ATE530886T1 - Drucksensor und herstellungsverfahren für den sensor - Google Patents
Drucksensor und herstellungsverfahren für den sensorInfo
- Publication number
- ATE530886T1 ATE530886T1 AT08152807T AT08152807T ATE530886T1 AT E530886 T1 ATE530886 T1 AT E530886T1 AT 08152807 T AT08152807 T AT 08152807T AT 08152807 T AT08152807 T AT 08152807T AT E530886 T1 ATE530886 T1 AT E530886T1
- Authority
- AT
- Austria
- Prior art keywords
- sensor
- diaphragm
- production method
- circuit board
- pressure sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065164A JP4383461B2 (ja) | 2007-03-14 | 2007-03-14 | センサ及びセンサの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE530886T1 true ATE530886T1 (de) | 2011-11-15 |
Family
ID=39473960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08152807T ATE530886T1 (de) | 2007-03-14 | 2008-03-14 | Drucksensor und herstellungsverfahren für den sensor |
Country Status (4)
Country | Link |
---|---|
US (1) | US7581448B2 (de) |
EP (1) | EP1970686B1 (de) |
JP (1) | JP4383461B2 (de) |
AT (1) | ATE530886T1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008052244A1 (de) * | 2008-10-18 | 2010-04-22 | Carl Freudenberg Kg | Flexible Leiterplatte |
KR101017304B1 (ko) | 2008-12-10 | 2011-03-02 | 이성기 | 상용자동차용 압력센서의 제조방법 |
JP4790033B2 (ja) * | 2009-02-17 | 2011-10-12 | 長野計器株式会社 | センサ |
US8286496B2 (en) | 2009-02-17 | 2012-10-16 | Nagano Keiki Co., Ltd. | Fluid pressure sensor incorporating flexible circuit board |
CN102130676A (zh) * | 2010-01-14 | 2011-07-20 | 鸿富锦精密工业(深圳)有限公司 | 键盘 |
EP2783395A4 (de) * | 2011-11-23 | 2015-09-02 | S3C Inc | Mechanische verpackungstechnik zur befestigung von mems- und flexiblen schaltungen |
US9804002B2 (en) * | 2013-09-04 | 2017-10-31 | Cameron International Corporation | Integral sensor |
US20160033348A1 (en) * | 2014-07-30 | 2016-02-04 | Yi-Lin Motor Parts Co., Ltd. | Pressure transducer |
JP6163148B2 (ja) * | 2014-11-20 | 2017-07-12 | 長野計器株式会社 | 圧力センサ |
EP3239680B1 (de) * | 2014-12-24 | 2020-01-15 | Fujikura Ltd. | Drucksensor und drucksensormodul |
WO2018155915A1 (ko) * | 2017-02-22 | 2018-08-30 | 타이코에이엠피 주식회사 | 압력 센서 |
EP3961175A4 (de) | 2019-04-26 | 2022-06-22 | Nagano Keiki Co., Ltd. | Drucksensor |
US11598684B1 (en) | 2021-05-14 | 2023-03-07 | Precis Llc | Thickness-shear mode resonators |
IT202100018923A1 (it) * | 2021-07-16 | 2023-01-16 | Dinamica Generale S P A | Adattatore per estensimetri. |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS616848A (ja) | 1984-06-20 | 1986-01-13 | Nec Corp | 配線基板 |
EP0922946B1 (de) * | 1997-12-11 | 2003-06-25 | Nagano Keiki Co., Ltd. | Druckwandler |
EP1455165A1 (de) * | 2003-03-07 | 2004-09-08 | Intersema Sensoric SA | Miniaturisierter Sensor |
JP2005326337A (ja) | 2004-05-17 | 2005-11-24 | Denso Corp | 圧力検出装置 |
JP2006038824A (ja) | 2004-06-25 | 2006-02-09 | Nippon Seiki Co Ltd | 半導体センサ装置 |
-
2007
- 2007-03-14 JP JP2007065164A patent/JP4383461B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-13 US US12/047,513 patent/US7581448B2/en not_active Expired - Fee Related
- 2008-03-14 AT AT08152807T patent/ATE530886T1/de not_active IP Right Cessation
- 2008-03-14 EP EP08152807A patent/EP1970686B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
US7581448B2 (en) | 2009-09-01 |
JP2008224512A (ja) | 2008-09-25 |
EP1970686A3 (de) | 2010-06-30 |
EP1970686B1 (de) | 2011-10-26 |
EP1970686A2 (de) | 2008-09-17 |
JP4383461B2 (ja) | 2009-12-16 |
US20080223142A1 (en) | 2008-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |