CN101384419A - Wire embedded bridge - Google Patents

Abstract

A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into the poly sheet at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction. The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips with the embedded wire and form a protected RFID circuit.

Description

Wire embedded bridge

Technical field

The present invention relates to safety label, particularly be used for production such as the integrated conductive strips commonly used of RFID circuit.

Background technology

Chip join with high costs.At present the cost structure of two maximums is integrated circuits and this circuit (being also referred to as silicon circuit) is connected to antenna structure in the RFID label.Though the increase of number of chips helps to impel the integrated circuit price to descend, engaging is mechanical process, can not benefit from same technological progress or large-scale production.

The existing chip joint method is not enough to the workout cost problem.The two-step method of intermediary chip strap has realized the marginal cost improvement by redistributing cost.Yet chip belt can not directly be dealt with problems, because still need to engage, only for less label.And chip belt has increased another and has joined chip belt on the antenna structure step.Use the present manufacturer of the standard joining technique of chip belt to wish that chip belt has common traditional composition surface based on circuit board technology, promptly hard and unbending surface.But this chip belt is unsuitable for being integrated into easily in the flexible label (for example, RFID label).The standard engaging process is known full solution based on bandage, and is unfavorable therefore.

A kind of relevant method of attachment that is called fluid self-assembly (FSA) can not provide enough strong joint.Because chip need manage to enter abutment sleeve, move freely and enter sleeve pipe because any stickum all can hinder chip, so chip can not use adhesive and solder flux.In fluid self-assembly process, described joint tangentially is formed between chip join dish and the conjugate foramen edge.The joint at this plane-edge (flat-to-edge) is different from traditional joint, and poorer than the reliability of the joint of traditional plane-plane (flat-to-flat).The fluid self-assembly also limits spendable type of substrate.The fluid self-assembly does not produce joint, just label is positioned in the suitable carriers that is used to connect.The fluid self-assembly method of current use is used the shearing polyester of patterning and another thin layer is pressed onto the top of the connecting plate that chip is arranged (web) of appropriate location.Back connecting plate is left a hole by laser cutting, this hole the near-end of chip join disk area and above.Be filled with conductive ink in the described hole and finish a row traces perpendicular to the back side in hole to form conductive strips.Described fluid self-assembly process is slowly and uses a plurality of steps, exigent again accuracy for present utilizable production technology.

Disclose known wire engaging process in people's such as Isaacson United States Patent (USP) 5,708,419, the content of this patent is incorporated in this by reference.Isaacson has been discussed integrated circuit and can not have been born the flexibility of high temperature (for example carrying out the temperature of welding process) or engaging of non-rigid substrate usually.In this wire engaging process, chip or dyestuff are connected on substrate or the carrier with lead.Chip is connected on the substrate that docks with the front end front of chip.Lead at first joins chip to, is linked to be the loop then and is mounted on the substrate.The step that typical wire engages operation comprises:

1. connecting plate (web) is advanced to next abutment;

2. stop;

3. take the digital photos at this abutment;

4. calculating bonding station;

5. pick-up chip;

6. this chip is moved to the abutment;

7. use of the placement of photograph feedback adjusting in the actual point position;

8. place and apply (depositing) chip;

9. chip is taken pictures with the locating engagement dish;

10. head is moved on to the chip join dish;

11. push, vibrate and with wire bonds to bond pad;

12. chip is pulled up and moves to the substrate bond pad, lead is pulled back the chip join thing;

13. push and weld this binding element;

14. pull up and cut off lead; And

15. each is connected repeating step 10-14.

On the contrary, chip and the interconnection between the substrate with the upside-down method of hull-section construction encapsulation formed by bond pad that is located immediately at the conduction on the chip surface or solder bump.Chip upset that then should projection and facing down is so that projection is electrically connected to substrate.

Owing to each chip need be matched the abutment of tiny, an accurate cutting, as a kind of current technical process, it is expensive that upside-down method of hull-section construction engages.When chip become more hour, it just becomes harder so that can more accurately cut and handle the abutment.But described upside-down method of hull-section construction engaging process has quite progressive than the wire joint.The step of typical upside-down method of hull-section construction engaging process comprises:

1. connecting plate is advanced to next abutment;

2. stop;

3. taken pictures in this abutment;

4. calculating bonding station;

5. pick-up chip;

6. chip is moved to the abutment;

7. use of the placement of photograph feedback adjusting in the actual point position;

8. placement chip;

9. the position of the head ultrasonic vibration of placing to welding chip; And

10. regain the head of placing.

The step 1 to 8 of above-mentioned engaging process is basic identical.Described connecting plate must stop so that locating conductive trench and accurately place integrated circuit on substrate.Relevant technical process requirement connecting plate is stopped also measured (for example take the abutment that comprises bonding station, use the placement of photograph feedback adjusting in the actual point position) so that chip can be placed into accurately the position and the joint of adjacent trenches.

The path spended time that turns back in engaging process causes vibration, and the wearing and tearing mechanical connection.The mechanical connection of these wearing and tearing also causes the uncertain of absolute position.Preferred rotation or continuous motion device rather than reciprocating apparatus, partly cause are to stop and starting production line production is slowed down and to reduce output.Regulating process operation in operation is useful so that advance continuously with known translational speed along straight line.

