ATE540997T1 - Harz zur kapselung eines optischen halbleiterelements mit polyimid und damit erhaltene optische halbleitervorrichtung - Google Patents
Harz zur kapselung eines optischen halbleiterelements mit polyimid und damit erhaltene optische halbleitervorrichtungInfo
- Publication number
- ATE540997T1 ATE540997T1 AT08019283T AT08019283T ATE540997T1 AT E540997 T1 ATE540997 T1 AT E540997T1 AT 08019283 T AT08019283 T AT 08019283T AT 08019283 T AT08019283 T AT 08019283T AT E540997 T1 ATE540997 T1 AT E540997T1
- Authority
- AT
- Austria
- Prior art keywords
- optical semiconductor
- resin
- polyimide
- semiconductor device
- encapsulating
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000004642 Polyimide Substances 0.000 title abstract 3
- 229920001721 polyimide Polymers 0.000 title abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 abstract 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 abstract 1
- -1 aliphatic diamine compound Chemical class 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- 238000012643 polycondensation polymerization Methods 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007292310A JP2009114415A (ja) | 2007-11-09 | 2007-11-09 | ポリイミドを含む光半導体素子封止用樹脂およびそれを用いて得られる光半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE540997T1 true ATE540997T1 (de) | 2012-01-15 |
Family
ID=40386473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT08019283T ATE540997T1 (de) | 2007-11-09 | 2008-11-04 | Harz zur kapselung eines optischen halbleiterelements mit polyimid und damit erhaltene optische halbleitervorrichtung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7829967B2 (de) |
| EP (1) | EP2058354B1 (de) |
| JP (1) | JP2009114415A (de) |
| KR (1) | KR20090048367A (de) |
| CN (1) | CN101429278B (de) |
| AT (1) | ATE540997T1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101292886B1 (ko) | 2009-09-29 | 2013-08-02 | 코오롱인더스트리 주식회사 | 내용제성이 개선된 무색투명한 폴리이미드 필름 |
| US10619008B2 (en) * | 2014-04-25 | 2020-04-14 | Polyone Corporation | Aliphatic polyimides from unsaturated monoanhydride or unsaturated diacid reacted with both monoamine and diamine |
| US9315633B2 (en) * | 2014-08-29 | 2016-04-19 | The Boeing Company | Nanomodified backbones for polyimides with difunctional and mixed-functionality endcaps |
| TWI658067B (zh) * | 2017-11-24 | 2019-05-01 | 台虹科技股份有限公司 | 聚醯亞胺前驅物及其所製得之微影圖案 |
| CN113677741B (zh) * | 2019-04-02 | 2023-10-20 | 日本化药株式会社 | 双马来酰亚胺化合物、使用其的感光性树脂组成物、其硬化物及半导体组件 |
| JP7596091B2 (ja) * | 2019-08-01 | 2024-12-09 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| JP7563912B2 (ja) * | 2019-08-01 | 2024-10-08 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| JP7563913B2 (ja) * | 2019-08-01 | 2024-10-08 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
| JP7351396B1 (ja) | 2022-12-12 | 2023-09-27 | 東洋インキScホールディングス株式会社 | 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680842B2 (ja) | 1986-06-27 | 1994-10-12 | 日東電工株式会社 | 光半導体装置 |
| JPH07309927A (ja) | 1994-05-17 | 1995-11-28 | Nitto Denko Corp | 光半導体装置 |
| JP3257325B2 (ja) | 1995-01-31 | 2002-02-18 | ジェイエスアール株式会社 | ポリイミド系共重合体の製造方法、薄膜形成剤、並びに液晶配向膜の製造方法 |
| JPH1160732A (ja) * | 1997-08-27 | 1999-03-05 | Hitachi Chem Co Ltd | ポリイミド系樹脂及びこれを用いた光学用素子 |
| US6489431B1 (en) * | 1998-10-13 | 2002-12-03 | Nissan Chemical Industries, Ltd. | Polyimide precursors and polyimides |
| US20030129379A1 (en) * | 1999-04-23 | 2003-07-10 | Shigeru Yao | Porous insulating film and its laminates |
| US7023019B2 (en) * | 2001-09-03 | 2006-04-04 | Matsushita Electric Industrial Co., Ltd. | Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device |
| JP4375533B2 (ja) * | 2003-06-26 | 2009-12-02 | 三菱瓦斯化学株式会社 | 溶媒可溶性ポリイミドの製造方法 |
| US7129318B2 (en) | 2003-09-02 | 2006-10-31 | I.S.T. (Ma) Corporation | RTM and RI processable polyimide resins |
| KR100666265B1 (ko) * | 2004-10-18 | 2007-01-09 | 엘지이노텍 주식회사 | 형광체 및 이를 이용한 발광소자 |
| JP4858678B2 (ja) * | 2005-05-24 | 2012-01-18 | ソニーケミカル&インフォメーションデバイス株式会社 | エステル基含有ポリ(イミド−アゾメチン)共重合体、エステル基含有ポリ(アミド酸−アゾメチン)共重合体及びポジ型感光性樹脂組成物 |
| DE502007000472D1 (de) | 2006-04-12 | 2009-04-16 | Ems Chemie Ag | Anschlussvorrichtung für ein Rohr |
| EP2039716B1 (de) * | 2006-07-07 | 2012-02-22 | Mitsubishi Gas Chemical Company, Inc. | Polyimidharz |
| JP4802934B2 (ja) * | 2006-08-18 | 2011-10-26 | 新日本理化株式会社 | 脂環系ポリイミド共重合体及びその製造方法 |
-
2007
- 2007-11-09 JP JP2007292310A patent/JP2009114415A/ja active Pending
-
2008
- 2008-10-28 US US12/259,317 patent/US7829967B2/en not_active Expired - Fee Related
- 2008-11-04 EP EP08019283A patent/EP2058354B1/de not_active Not-in-force
- 2008-11-04 AT AT08019283T patent/ATE540997T1/de active
- 2008-11-07 CN CN2008101744865A patent/CN101429278B/zh not_active Expired - Fee Related
- 2008-11-07 KR KR1020080110601A patent/KR20090048367A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090048367A (ko) | 2009-05-13 |
| US7829967B2 (en) | 2010-11-09 |
| EP2058354A3 (de) | 2009-09-30 |
| JP2009114415A (ja) | 2009-05-28 |
| US20090121255A1 (en) | 2009-05-14 |
| CN101429278B (zh) | 2012-02-08 |
| EP2058354B1 (de) | 2012-01-11 |
| CN101429278A (zh) | 2009-05-13 |
| EP2058354A2 (de) | 2009-05-13 |
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