WO2011095616A3 - Led-lampe mit wärmerohr als kühlung - Google Patents
Led-lampe mit wärmerohr als kühlung Download PDFInfo
- Publication number
- WO2011095616A3 WO2011095616A3 PCT/EP2011/051703 EP2011051703W WO2011095616A3 WO 2011095616 A3 WO2011095616 A3 WO 2011095616A3 EP 2011051703 W EP2011051703 W EP 2011051703W WO 2011095616 A3 WO2011095616 A3 WO 2011095616A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- heat pipe
- led lamp
- cooling
- working medium
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Die Erfindung betrifft eine LED-Lampe mit mindestens einer LED (11), die in einem Arbeitsraum (12) angeordnet ist. Erfindungsgemäß ist vorgesehen, dass die Kühlung der LED (11) durch ein Wärmerohr erfolgt, welches durch den Arbeitsraum (12) der LED (11) selbst gebildet ist. Vorteilhaft ist daher eine direkte Abgabe der Verlustwärme der LED (11) an das Arbeitsmedium (17) möglich, wodurch vorteilhaft eine sehr effektive Kühlung realisiert wird. Das verdampfende Arbeitsmedium kondensiert beispielsweise an der als Reflektor ausgeführten Seitenfläche (18) des Arbeitsraumes (12), wodurch eine zuverlässige Wärmeabfuhr ermöglicht wird. Die Seitenflächen (18) können zur Unterstützung des Rücktransportes des flüssigen Arbeitsmediums zur LED (11) mit einer kapillaren Struktur versehen sein.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11704041A EP2534417A2 (de) | 2010-02-08 | 2011-02-07 | Led-lampe mit wärmerohr als kühlung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010007687.2 | 2010-02-08 | ||
DE102010007687A DE102010007687A1 (de) | 2010-02-08 | 2010-02-08 | LED-Lampe mit Wärmerohr als Kühlung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011095616A2 WO2011095616A2 (de) | 2011-08-11 |
WO2011095616A3 true WO2011095616A3 (de) | 2011-11-10 |
Family
ID=44316699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/051703 WO2011095616A2 (de) | 2010-02-08 | 2011-02-07 | Led-lampe mit wärmerohr als kühlung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2534417A2 (de) |
DE (1) | DE102010007687A1 (de) |
WO (1) | WO2011095616A2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011121155B4 (de) | 2011-12-15 | 2014-01-02 | Oechsler Aktiengesellschaft | LED-Leuchte mit Wärmeträger-Gehäuse |
US9122582B2 (en) | 2012-06-12 | 2015-09-01 | International Business Machines Corporation | File system for maintaining data versions in solid state memory |
US9116793B2 (en) | 2012-06-12 | 2015-08-25 | International Business Machines Corporation | Maintaining versions of data in solid state memory |
US9135161B2 (en) | 2012-06-12 | 2015-09-15 | International Business Machines Corporation | Flash translation layer system for maintaining data versions in solid state memory |
DE102012211279A1 (de) | 2012-06-29 | 2014-01-02 | Osram Gmbh | Halbleiter-leuchtvorrichtung mit wärmerohr |
DE102013201955B4 (de) * | 2013-02-06 | 2017-02-16 | Osram Gmbh | Halbleiter-Leuchtvorrichtung mit Wärmerohr |
US9401468B2 (en) | 2014-12-24 | 2016-07-26 | GE Lighting Solutions, LLC | Lamp with LED chips cooled by a phase transformation loop |
DE102019213150A1 (de) | 2019-08-30 | 2021-03-04 | Würth Elektronik eiSos Gmbh & Co. KG | Strahler und Verfahren zum Abstrahlen von Licht |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005013208A1 (de) * | 2004-03-21 | 2005-10-27 | Späth, Christian, Dipl.-Designer | LED-Leuchtdioden Leuchte |
US20050243558A1 (en) * | 2004-04-30 | 2005-11-03 | Guide Corporation | LED assembly with reverse circuit board |
WO2006105644A1 (en) * | 2005-04-05 | 2006-10-12 | Tir Systems Ltd. | Mounting assembly for optoelectronic devices |
WO2007069119A1 (en) * | 2005-12-14 | 2007-06-21 | Philips Intellectual Property & Standards Gmbh | Lighting device and method for manufacturing same |
US20090002995A1 (en) * | 2007-06-27 | 2009-01-01 | Foxconn Technology Co., Ltd. | Led lamp |
FR2926947A1 (fr) * | 2008-01-30 | 2009-07-31 | Fd Eclairage Architectural Sa | Source lumineuse a diodes led |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6410982B1 (en) * | 1999-11-12 | 2002-06-25 | Intel Corporation | Heatpipesink having integrated heat pipe and heat sink |
DE102005057524A1 (de) * | 2004-12-30 | 2006-07-13 | Osram Opto Semiconductors Gmbh | Kühlvorrichtung zur Kühlung eines Halbleiterbauelementes, insbesondere eines optoelektronischen Halbleiterbauelementes |
DE102007055165A1 (de) * | 2007-11-19 | 2009-05-20 | Osram Gesellschaft mit beschränkter Haftung | LED-Scheinwerfer |
-
2010
- 2010-02-08 DE DE102010007687A patent/DE102010007687A1/de not_active Withdrawn
-
2011
- 2011-02-07 WO PCT/EP2011/051703 patent/WO2011095616A2/de active Application Filing
- 2011-02-07 EP EP11704041A patent/EP2534417A2/de not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005013208A1 (de) * | 2004-03-21 | 2005-10-27 | Späth, Christian, Dipl.-Designer | LED-Leuchtdioden Leuchte |
US20050243558A1 (en) * | 2004-04-30 | 2005-11-03 | Guide Corporation | LED assembly with reverse circuit board |
WO2006105644A1 (en) * | 2005-04-05 | 2006-10-12 | Tir Systems Ltd. | Mounting assembly for optoelectronic devices |
WO2007069119A1 (en) * | 2005-12-14 | 2007-06-21 | Philips Intellectual Property & Standards Gmbh | Lighting device and method for manufacturing same |
US20090002995A1 (en) * | 2007-06-27 | 2009-01-01 | Foxconn Technology Co., Ltd. | Led lamp |
FR2926947A1 (fr) * | 2008-01-30 | 2009-07-31 | Fd Eclairage Architectural Sa | Source lumineuse a diodes led |
Also Published As
Publication number | Publication date |
---|---|
WO2011095616A2 (de) | 2011-08-11 |
DE102010007687A1 (de) | 2011-08-11 |
EP2534417A2 (de) | 2012-12-19 |
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