When chip was placed on the antenna structure, just as the delegation aluminium strip forms bridge, that close on and overlapping conductive material had produced the electric capacity of not expecting, especially under UHF or higher frequency.Therefore, be overlapping the minimizing of the conduction at the abutment between chip and the conductive strips useful, particularly for high frequency, as bigger bigger undesirable electric capacity and the lower tuned frequency of having when overlapping.Here all lists of references of mentioning all are herein incorporated by reference.

Summary of the invention

Described preferred embodiment comprise wire embed band and be used to make can belt body production method, for example, this belt body can use in forming the RFID circuit, perhaps is used to form the simple idol level antenna of RFID circuit.Described method for optimizing uses the basic composition of a pliable and tough film based on polymer as described belt body.By using heating and assisted calibration, wire is embedded into the accurate position in the polymer.Described embedded location wiry allows accurately chip to be placed on the described track, and this process is reliable and cheap.

According to one of preferred embodiment, the present invention includes the production equipment that is used to produce wire embedding band.This production equipment comprises first turning base, heating station and splitting station.Described first turning base is along the continuous mobile polymer flake of machine direction (for example, polyester, polyurethane, polystyrene, polypropylene, polyethylene, polyacrylate, copolymer, tripolymer and film thereof etc.).Described heating station heats this conductive strips during towards the first turning base continuous motion near first turning base and when conductive strips.When described conductive strips and polymer flake moved with respect to first turning base, described first turning base was embedded into polymer flake to the conductive strips of described heating so that form the conductive strips that embed.Described splitting station is divided into a plurality of conductive strips parts to the conductive strips that embed so that form non-conductive gap between continuous conductive strips part.Each continuous conductive strips part and the related circuit of bridge joint on each the non-conductive gap between each continuous part are electrical connected, and are formed for the antenna of described circuit.Described preferred production equipment also can comprise the alignment unit near first turning base, and described first turning base is aimed at conductive strips and polymer flake before conductive strips are embedded into polymer flake.In addition, described preferred production equipment can comprise the chip docking station, and this chip docking station is located at circuit on the non-conductive gap that is formed by splitting station.Described chip docking station also can be attached to each conductive strips part to the circuit of placing to form a bridge (for example, using pressure sintering).Described conductive strips can comprise delegation or multirow wire.

Be used for another preferred embodiment of the present invention and comprise the method that wire embeds band of making.This method comprises along the continuous mobile polymer flake of machine direction, heating is towards the conductive strips of polymer flake continuous motion, when conductive strips and polymer flake continuous motion, the conductive strips of heating are embedded into polymer flake to form Embedded conductive strips, embedded conductive strips are separated into the conductive strips part, and between continuous conductive strips part, form non-conductive gap.Further, described method for optimizing can be included in above-mentioned two parts are aimed at.Described method for optimizing can also comprise the related circuit that places on the non-conductive gap, and described related circuit is joined to the continuous part in close non-conductive gap to form a bridge.

According to another preferred embodiment, the present invention includes wire and embed band, this wire embeds and has polymer flake and couple of conductor.Described polymer flake (for example, polystyrene, polyethylene, polyester) is suitable for moving continuously along the machine direction of the production equipment of rotation.What described couple of conductor was parallel is embedded in the polymer flake along machine direction, and each lead is to being divided into lead to part along machine direction.Continuous lead to part by non-conductive gap along machine direction longitudinal separation, and with the related circuit electrical communication in the non-conductive gap of bridge joint.Preferred wire embeds band can also comprise the related circuit that part is electrically connected with each continuous lead, the non-conductive gap between also electrical each continuous part of bridge joint of described related circuit.

Description of drawings

The present invention will be described in conjunction with following accompanying drawing, and components identical represents with identical Reference numeral, wherein:

Fig. 1 is the side sectional view of the interior chip connection of mould production equipment according to a preferred embodiment of the invention;

Fig. 2 be according to a preferred embodiment of the invention the embedded metal silk and the vertical view of chip connection method;

Fig. 2 A is the stereogram of the chip belt (omission polythene strip) that makes of the method according to Fig. 2;

Fig. 3 is the broken section exploded view of chip belt according to a preferred embodiment of the invention;

Fig. 4 is the cutaway view of chip belt shown in Figure 3;

Fig. 5 illustrates the side sectional view that is used for making in the very first time first method for optimizing in non-conductive gap;

Fig. 6 illustrates the side sectional view that is used for making in second time first method for optimizing in non-conductive gap;

Fig. 7 is the side sectional view that second method for optimizing that is used to make non-conductive gap is shown;

Fig. 8 illustrates the side partial sectional view that is used for making in the very first time the 3rd method for optimizing in non-conductive gap; And

Fig. 9 illustrates to be used for making the side sectional view shown in the 3rd method for optimizing in non-conductive gap in second time.

