ATE544153T1 - Magnetischer speicher mit wärmeunterstütztem schreibverfahren und niedrigem schreibstrom - Google Patents

Magnetischer speicher mit wärmeunterstütztem schreibverfahren und niedrigem schreibstrom

Info

Publication number
ATE544153T1
ATE544153T1 AT09290340T AT09290340T ATE544153T1 AT E544153 T1 ATE544153 T1 AT E544153T1 AT 09290340 T AT09290340 T AT 09290340T AT 09290340 T AT09290340 T AT 09290340T AT E544153 T1 ATE544153 T1 AT E544153T1
Authority
AT
Austria
Prior art keywords
ferromagnetic
layer
tunnel junction
write current
magnetic tunnel
Prior art date
Application number
AT09290340T
Other languages
English (en)
Inventor
Ioan Lucian Prejbeanu
Original Assignee
Crocus Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crocus Technology filed Critical Crocus Technology
Application granted granted Critical
Publication of ATE544153T1 publication Critical patent/ATE544153T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/329—Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1675—Writing or programming circuits or methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
AT09290340T 2009-05-08 2009-05-08 Magnetischer speicher mit wärmeunterstütztem schreibverfahren und niedrigem schreibstrom ATE544153T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09290340A EP2249350B1 (de) 2009-05-08 2009-05-08 Magnetischer Speicher mit wärmeunterstütztem Schreibverfahren und niedrigem Schreibstrom

Publications (1)

Publication Number Publication Date
ATE544153T1 true ATE544153T1 (de) 2012-02-15

Family

ID=41226828

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09290340T ATE544153T1 (de) 2009-05-08 2009-05-08 Magnetischer speicher mit wärmeunterstütztem schreibverfahren und niedrigem schreibstrom

Country Status (4)

Country Link
US (1) US8385107B2 (de)
EP (1) EP2249350B1 (de)
JP (1) JP5653650B2 (de)
AT (1) ATE544153T1 (de)

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EP2466586B1 (de) * 2010-12-16 2016-03-02 Crocus Technology Magnetische Multibit-Direktzugriffsspeicherzelle mit verbessertem Lesebereich
EP2479759A1 (de) 2011-01-19 2012-07-25 Crocus Technology S.A. Stromsparende Magnetdirektzugriffsspeicherzelle
US8472240B2 (en) 2011-05-16 2013-06-25 Micron Technology, Inc. Spin torque transfer memory cell structures and methods
US8611141B2 (en) * 2011-09-21 2013-12-17 Crocus Technology Inc. Magnetic random access memory devices including heating straps
US8611140B2 (en) 2011-09-21 2013-12-17 Crocus Technology Inc. Magnetic random access memory devices including shared heating straps
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EP2615610B1 (de) * 2012-01-16 2016-11-02 Crocus Technology S.A. MRAM-Zelle und Verfahren zum Beschreiben einer MRAM-Zelle unter Verwendung einer wärmeunterstützten Schreiboperation mit reduziertem Feldstrom
US9007818B2 (en) 2012-03-22 2015-04-14 Micron Technology, Inc. Memory cells, semiconductor device structures, systems including such cells, and methods of fabrication
FR2989211B1 (fr) * 2012-04-10 2014-09-26 Commissariat Energie Atomique Dispositif magnetique a ecriture assistee thermiquement
EP2672488B1 (de) 2012-06-08 2015-08-19 Crocus Technology S.A. MRAM-Element mit verbesserter Datenspeicherung und geringer Schreibtemperatur
US8923038B2 (en) 2012-06-19 2014-12-30 Micron Technology, Inc. Memory cells, semiconductor device structures, memory systems, and methods of fabrication
US9054030B2 (en) 2012-06-19 2015-06-09 Micron Technology, Inc. Memory cells, semiconductor device structures, memory systems, and methods of fabrication
US8913422B2 (en) * 2012-09-28 2014-12-16 Intel Corporation Decreased switching current in spin-transfer torque memory
US8947915B2 (en) * 2012-12-17 2015-02-03 International Business Machines Corporation Thermal spin torqure transfer magnetoresistive random access memory
US9379315B2 (en) 2013-03-12 2016-06-28 Micron Technology, Inc. Memory cells, methods of fabrication, semiconductor device structures, and memory systems
US8971103B2 (en) * 2013-03-13 2015-03-03 International Business Machines Corporation Thermally-assisted MRAM with ferromagnetic layers with temperature dependent magnetization
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US9368714B2 (en) 2013-07-01 2016-06-14 Micron Technology, Inc. Memory cells, methods of operation and fabrication, semiconductor device structures, and memory systems
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US9331123B2 (en) * 2014-05-09 2016-05-03 Tower Semiconductor Ltd. Logic unit including magnetic tunnel junction elements having two different anti-ferromagnetic layers
US9524765B2 (en) * 2014-08-15 2016-12-20 Qualcomm Incorporated Differential magnetic tunnel junction pair including a sense layer with a high coercivity portion
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JP6888783B2 (ja) * 2015-07-24 2021-06-16 国立大学法人 東京大学 メモリ素子
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Also Published As

Publication number Publication date
EP2249350A1 (de) 2010-11-10
EP2249350B1 (de) 2012-02-01
JP5653650B2 (ja) 2015-01-14
JP2010263221A (ja) 2010-11-18
US8385107B2 (en) 2013-02-26
US20110110151A1 (en) 2011-05-12

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