ATE520143T1 - Sputter-target mit langsamsputter-schicht unter targetmaterial - Google Patents

Sputter-target mit langsamsputter-schicht unter targetmaterial

Info

Publication number
ATE520143T1
ATE520143T1 AT06785376T AT06785376T ATE520143T1 AT E520143 T1 ATE520143 T1 AT E520143T1 AT 06785376 T AT06785376 T AT 06785376T AT 06785376 T AT06785376 T AT 06785376T AT E520143 T1 ATE520143 T1 AT E520143T1
Authority
AT
Austria
Prior art keywords
target
sputter
slow
sputtering
layer under
Prior art date
Application number
AT06785376T
Other languages
English (en)
Inventor
Raymond M Mayer
Yiwei Lu
Original Assignee
Guardian Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guardian Industries filed Critical Guardian Industries
Application granted granted Critical
Publication of ATE520143T1 publication Critical patent/ATE520143T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
AT06785376T 2005-06-22 2006-06-21 Sputter-target mit langsamsputter-schicht unter targetmaterial ATE520143T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/158,407 US20060289304A1 (en) 2005-06-22 2005-06-22 Sputtering target with slow-sputter layer under target material
PCT/US2006/024371 WO2007002330A1 (en) 2005-06-22 2006-06-21 Sputtering target with slow-sputter layer under target material

Publications (1)

Publication Number Publication Date
ATE520143T1 true ATE520143T1 (de) 2011-08-15

Family

ID=37311923

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06785376T ATE520143T1 (de) 2005-06-22 2006-06-21 Sputter-target mit langsamsputter-schicht unter targetmaterial

Country Status (7)

Country Link
US (1) US20060289304A1 (de)
EP (1) EP1913624B1 (de)
AT (1) ATE520143T1 (de)
CA (1) CA2611345A1 (de)
ES (1) ES2370259T3 (de)
PL (1) PL1913624T3 (de)
WO (1) WO2007002330A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0713450D0 (en) * 2007-07-12 2007-08-22 Materia Nova Magnetron co-sputtering device
GB2461094B (en) * 2008-06-20 2012-08-22 Mantis Deposition Ltd Deposition of materials
US20100025229A1 (en) * 2008-07-30 2010-02-04 Guardian Industries Corp. Apparatus and method for sputtering target debris reduction
TWI641292B (zh) 2008-08-04 2018-11-11 Ａｇｃ北美平面玻璃公司 電漿源
US20100044222A1 (en) * 2008-08-21 2010-02-25 Guardian Industries Corp., Sputtering target including magnetic field uniformity enhancing sputtering target backing tube
DE102010038796B4 (de) * 2010-08-02 2014-02-20 Von Ardenne Anlagentechnik Gmbh Dünnschichtsolarzelle und Verfahren zu ihrer Herstellung
JP6037734B2 (ja) * 2012-09-07 2016-12-07 三菱重工工作機械株式会社 常温接合装置および常温接合方法
KR102177208B1 (ko) * 2013-07-25 2020-11-11 삼성디스플레이 주식회사 스퍼터링 시스템과, 이를 이용한 디스플레이 장치의 제조 방법
KR102272311B1 (ko) 2014-12-05 2021-07-06 에이쥐씨 글래스 유럽 중공형 음극 플라즈마 소스
US10755901B2 (en) 2014-12-05 2020-08-25 Agc Flat Glass North America, Inc. Plasma source utilizing a macro-particle reduction coating and method of using a plasma source utilizing a macro-particle reduction coating for deposition of thin film coatings and modification of surfaces
US9721764B2 (en) 2015-11-16 2017-08-01 Agc Flat Glass North America, Inc. Method of producing plasma by multiple-phase alternating or pulsed electrical current
US9721765B2 (en) 2015-11-16 2017-08-01 Agc Flat Glass North America, Inc. Plasma device driven by multiple-phase alternating or pulsed electrical current
US10242846B2 (en) 2015-12-18 2019-03-26 Agc Flat Glass North America, Inc. Hollow cathode ion source
US10573499B2 (en) 2015-12-18 2020-02-25 Agc Flat Glass North America, Inc. Method of extracting and accelerating ions
CN113001114B (zh) * 2021-03-01 2023-12-29 宁波江丰电子材料股份有限公司 一种旋转靶材溅射面的车削方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2933835A1 (de) * 1979-08-21 1981-03-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum befestigen von in scheiben- oder plattenform vorliegenden targetmaterialien auf kuehlteller fuer aufstaeubanlagen
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US5354446A (en) * 1988-03-03 1994-10-11 Asahi Glass Company Ltd. Ceramic rotatable magnetron sputtering cathode target and process for its production
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
EP0543931A4 (en) * 1990-08-10 1993-09-08 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
JPH0586462A (ja) * 1991-06-28 1993-04-06 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
WO1997008359A1 (fr) * 1995-08-23 1997-03-06 Asahi Glass Company Ltd. Cible, son procede de production et procede de formation d'une couche tres refringente
JPH1129858A (ja) * 1997-07-14 1999-02-02 Mitsubishi Chem Corp スパッタリングターゲット
DE60023176T2 (de) * 1999-12-03 2006-06-14 Bekaert Sa Nv Sputtertarget und verfahren zur herstellung eines solchen targets
KR20030024868A (ko) * 2000-08-17 2003-03-26 토소우 에스엠디, 인크 수명-종료-표시를 갖는 고순도 스퍼터 타켓과 이의 제조방법
WO2002020866A1 (fr) * 2000-09-08 2002-03-14 Asahi Glass Company, Limited Cible cylindrique et procede de fabrication de ladite cible
AU9304201A (en) 2000-09-25 2002-04-08 Cardinal Cg Co Improved sputtering target and methods of making and using same
US20040115362A1 (en) * 2002-01-14 2004-06-17 Klause Hartig Photocatalytic sputtering targets and methods for the production and use thereof
US20040074770A1 (en) * 2002-07-02 2004-04-22 George Wityak Rotary target
AU2003284294A1 (en) * 2002-10-21 2004-05-13 Cabot Corporation Method of forming a sputtering target assembly and assembly made therefrom
US7014741B2 (en) * 2003-02-21 2006-03-21 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron with self cleaning target
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target

Also Published As

Publication number Publication date
EP1913624B1 (de) 2011-08-10
PL1913624T3 (pl) 2012-01-31
EP1913624A1 (de) 2008-04-23
US20060289304A1 (en) 2006-12-28
CA2611345A1 (en) 2007-01-04
WO2007002330A1 (en) 2007-01-04
ES2370259T3 (es) 2011-12-14

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