The specific embodiment

According to a preferred embodiment of the invention, the heating of metal silk (for example, aluminium, gold, silver, copper and/or its combination) on accurate position embedded polymer thing (for example, polystyrene, polyethylene, polyester, polypropylene, polyethylene, polyacrylate, copolymer, tripolymer and film thereof) in case aim at the chip of placing subsequently and with described wire conducting.The have living space diameter of stability and preferred 2 Mills (mil) of described wire, perhaps known 40-50 number U.S.'s metal wire model (AWG).In a preferred embodiment, two row isolated metal lines are embedded in the polymer and are spaced laterally apart so that aim at the tie point of placing chip subsequently (for example, conduction contact block).The wire of described embedding is cut off and vertically separates with nonconducting gap between the wire that is formed on separation.As fruit chip (for example, RFID chip, transponder) be placed on the position of closing on the gap, and with the separating part electric connection wiry that embeds, so the non-conductive gap in the wire preferably be formed be used as the chip that is connected antenna and/or stop contingent short circuit.

Fig. 1-4 shows illustrative preferred embodiment and a kind of method of making wire embedding band that a kind of wire embeds band.Fig. 1 can the most clearly find out, is used to produce a kind of production equipment 10 that wire embeds band and includes 12, two rollers 14 of turning base and 16 of two rollers 14 and 16 along machine direction 20 continuous mobile polymer flakes 18.Described production equipment 10 conductive strips (for example also comprises one, wire 24, rod, volume) be heated to the heating station 22 of uniform temperature, described temperature is can be the softening temperature of polymer flake 18, and allows roller 14 by conductive strips are pressed into conductive strips to be embedded in the malleable polymer flake 18.Particularly, described heating of metal silk 24 makes the junction distortion of polymer alkene thin slice 18 at them, so that allow roller 14 that wire is pressed into polymer flake, thereby embeds wire.Preferably, described production equipment 10 comprises alignment unit 26, and this unit is aligned in wire 24 on the position of presetting to help side direction or the lateral arrangement of control wire 24 on polymer flake 18.Be not limited to specific theory, described production equipment 10 also comprises a splitting station 28, this splitting station 28 vertically is divided into wire belt 30 along the steering handle wire of described machine, and this wire belt 30 has non-conductive gap 32 between continuous wire belt, will describe in detail below.Can put up a bridge to form a chip belt by a chip subsequently in described non-conductive gap 32, also will describe in detail below.

Referring to Fig. 1, described polymer flake 18 moves on machine direction along production equipment 10.Be not limited to specific theory, described polymer flake 18 preferably under the help of the roller such such as roller 16 and roller 14 (be also referred to as and inlay roller 14) along the direction continuous motion of production equipment 10.Described roller is preferably made by the metal that hard rubber maybe can clamp polymer flake, so that described thin slice is advanced continuously.The described roller 14 of inlaying is preferably made so that wire 24 is pressed into polymer flake 18 by a kind of sufficiently rigid material or synthetic material, and is the material of high temperature resistance, the temperature negative effect wiry that makes roller can not be out of shape or can not be heated.So, can not damage the shape of inlaying roller 14 and roller 16 because of the temperature of hot wire, wherein the temperature of Jia Re wire 24 is enough high to melt or to soften described polymer flake 18 so that polymer flake 18 deforms and holds described wire 24.Described polymer flake 18 becomes the protection carrier of wire 24, therefore can stop after wire embeds described polymer flake unfavorable infringement wiry.

Described heating station 22 and alignment unit 26 are arranged in the polymer flake 18 ready for wire is accurate and reliable.It will be appreciated by those skilled in the art that, described heating station 22 heating of metal silks 24, for example heat energy, radiant energy or other energy are imposed on described wire, cause that temperature wiry is elevated to the degree of enough fusings or softening polymer flake 18, and when wire is inlayed roller 14 and is pressed into polymer flake, allow polymer flake 18 to hold described wire.Described alignment unit 26 comprises groove (for example, separating tank, opening 27), allows wire 24 to pass through alignment unit at groove or opening part, straight line embedded polymer thing thin slice on accurate position so that wire 24 is in line as wishing.Preferably, the aligned position of described wire 24 is configured to adapt (for example, contact point, conductive projection) with the terminal pad 40 of circuit, and this circuit can be connected to wire subsequently.Be not limited to special theory, described alignment unit 26 preferably is arranged on heating station 22 and inlays between the roller 14, and optionally near the position of inlaying roller, so that stop wire 26 before it is embedded into polymer flake 18, to deviate from the position of its calibration.But, the position that is appreciated that described alignment unit 26 is not limited thereto, described alignment unit can be connected to described heating station 22 or can be the part of turning base 12, as long as alignment unit 26 is for being embedded into the wire calibrating position in the polymer flake 18.

Still referring to Fig. 1, described wire 24 illustrates with a kind of conductive strips of winding, and this conductive strips unwinding is so that arrange wire in polymer flake 18.The mode that is appreciated that the wire source is not that the present invention will pay close attention to, and the wire bobbin is wire 24 preferred source embodiment.Therefore, it will be understood by those skilled in the art that described wire 24 can otherwise arrive heating station.

After described wire 24 was embedded in the polymer flake 18, described wire was cut into wire belt 30.Especially, when wire moved along with polymer flake 18, splitting station 28 cut off embedded metal silk 24 with certain interval, and this interval is by wire belt 30 decisions of the sufficient length that is suitable for application target (for example, antenna, connector, chip belt, bridge).Preferably, described splitting station 28 is the wire belt 30 crossed of separation cuts also, stays conduction and interrupt between continuous wire belt.Yet be not limited to a kind of specific theory, forming non-conductive gap between continuous wire belt has several different methods, and preferable methods is described as follows.

