WO2008002380A3 - Passive conductive cooling module - Google Patents

Passive conductive cooling module Download PDF

Info

Publication number
WO2008002380A3
WO2008002380A3 PCT/US2007/013227 US2007013227W WO2008002380A3 WO 2008002380 A3 WO2008002380 A3 WO 2008002380A3 US 2007013227 W US2007013227 W US 2007013227W WO 2008002380 A3 WO2008002380 A3 WO 2008002380A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling module
bladder
circuit card
electronic circuit
conductive cooling
Prior art date
Application number
PCT/US2007/013227
Other languages
French (fr)
Other versions
WO2008002380A2 (en
Inventor
Timothy J Glahn
Jr Robert G Kurtz
Original Assignee
Raytheon Co
Timothy J Glahn
Jr Robert G Kurtz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co, Timothy J Glahn, Jr Robert G Kurtz filed Critical Raytheon Co
Priority to KR1020097001585A priority Critical patent/KR101510093B1/en
Priority to EP07795751A priority patent/EP2033502B1/en
Priority to JP2009518136A priority patent/JP5395661B2/en
Priority to AT07795751T priority patent/ATE518415T1/en
Publication of WO2008002380A2 publication Critical patent/WO2008002380A2/en
Publication of WO2008002380A3 publication Critical patent/WO2008002380A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Abstract

A cooling module includes a thermally conductive plate, a bladder disposed on at least one side of the plate, the bladder have a chamber, and fluid disposed in the chamber of the bladder wherein the bladder in an inflated state impresses the cooling module against an adjacent electronic circuit card. where the cooling module is forcibly pressed against adjacent electronic circuit card providing increased physical stability to the electronic circuit card as well as provide a cooling technique for the circuit card.
PCT/US2007/013227 2006-06-26 2007-06-05 Passive conductive cooling module WO2008002380A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097001585A KR101510093B1 (en) 2006-06-26 2007-06-05 Passive conductive cooling module
EP07795751A EP2033502B1 (en) 2006-06-26 2007-06-05 Passive conductive cooling module
JP2009518136A JP5395661B2 (en) 2006-06-26 2007-06-05 Passive conduction cooling module
AT07795751T ATE518415T1 (en) 2006-06-26 2007-06-05 PASSIVE CONDUCTIVE COOLING MODULE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/426,435 2006-06-26
US11/426,435 US7952873B2 (en) 2006-06-26 2006-06-26 Passive conductive cooling module

Publications (2)

Publication Number Publication Date
WO2008002380A2 WO2008002380A2 (en) 2008-01-03
WO2008002380A3 true WO2008002380A3 (en) 2008-03-13

Family

ID=38846157

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/013227 WO2008002380A2 (en) 2006-06-26 2007-06-05 Passive conductive cooling module

Country Status (7)

