ATE552570T1 - Verfahren und vorrichtung zur verschachtelung eines moduls oder chips - Google Patents

Verfahren und vorrichtung zur verschachtelung eines moduls oder chips

Info

Publication number
ATE552570T1
ATE552570T1 AT08865669T AT08865669T ATE552570T1 AT E552570 T1 ATE552570 T1 AT E552570T1 AT 08865669 T AT08865669 T AT 08865669T AT 08865669 T AT08865669 T AT 08865669T AT E552570 T1 ATE552570 T1 AT E552570T1
Authority
AT
Austria
Prior art keywords
module
affixing
guiding member
chip
interleaving
Prior art date
Application number
AT08865669T
Other languages
English (en)
Inventor
Benoit Berthe
Frederic Beulet
Sebastien Michenet
Original Assignee
Datacard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacard Corp filed Critical Datacard Corp
Application granted granted Critical
Publication of ATE552570T1 publication Critical patent/ATE552570T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1339—Delivering cut part in sequence to serially conveyed articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
AT08865669T 2007-12-26 2008-12-16 Verfahren und vorrichtung zur verschachtelung eines moduls oder chips ATE552570T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0709107A FR2925969B1 (fr) 2007-12-26 2007-12-26 Procede et dispositif d'encartage d'un module ou puce.
PCT/IB2008/003501 WO2009081251A1 (en) 2007-12-26 2008-12-16 Method and device for interleaving a module or chip

Publications (1)

Publication Number Publication Date
ATE552570T1 true ATE552570T1 (de) 2012-04-15

Family

ID=39672665

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08865669T ATE552570T1 (de) 2007-12-26 2008-12-16 Verfahren und vorrichtung zur verschachtelung eines moduls oder chips

Country Status (7)

Country Link
US (1) US8562782B2 (de)
EP (1) EP2232416B1 (de)
CN (1) CN101952840B (de)
AT (1) ATE552570T1 (de)
BR (1) BRPI0821842A2 (de)
FR (1) FR2925969B1 (de)
WO (1) WO2009081251A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110276433B (zh) * 2012-11-09 2023-03-24 恩图鲁斯特咨询卡有限公司 打标记的压头

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224994A1 (de) * 1992-07-29 1994-02-03 Ruhlamat Automatisierungstechn Vorrichtung zum flächenbündigen Eindrücken eines Moduls
FR2695854B1 (fr) * 1992-09-22 1994-12-09 Leroux Ets Gilles Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.
FR2703806B1 (fr) * 1993-04-06 1995-07-13 Leroux Gilles Sa Objet portatif et procede de fabrication.
DE10110939B4 (de) * 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
KR100469169B1 (ko) * 2002-08-14 2005-02-02 삼성전자주식회사 절연 접착 테이프를 이용한 적층 칩 접착 장치
KR100484088B1 (ko) * 2002-12-06 2005-04-20 삼성전자주식회사 멀티 칩 패키지용 다이 어태치와 경화 인라인 장치
DE10320843B3 (de) * 2003-05-08 2005-01-13 Mühlbauer Ag Vorrichtung zum Verbinden von Mikrochipmodulen mit Antennen
EP1686512A1 (de) * 2005-02-01 2006-08-02 NagraID S.A. Verfahren zur Plazierung einer elektonischen Vorrichtung auf ein Substrat und Plaziervorrichtung
KR100899421B1 (ko) * 2007-02-28 2009-05-27 삼성테크윈 주식회사 칩 본딩 툴, 그 본딩 툴을 구비하는 플립 칩 본딩 장치 및 방법

Also Published As

Publication number Publication date
WO2009081251A1 (en) 2009-07-02
US20100319845A1 (en) 2010-12-23
FR2925969A1 (fr) 2009-07-03
EP2232416B1 (de) 2012-04-04
BRPI0821842A2 (pt) 2019-09-24
CN101952840A (zh) 2011-01-19
CN101952840B (zh) 2013-08-07
US8562782B2 (en) 2013-10-22
FR2925969B1 (fr) 2010-01-22
EP2232416A1 (de) 2010-09-29

Similar Documents

Publication Publication Date Title
DE502007007144D1 (de) Verfahren zur anbringung von kennzeichen auf substratoberflächen mit hilfe eines transferverfahrens
DE502005009898D1 (de) Verfahren und vorrichtung zum kontinuierlichen herstellen elektronischer folienbauteile sowie elektronisches folienbauteil
ATE550173T1 (de) Wellpappe-anlage und verfahren zur herstellung von wellpappe
GB0315623D0 (en) Die bonding
DE602005012742D1 (de) Bonding Maschine um Transponder zu befestigen und Verfahren
DE602007002380D1 (de) Verfahren zum ausrichten und schneiden einer deckelbandbahn
ATE503638T1 (de) Verfahren und vorrichtung zum herstellen von druckprodukten
DE502008003104D1 (de) Vorrichtung zur beschriftung von kennzeichnungsschildern
ATE552570T1 (de) Verfahren und vorrichtung zur verschachtelung eines moduls oder chips
ATE546806T1 (de) Anpassbare vorrichtung zum kennzeichnen von behältern
ATE516206T1 (de) Verfahren und vorrichtung zum siegeln einer aufreissfolie auf ein verpackungselement
NO20031061D0 (no) Laminatetikett samt fremgangsmåte og anordning for dens fremstilling
TW200720061A (en) Apparatus and method for manufacturing a photosensitive laminated body
KR20190130003A (ko) 캐리어와 이에 고정되는 복수의 전기 회로로 된 조립체 및 그 제조 방법
DE602005012628D1 (de) Verfahren zur herstellung eines lichtempfindlichen laminierten körpers und vorrichtung dafür
ATE503379T1 (de) Vorrichtung zum bewegen eines positionierrahmens sowie eines futterbehälters am melkplatz
JP3868332B2 (ja) Ｉｃタグラミネート装置および方法
ATE274726T1 (de) Verfahren zum heissverkleben eines chipmoduls mit einem trägersubstrat
ATE524300T1 (de) Verfahren zur herstellung von siegelwerkzeugen sowie eine siegelstation mit nach diesem verfahren hergestellten siegelwerkzeugen
CN107846787A (zh) 一种自动贴片机精准定位辅助装置
ATE531641T1 (de) Verpackungsmaschine und verfahren zur kontinuierlichen herstellung von kunststofffolienverpackungen mit etikett
ATE243623T1 (de) Verfahren und vorrichtung zur herstellung von personalisierten coupons
TW200745964A (en) Wire embedded bridge
ATE486333T1 (de) Verfahren zum frankieren, bedrucken und bebildern von flachen versandobjekten
ATE391592T1 (de) Einrichtung und verfahren zur herstellung von kunststoffteilen mit einer beschichtung