As known in the field, if not conduction interruption on the described conductive strips between the terminal pad of a chip, the chip or the circuit that have a plurality of conduction terminal pads that are connected to single conductive strips so can short circuits.Accordingly, in a preferred embodiment, between conducting metal silk ribbon 30, form non-conductive gap 32.Described gap is enough greatly to stop direct electric connection between the continuous metal silk ribbon 30, and is also enough little of to allow chip or circuit to be connected to continuous wire belt on this gap, for example, and as Figure 1-3.The antenna that described then wire belt 30 can be used as chip uses.In operation, described roller 14 and 16 is along the continuous propelling of the direction 20 of machine and move described polymer flake 18.Described wire 24 preferably from the starting position 34 of its bobbin towards described polymer flake 18 continuous motions, moves along machine direction 20 in company with polymer flake 18 after embedding.Described heater 22 is heated to wire 24 and can melts or the temperature of softening polymer flake 18, this polymer flake contact heating of metal silk.Preferred temperature to the small part that it will be understood by those skilled in the art that hot wire is by the speed decision by described roller 14 of the material of polymer flake, size wiry and polymer flake 18.The ability that described speed is only kept connecting plate tension force and control product shaping limits.Not being in line at chip is connected to the position of wire 24, supposes the speed motion of chip with per minute 300-400 foot.As what describe in detail below, when appended chip alinement, can not reach such speed, but the speed of polymer flake 18 by roller is still than fast several times of the speed of prior art.Present most of manufacturer's production standard is to realize per hour about 20000 units (for example, chip belt) as far as possible.This equals the connecting plate speed of .040 inch chip per minute 2-3 foot under the prior art.

Described wire 24 is constructed to be embedded into by alignment unit 26 the accurate lateral attitude of polymer flake 18.When the wire 24 of heating and calibration arrives describedly when inlaying roller 14, the wire of described heating is clamp-oned first side 78 of polymer flake 18 by roller 14.Described roller 16 is located at second side of polymer flake 18, and the opposite of inlaying roller 14 to support described polymer flake, makes described wire be inlayed roller and squeezes in the polymer flake.The described roller 14 of inlaying is got into softening polymer flake 18 to wire 24, preferably reaches the degree of depth of first side, the 78 basic coplanes of the expose portion that makes the embedded metal silk and polymer flake 18.Embedded metal silk 24 enter described polymer flake the degree of depth preferred embodiment as shown in Figure 4, will discuss in more detail below.

The wire 24 of described heating is embedded into after the described polymer flake 18, and wire and polymer flake continue along machine direction 20 continuous motions.The polymer flake 18 of described continuous motion and the wire 24 that embeds are further by splitting station 28, and splitting station splits into wire belt 30 with wire.In order to connect chip, described polymer flake 18 and wire belt 30 continue by chip docking station 36 then, and this station is connected to continuous wire belt 30 to chip 38 to form the conducting bridge of crossing over each non-conductive gap 32.Described chip 38 is connected in known manner to continuous wire belt 30, upside-down method of hull-section construction technology for example, this technology chips 38 have the conductive bond dish 40 that is located on the wire belt (as, contact, conductive solder piece), the chip of being placed 38 is heated and compresses so that bond pad 40 combines with embedded metal silk 24, forms the chip belt 42 shown in a Fig. 1-4.

Fig. 2 is polymer flake 18, the wire 24 of preferred embodiment shown in Figure 1, the partial top view of inlaying roller 14 and chip 38.Be not limited to particular theory, specific embodiment shown in Figure 2 shows two row metal silks 24 spaced a certain distance and is embedded into side by side in the polymer flake 18.When polymer flake 18 on machine direction 20 during continuous motion, described two row metal silks 24 are inlayed roller 14 embedded polymer thing thin slice 18 substantially parallel simultaneously.As can be seen, after the wire 24 of heating was inlayed roller 14 and embedded, two row metal silks 24 were all cut off by splitting station 28 from Fig. 1 and Fig. 2, and splitting station 28 forms gap 32 between the continuous wire belt 30 of every row.Described then chip docking station 36 is provided with chip 38 on gap 32, so that by being attached to the described wire belt 30 of bond pad 40 electric connections on the wire belt.

Be appreciated that the size of chip 38 and the quantity of chip join dish 40 are not keys of the present invention, illustrate as just an example of preferred embodiment.Be appreciated that, the quantity of the size of configuring chip 38 and chip join dish 40 or position are set to allow described bond pad 40 across aiming at the conductive strips of wire 24 on the corresponding gap between the wire belt 30, and described wire belt 30 is connected to the bond pad of described chip 38.For example, there is the chip 38 of two bond pads 40 can be connected to the continuous metal silk ribbon 30 that comes from delegation's wire 24.And, as shown in Figure 2, there is the chip 38 of four bond pads 40 can preferably be connected respectively to the continuous metal silk ribbon 30 that comes from two row metal silks 24 of separation.In other words, the quantity and the configuration of the bond pad on the wire line number that it will be understood by those skilled in the art that embedded polymer thing thin slice 18 and the chip 38 that is connected to wire 24 are consistent.In addition, preferably wire is not crossed bond pad on the chip.

