JP5395661B2 - 受動の伝導冷却モジュール - Google Patents
受動の伝導冷却モジュール Download PDFInfo
- Publication number
- JP5395661B2 JP5395661B2 JP2009518136A JP2009518136A JP5395661B2 JP 5395661 B2 JP5395661 B2 JP 5395661B2 JP 2009518136 A JP2009518136 A JP 2009518136A JP 2009518136 A JP2009518136 A JP 2009518136A JP 5395661 B2 JP5395661 B2 JP 5395661B2
- Authority
- JP
- Japan
- Prior art keywords
- bladder
- coolant
- disposed
- cooling module
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (5)
- 伝熱冷却されたシャーシ(30)と、
前記伝熱冷却されたシャーシ(30)に配設された少なくとも一つのエレクトロニクス回路カード(20)と、
前記伝熱冷却されたシャーシ(30)に配設され、前記少なくとも一つのエレクトロニクス回路カード(20)に隣接する、少なくとも一つの冷却モジュール(10)とを備え、
前記冷却モジュール(10)が、
熱伝導板(14)と、
前記熱伝導板(14)の少なくとも一側部に配設されて、1つの室を有するブラダー(12)と、
前記ブラダー(12)の前記室内に配設された流体とを備え、
前記ブラダー(12)は、前記熱伝導板(14)の一端の周りに巻かれた一部分を備え、前記ブラダー(12)は、シャーシのカバー板が前記熱伝導板(14)の一端の周りに巻かれたブラダー(12)の部分に押し付けられたとき、膨張し得るようになっており、
膨張状態での前記ブラダー(12)では、前記エレクトロニクス回路カード(20)に対して冷却モジュール(10)のブラダーの一部が圧接し、
前記熱伝導板(14)は、入力ポート(17)に接続された冷却剤の供給通路(25)と、前記室内に存在する冷却剤の噴射ポート(23)と、出口ポート(19)に接続される冷却剤の回収通路(27)と、前記室から入る冷却剤の回収ポート(21)とを含み、
前記室は、前記室に流体を通過させるため冷却剤の噴射ポート(23)と冷却剤の回収ポート(21)とに接続され、
前記冷却剤の供給通路(25)の一部が前記熱伝導板(14)の中央付近に配置され、前記冷却剤の回収通路(27)が、前記冷却剤の供給通路の一部の周りに配置されており、
別の冷却モジュール(10)が、前記伝熱冷却されたシャーシ(30)に配設され、且つ前記少なくとも1つのエレクトロニクス回路カード(20)に隣接して配設され、前記ブラダー(12)が膨張状態にあるとき、前記少なくとも1つの冷却モジュール(10)と前記別の冷却モジュール(10)とが前記少なくとも1つのエレクトロニクス回路カード(20)をはさむ、装置。 - 請求項1に記載の装置において、前記流体の体積が、外部源から入力ポート内へ送られ、外部源へ出口ポートにより解放される液体の量により制御される、装置。
- 伝熱冷却されたシャーシ(30)に配設され、前記シャーシ(30)に設けられる少なくとも一つのエレクトロニクス回路カード(20)に隣接する、冷却モジュール(10)において、
熱伝導板(14)と、
前記熱伝導板(14)の少なくとも一側部に配設されて、1つの室を有するブラダー(12)と、
前記ブラダー(12)の前記室内に配設された流体とを備え、
前記ブラダー(12)は、前記熱伝導板(14)の一端の周りに巻かれた一部分を備え、前記ブラダー(12)は、前記シャーシ(30)のカバー板が前記熱伝導板(14)の一端の周りに巻かれたブラダー(12)の部分に押し付けられたとき、膨張し得るようになっており、
前記熱伝導板は、入力ポートに接続された冷却剤の供給通路と、冷却剤の噴射ポートと、出口ポートに接続された冷却剤の回収通路と、冷却剤の回収ポートとを含み、
前記冷却剤の供給通路と冷却剤の回収通路は前記熱伝導板内に配置され、
冷却剤の供給通路の一部が前記熱伝導板の中央付近に配置され、前記冷却剤の回収通路が、前記冷却剤の供給通路の一部の周りに配置されており、
前記ブラダーの室は、前記冷却剤の噴射ポートと前記冷却剤の回収ポートとに接続しており、
流体の体積が、外部源から入力ポート内へ送られ、外部源へ出口ポートにより解放される液体の量により制御され、前記ブラダーは隣接する回路カードと接触するように膨張する、冷却モジュール。 - 請求項3に記載の冷却モジュールにおいて、第2のブラダーが、前記板の反対側に配設されている、冷却モジュール。
- 請求項3に記載の冷却モジュールにおいて、前記出口ポートに接続される圧力解放弁を有する、冷却モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/426,435 | 2006-06-26 | ||
US11/426,435 US7952873B2 (en) | 2006-06-26 | 2006-06-26 | Passive conductive cooling module |
PCT/US2007/013227 WO2008002380A2 (en) | 2006-06-26 | 2007-06-05 | Passive conductive cooling module |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009542031A JP2009542031A (ja) | 2009-11-26 |
JP5395661B2 true JP5395661B2 (ja) | 2014-01-22 |
Family
ID=38846157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009518136A Expired - Fee Related JP5395661B2 (ja) | 2006-06-26 | 2007-06-05 | 受動の伝導冷却モジュール |
Country Status (7)
Country | Link |
---|---|
US (1) | US7952873B2 (ja) |
EP (1) | EP2033502B1 (ja) |
JP (1) | JP5395661B2 (ja) |
KR (1) | KR101510093B1 (ja) |
AT (1) | ATE518415T1 (ja) |
TW (1) | TWI411382B (ja) |
WO (1) | WO2008002380A2 (ja) |
Cited By (1)
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---|---|---|---|---|
US12052847B2 (en) | 2020-03-09 | 2024-07-30 | Raytheon Company | Aligned multi-rail high-power cooling module |
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2006
- 2006-06-26 US US11/426,435 patent/US7952873B2/en not_active Expired - Fee Related
-
2007
- 2007-06-05 WO PCT/US2007/013227 patent/WO2008002380A2/en active Application Filing
- 2007-06-05 KR KR1020097001585A patent/KR101510093B1/ko not_active IP Right Cessation
- 2007-06-05 EP EP07795751A patent/EP2033502B1/en not_active Not-in-force
- 2007-06-05 AT AT07795751T patent/ATE518415T1/de not_active IP Right Cessation
- 2007-06-05 JP JP2009518136A patent/JP5395661B2/ja not_active Expired - Fee Related
- 2007-06-12 TW TW096121183A patent/TWI411382B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12052847B2 (en) | 2020-03-09 | 2024-07-30 | Raytheon Company | Aligned multi-rail high-power cooling module |
Also Published As
Publication number | Publication date |
---|---|
KR101510093B1 (ko) | 2015-04-08 |
ATE518415T1 (de) | 2011-08-15 |
JP2009542031A (ja) | 2009-11-26 |
TWI411382B (zh) | 2013-10-01 |
EP2033502B1 (en) | 2011-07-27 |
US20070297137A1 (en) | 2007-12-27 |
WO2008002380A2 (en) | 2008-01-03 |
KR20090025363A (ko) | 2009-03-10 |
US7952873B2 (en) | 2011-05-31 |
WO2008002380A3 (en) | 2008-03-13 |
EP2033502A2 (en) | 2009-03-11 |
TW200814917A (en) | 2008-03-16 |
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