Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems IncfiledCriticalCheckpoint Systems Inc
Publication of TW200745964ApublicationCriticalpatent/TW200745964A/en
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into the poly sheet at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction. The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips with the embedded wire and form a protected RFII) circuit.
Nitriding method for insulation film, semiconductor device and production method for semiconductor device, substrate treating device and substrate treating method
Semiconductor substrate manufacturing method and semiconductor device manufacturing method, and semiconductor substrate and semiconductor device manufactured by the methods
Production method of electronic apparatus, production method of electronic equipment in which electronic apparatus is packaged, and production method of article in which electronic apparatus is mounted