Described chip docking station 36 (Fig. 1) is placed on chip 38 or circuit on the wire belt 30 of being isolated by non-conductive gap 32, with the chip belt 42 that is formed with wire embedded bridge.The wire embedded bridge of described preferred embodiment comprises with continuous technology and embeds and be molded over continuous wire belt 30 in the described polymer flake 18.Wire embedded bridge is configured to be connected to chip 38 or circuit to form the chip belt that wire is embedded into the polymer flake that is used for protecting.Described wire embedded bridge also can form the idol level antenna that is used in combination with chip 38.

Preferably, described chip 38 is also firm is pressed into polymer flake 18, and the bottom of filling chip is to increase the stability of belt body and chip, so that chip belt can bending in downstream process and when using as final products.The embodiment of chip belt and/or wire embedded bridge is shown in Fig. 2 A-4.For example, Fig. 3 is the side broken section exploded view of chip belt 42 shown in Figure 1.In Fig. 3, polymer flake 18 is packed wire 30 into, and described wire and polymer flake are on identical plane.Because polymer flake 18 is not melted or cuts, only cutting metal wire is preferably very close to each other on the polymer flake 18.

As shown in Figure 3, chip 38 is configured on the gap 32 between the continuous wire belt 30, so that the bond pad of chip 40 is electrically connected with wire belt.In this manner, chip 38 bridge gap 32, and be connected with wire belt 30 conduction.Fig. 4 is the sectional side view of chip belt 42 shown in Figure 3.Same, Fig. 4 shows the wire belt 30 of the bond pad 40 that is embedded into polymer flake 18 and is connected to chip 38.In order to help a chip 38 reliably to be connected in the embedded metal silk ribbon 30, described chip uses preferably that known pressure sintering engages chip in the flip chip bonding connection technology with wire.This technology has strengthened the security and the stability of electric conductivity and mechanical bond.

Fig. 2 A is the stereogram of the chip belt (having omitted polymer flake 18) in production equipment 10 and Fig. 1,2,3 and 4 technologies of describing.Fig. 2 and Fig. 2 A can find out better that described wire belt is calibrated one section predetermined distance of unit 26 lateral separation so that aim at the bond pad 40 of chip 38.Be not limited to special theory, shown in Fig. 2 A-4 as described in the bond pad 40 of chip 38 (for example, flip-chip) from the lateral bias internal of chip.But, other positions that bond pad 40 can be located at described chip (for example, the outside, near the outside), and for example by increasing or reduce distance between each row metal silk, alignment unit 26 belt body of wire 24 is departed from and with the aligned in position of bond pad.

As mentioned above, described production equipment 10 comprises splitting station 28, and this splitting station 28 is cut into wire belt 30 to wire 24 and with non-conductive gap 32 wire belt is separated.Described gap 32 is formed between the continuous wire belt 30, and optionally recharges described gap to prevent electric problem with described polymer, is connected to the chip short circuit of continuous metal silk ribbon when for example using.Described gap 32 can form by several different methods, and the invention is not restricted to any method.Describe the implementation method that is used to form non-conductive gap in detail below in conjunction with Fig. 5-9.

Fig. 5 and 6 is illustrated in first method for optimizing that produces non-conductive gap 32 between the continuous metal silk ribbon 30.In this embodiment, described splitting station 28 comprises a shearing station and the station, formation gap with roller 48,50,52,54 with roller 44,46.All rollers 44,46,48,50,52,54 are to small part contact embedded metal silk 24 and/or polymer flake 18, and rotation is so that help to advance described embedded metal silk/polymer flake at the direction upper roller of machine direction 20.Example as shown in Figure 5 and Figure 6, described roller 44,48,52 is being rotated counterclockwise as arrow 56 indicated directions, and roller 46,50,54 is turning clockwise as arrow 58 indicated directions.Be not limited to particular theory, unless following have explanation in addition, described roller is preferably by allowing described roller to roll on described machine direction 20 and/or promoting rubber, plastics or the metal of described embedded metal silk and polymer flake to form.

Remain referring to Fig. 5 and Fig. 6, roller 44 comprises a mechanical shearing portion, blade 60 for example, and its periphery from roller stretches out to form a sharp edges 62., when wire along with polymer flake 18 during along machine direction 20 continuous motions, blade 60 is suitable for along with roller 44 rotates together, with 24 handing-over of embedded metal silk and cut off embedded metal silk 24.Preferably, described blade extends certain-length from the outside of roller 44, and this length allows described blade to cut off wire 24 and do not cut off and surround polymer flake 18 wiry, makes that the integrality of polymer flake is unaffected.Described roller 46 is located at facing to the side of the polymer flake 18 of roller 44 or surface 76, is that polymer flake provides support or liner when blade 60 is cut wire 24.Therefore, described roller 44 cuts into wire belt 30 at following embedded metal silk 24 of the help of roller 46.

