ATE518415T1 - Passives leitfähiges kühlmodul - Google Patents

Passives leitfähiges kühlmodul

Info

Publication number
ATE518415T1
ATE518415T1 AT07795751T AT07795751T ATE518415T1 AT E518415 T1 ATE518415 T1 AT E518415T1 AT 07795751 T AT07795751 T AT 07795751T AT 07795751 T AT07795751 T AT 07795751T AT E518415 T1 ATE518415 T1 AT E518415T1
Authority
AT
Austria
Prior art keywords
cooling module
bladder
circuit card
electronic circuit
conductive cooling
Prior art date
Application number
AT07795751T
Other languages
English (en)
Inventor
Timothy Glahn
Robert G Kurtz Jr
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ATE518415T1 publication Critical patent/ATE518415T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT07795751T 2006-06-26 2007-06-05 Passives leitfähiges kühlmodul ATE518415T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/426,435 US7952873B2 (en) 2006-06-26 2006-06-26 Passive conductive cooling module
PCT/US2007/013227 WO2008002380A2 (en) 2006-06-26 2007-06-05 Passive conductive cooling module

Publications (1)

Publication Number Publication Date
ATE518415T1 true ATE518415T1 (de) 2011-08-15

Family

ID=38846157

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07795751T ATE518415T1 (de) 2006-06-26 2007-06-05 Passives leitfähiges kühlmodul

Country Status (7)

Country Link
US (1) US7952873B2 (de)
EP (1) EP2033502B1 (de)
JP (1) JP5395661B2 (de)
KR (1) KR101510093B1 (de)
AT (1) ATE518415T1 (de)
TW (1) TWI411382B (de)
WO (1) WO2008002380A2 (de)

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US8441793B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal rack backplane system
US8411440B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Cooled universal hardware platform
US8410364B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Universal rack cable management system
US8441792B2 (en) * 2010-07-21 2013-05-14 Birchbridge Incorporated Universal conduction cooling platform
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US9649150B2 (en) 2010-11-05 2017-05-16 Ethicon Endo-Surgery, Llc Selective activation of electronic components in medical device
US9421062B2 (en) 2010-11-05 2016-08-23 Ethicon Endo-Surgery, Llc Surgical instrument shaft with resiliently biased coupling to handpiece
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US10959769B2 (en) 2010-11-05 2021-03-30 Ethicon Llc Surgical instrument with slip ring assembly to power ultrasonic transducer
US9597143B2 (en) 2010-11-05 2017-03-21 Ethicon Endo-Surgery, Llc Sterile medical instrument charging device
US20120116265A1 (en) 2010-11-05 2012-05-10 Houser Kevin L Surgical instrument with charging devices
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US9782215B2 (en) 2010-11-05 2017-10-10 Ethicon Endo-Surgery, Llc Surgical instrument with ultrasonic transducer having integral switches
US9526921B2 (en) 2010-11-05 2016-12-27 Ethicon Endo-Surgery, Llc User feedback through end effector of surgical instrument
US9039720B2 (en) 2010-11-05 2015-05-26 Ethicon Endo-Surgery, Inc. Surgical instrument with ratcheting rotatable shaft
US9510895B2 (en) 2010-11-05 2016-12-06 Ethicon Endo-Surgery, Llc Surgical instrument with modular shaft and end effector
US10085792B2 (en) 2010-11-05 2018-10-02 Ethicon Llc Surgical instrument with motorized attachment feature
FR2977949B1 (fr) * 2011-07-11 2015-10-16 Airbus Operations Sas Systeme electronique comportant un dispositif de refroidissement expansible integre
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
US20130153187A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Dual Heat Sinks For Distributing A Thermal Load
JP5761448B2 (ja) * 2012-03-19 2015-08-12 富士通株式会社 発熱装置の冷却装置
GB2507958B (en) * 2012-11-08 2017-04-05 Cybula Ltd Computing devices that both intercommunicate and receive power by wireless methods
CA2800056A1 (en) 2012-12-24 2014-06-24 Nova Chemicals Corporation Polyethylene blend compositions
CN203327457U (zh) * 2013-05-20 2013-12-04 中兴通讯股份有限公司 一种散热装置
CN104345848B (zh) * 2013-08-09 2017-11-21 英业达科技有限公司 服务器及其散热系统
WO2015064240A1 (ja) * 2013-10-29 2015-05-07 ポリマテック・ジャパン株式会社 液体封入放熱部材
ITUD20130151A1 (it) * 2013-11-15 2015-05-16 Eurotech S P A Architettura di supercalcolo modulare
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US10136938B2 (en) 2014-10-29 2018-11-27 Ethicon Llc Electrosurgical instrument with sensor
DE102014224989A1 (de) * 2014-12-05 2016-06-09 Siemens Aktiengesellschaft Kühlvorrichtung zur Kühlung eines elektrischen Geräts
FR3030999B1 (fr) * 2014-12-19 2019-05-17 Airbus Operations (S.A.S.) Procede et dispositif de refroidissement d'un equipement pourvu de cartes electroniques utilisant au moins une carte distincte de refroidissement par fluide
EP3274034B1 (de) 2015-03-25 2021-02-24 ResMed Pty Ltd Patientenschnittstelle mit preventergarnitur für dichtungsformendes teil
US10098241B2 (en) 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
US9760134B1 (en) * 2016-02-25 2017-09-12 Raytheon Company Hydraulic card retainer
US11140780B2 (en) * 2019-06-10 2021-10-05 Mellanox Technologies, Ltd. Networking cards with increased performance
US10736218B1 (en) * 2019-06-10 2020-08-04 Mellanox Technologies, Ltd. Networking cards with increased thermal performance
EP3771644A1 (de) 2019-07-29 2021-02-03 General Electric Company Fahrzeugwärmetauschersystem
CN112543575B (zh) * 2019-09-23 2022-03-04 上海微电子装备（集团）股份有限公司 一种板卡插接模组及电控盒
DE102019215336A1 (de) 2019-10-07 2021-04-08 Mahle International Gmbh Temperiereinrichtung zum Temperieren einer elektrischen Vorrichtung
DE102020104327A1 (de) 2020-02-19 2021-08-19 Audi Aktiengesellschaft Elektronischer Schaltungskreis mit einem Kühlsystem sowie Kühleinheit für das Kühlsystem und Kraftfahrzeug mit einem Schaltungskreis
US12052847B2 (en) 2020-03-09 2024-07-30 Raytheon Company Aligned multi-rail high-power cooling module
CN113423249B (zh) * 2021-07-06 2022-07-22 深圳市特发信息技术服务有限公司 一种模块化集装箱式数据中心机房
DE102021209640A1 (de) 2021-09-01 2023-03-02 Continental Automotive Technologies GmbH Kühlvorrichtung, Kühlanordnung, Steuereinrichtung sowie Racksystem
BE1031101B1 (de) * 2022-12-02 2024-07-01 Phoenix Contact Gmbh & Co Technik zum Wärmetauschen

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Also Published As

Publication number Publication date
US7952873B2 (en) 2011-05-31
JP2009542031A (ja) 2009-11-26
JP5395661B2 (ja) 2014-01-22
TW200814917A (en) 2008-03-16
KR101510093B1 (ko) 2015-04-08
TWI411382B (zh) 2013-10-01
WO2008002380A3 (en) 2008-03-13
KR20090025363A (ko) 2009-03-10
EP2033502B1 (de) 2011-07-27
US20070297137A1 (en) 2007-12-27
WO2008002380A2 (en) 2008-01-03
EP2033502A2 (de) 2009-03-11

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties