ATE549435T1 - METHOD FOR SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUBSTRATE BY ULTRASONIC ABLATION OF A MASK ELEMENT AND DEVICE THEREFOR - Google Patents

METHOD FOR SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUBSTRATE BY ULTRASONIC ABLATION OF A MASK ELEMENT AND DEVICE THEREFOR

Info

Publication number
ATE549435T1
ATE549435T1 AT09761646T AT09761646T ATE549435T1 AT E549435 T1 ATE549435 T1 AT E549435T1 AT 09761646 T AT09761646 T AT 09761646T AT 09761646 T AT09761646 T AT 09761646T AT E549435 T1 ATE549435 T1 AT E549435T1
Authority
AT
Austria
Prior art keywords
mask element
precious metal
substrate
device therefor
selective deposition
Prior art date
Application number
AT09761646T
Other languages
German (de)
Inventor
Sylvain Rochon
Jean-Yves Hihn
Loic Hallez
Francis Touyeras
Original Assignee
C & K Components Sas
Univ Franche Comte L
Centre Nat Rech Scient
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C & K Components Sas, Univ Franche Comte L, Centre Nat Rech Scient filed Critical C & K Components Sas
Application granted granted Critical
Publication of ATE549435T1 publication Critical patent/ATE549435T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to a method for selectively depositing a precious metal (32) on a metal substrate (10), the method sequentially comprising: a masking step, consisting of depositing a mask element (16) on one treated surface (12) of the metal substrate (10); a selective ablation step, for the selective ablation of at least one removed portion (17) of the pre-deposited mask element (16) to expose at least one deposition area (18) of said treated surface (12) of the metal substrate (10); a deposition step, for depositing the precious metal (32) on said pre-exposed deposition area (18); and characterized in that the selective ablation step involves the ultrasound wave (22) irradiation of said removed portion (17) of the mask element (16) to destroy said removed portion (17). The invention also relates to an ultrasound device (20) for implementing the selective ablation step.
AT09761646T 2008-06-12 2009-06-03 METHOD FOR SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUBSTRATE BY ULTRASONIC ABLATION OF A MASK ELEMENT AND DEVICE THEREFOR ATE549435T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0853892A FR2932497B1 (en) 2008-06-12 2008-06-12 METHOD FOR THE SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUPPORT BY ULTRASONIC ABLATION OF A MASKING MEMBER AND ITS DEVICE
PCT/EP2009/056803 WO2009150083A1 (en) 2008-06-12 2009-06-03 Method for selectively depositing a precious metal on a substrate by the ultrasound ablation of a mask element, and device thereof

Publications (1)

Publication Number Publication Date
ATE549435T1 true ATE549435T1 (en) 2012-03-15

Family

ID=40210559

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09761646T ATE549435T1 (en) 2008-06-12 2009-06-03 METHOD FOR SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUBSTRATE BY ULTRASONIC ABLATION OF A MASK ELEMENT AND DEVICE THEREFOR

Country Status (4)

Country Link
EP (1) EP2283171B1 (en)
AT (1) ATE549435T1 (en)
FR (1) FR2932497B1 (en)
WO (1) WO2009150083A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210069469A (en) * 2019-12-03 2021-06-11 삼성전자주식회사 Surface pattern forming method for aluminium product

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1041769A (en) * 1965-05-19 1966-09-07 Ibm A method of applying fluid to selected areas of a workpiece and a mask for use therein
GB1521130A (en) * 1975-12-02 1978-08-16 Standard Telephones Cables Ltd Selective electro-plating etching or electro-machining
US4626323A (en) * 1985-04-10 1986-12-02 Siemens Aktiengesellschaft Method for the manufacture of a printing element for an ink droplet printing unit
US5156936A (en) * 1989-09-19 1992-10-20 U.S. Philips Corporation Contact device for the photocathode of photoelectric tubes and manufacturing method
US7091132B2 (en) * 2003-07-24 2006-08-15 Applied Materials, Inc. Ultrasonic assisted etch using corrosive liquids

Also Published As

Publication number Publication date
WO2009150083A1 (en) 2009-12-17
FR2932497A1 (en) 2009-12-18
EP2283171A1 (en) 2011-02-16
FR2932497B1 (en) 2011-03-11
EP2283171B1 (en) 2012-03-14

Similar Documents

Publication Publication Date Title
ATE491052T1 (en) METHOD FOR TREATING THE BLADE TIP OF A TURBINE BLADE AND TURBINE BLADE TREATED BY SUCH A METHOD
DE60026807D1 (en) Device and method for perforating by ultrasound
ATE466190T1 (en) METHOD AND DEVICE FOR TREATING A ROTOR BLADE ON A WIND TURBINE
SG158065A1 (en) Method and apparatus for selectively removing portions of an abradable coating using a water jet
ATE475454T1 (en) METHOD AND DEVICE FOR PROCESSING A WORKPIECE
SG137812A1 (en) Method of removing deposits
TW200631679A (en) Method and device for treating substrates and corresponding nozzle unit
DE60314051D1 (en) Method for controlling a device for treating a gas charge by pressure swing adsorption
DE602006008698D1 (en) Method and device for treating a part
DE602005023851D1 (en) DEVICE FOR TREATING THE INCIDENT OF A BODY ORGAN
DE602004022163D1 (en) DEVICE FOR TREATING AN ESTATE OF A BRANCHING VESSEL
ATE470952T1 (en) METHOD FOR CLEANING AND ETCHING A SUBSTRATE WITH A TRANSPARENT, CONDUCTIVE OXIDE LAYER AND DEVICE FOR CARRYING OUT THE METHOD
ATE471997T1 (en) DEVICE AND METHOD FOR COATING A SUBSTRATE
ATE411843T1 (en) METHOD AND DEVICE FOR TREATING A FEED GAS
SG150421A1 (en) Method of forming thin film metal conductive lines
ATE509732T1 (en) METHOD FOR SURFACE DOPPING
SG131052A1 (en) Substrate processing method
TW200505617A (en) Method and apparatus for removing an edge region of a layer applied to a substrate and for coating a substrate and a substrate
ATE472620T1 (en) METHOD FOR PRODUCING A DETACHABLE SUBSTRATE
ATE510629T1 (en) COVERING ARTICLE AND METHOD FOR COVERING A SUBSTRATE TO BE COATED
ATE505970T1 (en) DEVICE AND METHOD FOR CLEANING AN ELECTRIC HAIR CUTTER AND SET COMPRISING SUCH DEVICE
DE112021002686A5 (en) Device for irradiating a substrate
ATE549435T1 (en) METHOD FOR SELECTIVE DEPOSITION OF A PRECIOUS METAL ON A SUBSTRATE BY ULTRASONIC ABLATION OF A MASK ELEMENT AND DEVICE THEREFOR
ATE402991T1 (en) METHOD FOR TREATING A SURFACE
WO2011057816A3 (en) Method for spatially resolving the enlargement of nanoparticles on a substrate surface