As mentioned above, the gap forming station of described splitting station 28 comprises roller 48,50,52,54.Described roller 48,50 is located at the opposite side of embedded metal silk/polymer flake, is suitable for clamping and advances described embedded metal silk and polymer flake continuously with even velocity.Especially, described roller 48 clamps first side 78 of the polymer flake 18 of embedded metal silk 24 and preferred close roller 48 at least, and described roller 50 clamps second side 76 of the polymer flake of close roller 50.Described roller 54 is roughly similar with 50 to roller 46, roller 54 keep the contact and on machine direction 20 at the uniform velocity to promote second side 76 near the polymer flake of roller 54.Yet the rotary speed of described roller 52 is faster than roller 48, so that the surface movement velocity of roller 52 is faster than polymer flake 18 belt speeds.In other words, roller 48 and 50 is the machinery folder point that drives connecting plate (for example, polymer flake 18) with specific speed basically, the speed of the described cutting roller 44 of this speeds match.But, roller 52 is SERVO CONTROL rollers, this SERVO CONTROL roller overdrive, and spur described polymer flake 18 faster forward than roller 56,58 last folder points by the speed of clamping connecting plate and Yin Genggao, in the position that wire 24 is cut, connecting plate slightly stretches.

Roller 52 comprises a holder 64, and this holder 64 extends from the peripheral outward radial of roller 52, is preferably a convex ridge that radially extends along the length of roller.Preferably, described holder 64 is first side 78 or surface and embedded metal silk ribbon 30 contacted unique parts of roller 52 and polymer flake 18.In other words, in this method for optimizing, described roller 52 usefulness holders 64 clamping wire belts 30; Otherwise described roller 52 is contacting metal silk or polymer flake not.Along with roller 52 with the speed rotation of---particularly roller 48---faster than other rollers, the described wire and first side 78 are drawn or advanced to first side 78 and the embedded metal silk ribbon 30 of described holder 64 contacts and clamping polymer flake 18 with next wire belt 30 faster speed of moving than the continuous velocity according to roller 48 and 50 simultaneously.By holder 64 dilatory wire belt 30 move away from next wire belt that still contacts with roller 48.This being separated in made a non-conductive gap 32 between roller 48 and 52 between the wire belt 30.When this process continues, described holder 64 separates wire belt 30 by clamping and to move each wire belt than next wire belt faster speed with next wire belt cut-out, produce the gap 32 between the continuous metal silk ribbon 30 that is embedded in the polymer flake 18.

Fig. 5 illustrates the otch 66 of the embedded metal silk of being made by blade 60 24.At t0 constantly, when otch 66 separated two parts, wire belt 68 was not connected on the wire 24.At ensuing moment t1, as shown in Figure 6, roller 44 continues its rotation, causes that blade 60 cuts off described embedded metal silk 24 and forms an otch 70 and a wire belt 72.Still referring to Fig. 6, described roller 52 continues its rotation, makes described holder 64 clamp and draw wire belt 68 away from wire belt 72, makes a non-conductive gap 32 between wire belt 68 and 72.This process continues to make non-conductive gap between the continuous wire belt 30 that advances along machine direction 20.

Be to be understood that all rollers described herein show as a whole or the embodiment at partial rotation station.Promptly, a turning base (for example can comprise at least one roller, roller 44,48,52), the a pair of roller that is oppositely arranged on polymer flake 18 (for example, roller to 44 and 46, roller to 48 and 50, roller is to 52 and 54), the described mode of roller embodiment according to here that perhaps it will be appreciated by those skilled in the art that influences any equivalent elements of the polymer flake and/or the wire 24 of continuous motion.

Second preferred embodiment of described splitting station 28 as shown in Figure 7.Especially, splitting station 28 shown in Figure 7 comprises a laser equipment 74, and this laser equipment 74 is towards the strong homogeneous beam of wire 24 periodic transmission of the embedded polymer thing thin slice 18 of continuous motion.This laser beam is cut apart wire make non-conductive gap 32 between continuous wire belt 30.That is, described laser equipment 74 emission laser beams, this laser beam cuts off wire 24 with formation wire belt 30, and fusing is exposed to the wire under the laser and makes non-conductive gap 32.

Another preferred embodiment of splitting system 28 such as Fig. 8 and shown in Figure 9.In the method, described splitting station 28 comprises the shearing station 80 and the support component that are provided with near polymer flake 18 first sides 78, for example with relative and at the roller 82 of polymer flake second side 76 settings in shearing station 80.Described shearing station 80 comprises a blade, the following laser or the cutting member that are suitable for shearing wire 24 that extend that will describe on first side 78 of polymer flake 18.Fig. 8 also illustrates roller shown in Figure 1 16 and 14A.Described roller 14A is the rolling element that substitutes roller 14 shown in Figure 1, and its purpose is similar to roller 14 with material.Described roller 14A comprises that one embeds the sweep 86 of wire 24 with above-mentioned roller 14 consistent being used to.But this roller 14A also comprises planar section 84, and this planar section 84 does not radially extend to the periphery of roller 14A sweep 86.In operation, roller 14A is with the direction rotation of arrow 88, and described sweep 86 is pressed into the wire 24 of heating in the polymer flake 18 by pushing.But flat part can not push wire in the polymer flake.The substitute is, can better find out as Fig. 9, when the flat part 84 of roller 14A during towards polymer flake 18, described wire 24 remains on the polymer flake top.The wire 24 that does not have to embed remains on the wire part 90 that polymer flake 18 tops form exposure.When roller 14A continues its rotation, described sweep 86 will be close to the wire 24 embedded polymer things of downstream wire part 90 this moment once more by extruding.

