruded heat exchanger

Also Published As

Publication number Publication date
EP2282624A1 (de) 2011-02-09
EP2282624B1 (de) 2012-04-18
US20110030400A1 (en) 2011-02-10
CN101996964A (zh) 2011-03-30
US8763681B2 (en) 2014-07-01
CN101996964B (zh) 2016-03-30

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