Referring to Fig. 8, when polymer flake advanced on machine direction 20, the wire part 90 of the exposure of described polymer flake 18 first sides of 80 cuttings 78 tops, described shearing station was so that make described non-conductive gap 32 and described embedded metal silk ribbon 30.On the other hand, the wire part 90 of described exposure can be etched to separate with embedded metal silk ribbon 30, and wherein the wire belt that embeds fully obtains to be protected from etching.Be not limited to particular theory, it will be understood by those skilled in the art that described shearing station 80 preferably includes a blade, laser or other first sides 78 near polymer flake 18 and is provided with so that the cutting element of the wire part 90 that cutting exposes.The open edge that has been sheared the wire belt 30 of station 80 cuttings of inventor preferably upwards screws out polymer flake 18 left, so that reliably be connected with the bond pad 40 of the chip of being placed subsequently 38.

Be not limited to particular theory, the preferred embodiments of the present invention provide the wire belt of the polymer flake that is partially submerged into continuous motion at least.Shown in Fig. 2 A, the invention discloses, be connected to independently that wire minimizes the interference parasitic capacitance between chip circuit and the antenna structure thereof to the chip join dish, connect the die to independent sky tape especially.When chip is used for higher frequency (for example, UHF or higher frequency), described effect of parasitic capacitance is bigger.When connecting the die to antenna structure, near any conductive material is all relevant, because it can cause interference capacitors, reduces the harmony frequency.Accordingly, in a preferred embodiment, wire can not crossed over each bond pad on the chip.The chip belt 42 of described production equipment and method manufacturing thereof has extra advantage, and the overlapping of current-carrying part comes minimum parasitic capacitance around the abutment between chip and the antenna structure thereof by minimizing.In fact, the preferred diameter of wire 24 minimizes further to make the conduction lap less than the diameter of the bond pad 40 of chip 38.

Be not limited to particular theory, the preferred thickness of polymer flake 18 is 50-75 microns, and the preferred diameter of wire 24 is 25-50 microns.But, be appreciated that polymer flake and size wiry are not keys of the present invention, also can use other sizes and still think within the scope of the present invention.Preferably, the thickness of polymer flake 18 is greater than the diameter of wire 24, wire 24 preferred on-insulated and by conductive material make (as, gold, aluminium, copper).

Be appreciated that the embedded metal silk ribbon that interior chip connection method of mould and equipment and institute describe and illustrate provides shown in the preferred embodiments of the present invention and in illustrated mode.In other words, theory of the present invention can be applied to various preferred embodiments easily, comprises unexposed embodiment in this.When the present invention is described in detail according to its specific embodiment,, be conspicuous to those skilled in the art without prejudice to the various changes and modifications of the described embodiment of spirit and scope of the invention.For example, Fig. 5 and holder 64 shown in Figure 6 can be that at least one stretches out block, rather than convex ridge, and each block is aimed at so that to move forward wire belt 30 than polymer flake 18 faster speed, form non-conductive gap 32 with delegation wire 24.Do not need further details, according to existing or knowledge in the future, aforementioned content illustrates other possibilities of the present invention fully, is easy to be suitable under various conditions identical method equipment.

Claims (28)

1. one kind is used to produce the production equipment that wire embeds band, and it comprises:

First turning base, described first turning base is along the continuous mobile polymer flake of machine direction;

Heating station, described heating station is used to heat the conductive strips towards the described first turning base continuous motion, when described conductive strips and polymer flake during along the machine direction continuous motion, described first turning base is the conductive strips embedded polymer thing thin slice of heating, thereby forms embedded conductive strips; And

Splitting station, described splitting station is divided into a plurality of conductive strips parts to described conductive strips along machine direction, described splitting station forms non-conductive gap between continuous conductive strips part, each continuous part of described conductive strips electrically communicates with the related circuit of bridge joint on each the non-conductive gap between each continuous part.

2. production equipment according to claim 1, it further comprises: near the alignment unit of described first turning base, described alignment unit comprises the groove that described electric conduction of heating band is aimed at polymer flake.

3. production equipment according to claim 2, wherein said alignment unit are arranged between described heating station and described first turning base.

4. production equipment according to claim 2, wherein said heating station comprises described alignment unit.

5. production equipment according to claim 2, wherein said first turning base comprises described alignment unit.

6. production equipment according to claim 1, it further comprises the chip docking station, described chip docking station is arranged on described related circuit on the non-conductive gap that is formed by described splitting station, and described related circuit is attached to continuous conductive strips part.

7. production equipment according to claim 1, wherein said splitting station comprises laser instrument, described laser instrument periodically melts the conductive strips that are embedded in along in the polymer flake of machine direction continuous motion, so that form non-conductive gap.

8. production equipment according to claim 1, wherein said splitting station comprises cutting station and gap forming station, described cutting station cuts into described a plurality of conductive strips part to the conductive strips that are embedded in the described polymer flake that move continuously along machine direction, and described gap forming station is partly separated to form non-conductive gap described continuous conductive strips.

9. production equipment according to claim 8, wherein said cutting station comprise second turning base that moves described embedded conductive strips along machine direction continuously, and described second turning base comprises the blade that cuts described conductive strips.

10. production equipment according to claim 8, wherein said gap forms the station and comprises second turning base and the 3rd turning base, described second turning base clamps the embedded conductive strips that move continuously with first speed along machine direction, described the 3rd turning base comprises quick propulsion element, described quick propulsion element periodically advances described embedded conductive strips part to move continuously with the second speed that is different from first speed along machine direction, thereby forms non-conductive gap.

11. production equipment according to claim 1, wherein said first turning base comprises first roller and second roller, described first roller is pressed in the polymer flake described conductive strips are embedded second side relative with first side of the close polymer flake that moves continuously of described second roller near first side of the described continuous polymer flake that moves and the conductive strips of heating.

12. production equipment according to claim 11, wherein said first roller periodically is pressed into the conductive strips of heating in the polymer flake so that periodically embed conductive strips, and described splitting station comprises a cut part, and the conductive strips of embedded polymer thing thin slice are not sheared to form conductive strips part and non-conductive gap in described cut part.

13. production equipment according to claim 12, wherein said cut part comprises blade.

14. production equipment according to claim 1, wherein said embedded conductive strips are along the substantially parallel pair of conductive wire that is embedded into described polymer flake of machine direction.

15. one kind is used to make the production equipment that wire embeds band, it comprises:

Be used for along the device of the continuous mobile polymer flake of machine direction;

Be used to heat device towards the continuous conductive strips that move of polymer flake;

Continuous when mobile when described conductive strips and polymer flake, be used for the conductive strips of heating are embedded into polymer flake to form the device of embedded conductive strips;

Be used for embedded conductive strips being separated into the device of conductive strips part along machine direction; And

Be used for forming between continuous conductive strips part the device in non-conductive gap, described continuous part electrically communicates with the related circuit in the described non-conductive gap of bridge joint.

16. production equipment according to claim 15, it further comprises, before the conductive strips of heating are embedded into polymer flake, is used for the device that the conductive gap of heating is aimed at polymer flake.

17. production equipment according to claim 15, it further comprises, is used for being provided with on non-conductive gap the device of related circuit, and is used for described related circuit and the device that engages near the continuous part in non-conductive gap.

18. production equipment according to claim 15, the wherein said device that is used to separate conductive strips comprise that periodically fusing is embedded into conductive strips in the polymer flake to form the device in non-conductive gap along what machine direction moved continuously.

19. production equipment according to claim 15, the wherein said device that is used to separate conductive strips comprises and is used to clamp along the device of machine direction with the embedded conductive strips of the first speed continuous motion, thereby and periodically advances described embedded conductive strips part to move the device that forms non-conductive gap along machine direction continuously with the second speed faster than first speed.

20. production equipment according to claim 15, wherein be used for the described device that the conductive strips of heating are embedded in the polymer flake is comprised, be used for the conductive strips of heating periodically are pressed into polymer flake so that the periodic device that described conductive strips are embedded, the described device that is used to separate embedded conductive strips comprises and is used to cut the conductive strips that are not embedded in the polymer flake to form the device of conductive strips part that the cutting of described conductive strips also forms non-conductive gap.

21. one kind is used to make the method that wire embeds band, comprises:

Along the continuous mobile polymer flake of machine direction;

The conductive strips that heating is moved continuously towards polymer flake;

Continuous when mobile when described conductive strips and polymer flake, the conductive strips of described heating are embedded in the polymer flake, to form embedded conductive strips;

Along machine direction embedded conductive strips are separated into the conductive strips part; And

Form non-conductive gap between continuous conductive strips part, described continuous part electrically communicates with the related circuit in the non-conductive gap of bridge joint.

22. method according to claim 21 further is included in before the conductive strips embedded polymer thing thin slice of heating the conductive strips of described heating being aimed at described polymer flake.

23. method according to claim 21 further comprises related circuit is arranged on the non-conductive gap, and near the continuous part in corresponding independent circuits and non-conductive gap is engaged.

24. method according to claim 21, the step of wherein separating described conductive strips comprise that periodically fusing is embedded into conductive strips in the polymer flake to form non-conductive gap along the machine direction continuous motion.

25. method according to claim 21, the step of wherein separating described conductive strips comprises the embedded conductive strips that clamping is moved with first speed continuously along machine direction, and periodically advance the embedded conductive strips part that moves continuously with second speed along machine direction, so that form non-conductive gap greater than first speed.

26. method according to claim 21, wherein the described step that the conductive strips of heating are embedded in the polymer flake comprises that the conductive strips of heating periodically are pressed into polymer flake forms the conductive strips that periodically embed, the described step of separating embedded conductive strips comprises that cutting is not embedded into the conductive strips in the polymer flake, so that form the conductive strips part, the cutting conductive strips also form non-conductive gap.

27. a wire embeds band, comprising:

Polymer flake, described polymer flake are suitable for moving continuously along the machine direction of the production equipment of rotation;

The pair of conductive wire, described conductive wire is embedded in the described polymer flake substantially parallel along machine direction, each paired conductive wire is split into paired conductive wire part along machine direction, the continuous part of described paired conductive wire, and is electrically come round with the related circuit in the described non-conductive gap of bridge joint by non-conductive clearance gap certain distance along machine direction.

28. wire according to claim 27 embeds band, further comprise and each paired conductive wire partly is electrical connected and each continuous part of conductive bridge between the related circuit in non-conductive gap.

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