Country Link
US (1) US7952873B2 (en)
EP (1) EP2033502B1 (en)
JP (1) JP5395661B2 (en)
KR (1) KR101510093B1 (en)
AT (1) ATE518415T1 (en)
TW (1) TWI411382B (en)
WO (1) WO2008002380A2 (en)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7508670B1 (en) * 2007-08-14 2009-03-24 Lockheed Martin Corporation Thermally conductive shelf
US20090323286A1 (en) * 2008-06-13 2009-12-31 Evga Corporation Apparatus for removing heat from pc circuit board devices such as graphics cards and the like
US20100039770A1 (en) * 2008-08-15 2010-02-18 Danello Paul A Pneumatic presssure wedge
US7872867B2 (en) 2008-09-02 2011-01-18 International Business Machines Corporation Cooling system for an electronic component system cabinet
US8215377B1 (en) * 2009-05-06 2012-07-10 Lockheed Martin Corporation Heat transfer device with flexible cooling layer
US8776868B2 (en) * 2009-08-28 2014-07-15 International Business Machines Corporation Thermal ground plane for cooling a computer
US8411440B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Cooled universal hardware platform
US8441792B2 (en) * 2010-07-21 2013-05-14 Birchbridge Incorporated Universal conduction cooling platform
US8410364B2 (en) 2010-07-21 2013-04-02 Birchbridge Incorporated Universal rack cable management system
US8441793B2 (en) 2010-07-21 2013-05-14 Birchbridge Incorporated Universal rack backplane system
US9247986B2 (en) 2010-11-05 2016-02-02 Ethicon Endo-Surgery, Llc Surgical instrument with ultrasonic transducer having integral switches
US9510895B2 (en) 2010-11-05 2016-12-06 Ethicon Endo-Surgery, Llc Surgical instrument with modular shaft and end effector
US9782215B2 (en) 2010-11-05 2017-10-10 Ethicon Endo-Surgery, Llc Surgical instrument with ultrasonic transducer having integral switches
US9000720B2 (en) 2010-11-05 2015-04-07 Ethicon Endo-Surgery, Inc. Medical device packaging with charging interface
US9375255B2 (en) 2010-11-05 2016-06-28 Ethicon Endo-Surgery, Llc Surgical instrument handpiece with resiliently biased coupling to modular shaft and end effector
US10959769B2 (en) 2010-11-05 2021-03-30 Ethicon Llc Surgical instrument with slip ring assembly to power ultrasonic transducer
US20120116265A1 (en) 2010-11-05 2012-05-10 Houser Kevin L Surgical instrument with charging devices
US10085792B2 (en) 2010-11-05 2018-10-02 Ethicon Llc Surgical instrument with motorized attachment feature
US9039720B2 (en) 2010-11-05 2015-05-26 Ethicon Endo-Surgery, Inc. Surgical instrument with ratcheting rotatable shaft
US9526921B2 (en) 2010-11-05 2016-12-27 Ethicon Endo-Surgery, Llc User feedback through end effector of surgical instrument
US9421062B2 (en) 2010-11-05 2016-08-23 Ethicon Endo-Surgery, Llc Surgical instrument shaft with resiliently biased coupling to handpiece
US20120116381A1 (en) 2010-11-05 2012-05-10 Houser Kevin L Surgical instrument with charging station and wireless communication
US9089338B2 (en) 2010-11-05 2015-07-28 Ethicon Endo-Surgery, Inc. Medical device packaging with window for insertion of reusable component
US9017849B2 (en) * 2010-11-05 2015-04-28 Ethicon Endo-Surgery, Inc. Power source management for medical device
US9161803B2 (en) 2010-11-05 2015-10-20 Ethicon Endo-Surgery, Inc. Motor driven electrosurgical device with mechanical and electrical feedback
US9072523B2 (en) 2010-11-05 2015-07-07 Ethicon Endo-Surgery, Inc. Medical device with feature for sterile acceptance of non-sterile reusable component
US9782214B2 (en) 2010-11-05 2017-10-10 Ethicon Llc Surgical instrument with sensor and powered control
US9017851B2 (en) 2010-11-05 2015-04-28 Ethicon Endo-Surgery, Inc. Sterile housing for non-sterile medical device component
US9011471B2 (en) 2010-11-05 2015-04-21 Ethicon Endo-Surgery, Inc. Surgical instrument with pivoting coupling to modular shaft and end effector
US9597143B2 (en) 2010-11-05 2017-03-21 Ethicon Endo-Surgery, Llc Sterile medical instrument charging device
US10881448B2 (en) 2010-11-05 2021-01-05 Ethicon Llc Cam driven coupling between ultrasonic transducer and waveguide in surgical instrument
US10660695B2 (en) 2010-11-05 2020-05-26 Ethicon Llc Sterile medical instrument charging device
US9381058B2 (en) 2010-11-05 2016-07-05 Ethicon Endo-Surgery, Llc Recharge system for medical devices
US9649150B2 (en) 2010-11-05 2017-05-16 Ethicon Endo-Surgery, Llc Selective activation of electronic components in medical device
FR2977949B1 (en) * 2011-07-11 2015-10-16 Airbus Operations Sas ELECTRONIC SYSTEM COMPRISING AN INTEGRATED EXPANSIBLE COOLING DEVICE
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
US20130153187A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Dual Heat Sinks For Distributing A Thermal Load
JP5761448B2 (en) * 2012-03-19 2015-08-12 富士通株式会社 Heating device cooling device
GB2507958B (en) * 2012-11-08 2017-04-05 Cybula Ltd Computing devices that both intercommunicate and receive power by wireless methods
CA2800056A1 (en) 2012-12-24 2014-06-24 Nova Chemicals Corporation Polyethylene blend compositions
CN203327457U (en) * 2013-05-20 2013-12-04 中兴通讯股份有限公司 Heat radiation device
CN104345848B (en) * 2013-08-09 2017-11-21 英业达科技有限公司 Server and its cooling system
CN105706541B (en) * 2013-10-29 2019-02-05 积水保力马科技株式会社 Filling liquid radiating component
ITUD20130151A1 (en) * 2013-11-15 2015-05-16 Eurotech S P A MODULAR SUPERCALCULAR ARCHITECTURE
US9426931B2 (en) 2014-02-07 2016-08-23 Lockheed Martin Corporation Fluid-flow-through cooling of circuit boards
US10136938B2 (en) 2014-10-29 2018-11-27 Ethicon Llc Electrosurgical instrument with sensor
DE102014224989A1 (en) * 2014-12-05 2016-06-09 Siemens Aktiengesellschaft Cooling device for cooling an electrical device
FR3030999B1 (en) * 2014-12-19 2019-05-17 Airbus Operations (S.A.S.) METHOD AND DEVICE FOR COOLING EQUIPMENT WITH ELECTRONIC CARDS USING AT LEAST ONE DISTINCTIVE FLUID COOLING CARD
NZ774237A (en) 2015-03-25 2023-12-22 ResMed Pty Ltd Patient interface with blowout prevention for seal-forming portion
US10098241B2 (en) 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
US9760134B1 (en) * 2016-02-25 2017-09-12 Raytheon Company Hydraulic card retainer
US10736218B1 (en) * 2019-06-10 2020-08-04 Mellanox Technologies, Ltd. Networking cards with increased thermal performance
US11140780B2 (en) * 2019-06-10 2021-10-05 Mellanox Technologies, Ltd. Networking cards with increased performance
EP3771644A1 (en) 2019-07-29 2021-02-03 General Electric Company Vehicle heat exchanger system
CN112543575B (en) * 2019-09-23 2022-03-04 上海微电子装备（集团）股份有限公司 Board card plug-in module and electric control box
DE102019215336A1 (en) 2019-10-07 2021-04-08 Mahle International Gmbh Temperature control device for controlling the temperature of an electrical device
DE102020104327A1 (en) 2020-02-19 2021-08-19 Audi Aktiengesellschaft Electronic circuit with a cooling system and a cooling unit for the cooling system and motor vehicle with a circuit
CN113423249B (en) * 2021-07-06 2022-07-22 深圳市特发信息技术服务有限公司 Modular container type data center machine room
DE102021209640A1 (en) 2021-09-01 2023-03-02 Continental Automotive Technologies GmbH Cooling device, cooling arrangement, control device and rack system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4102350A1 (en) * 1991-01-26 1992-07-30 Macrotek Gmbh Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink
US5504924A (en) * 1990-11-28 1996-04-02 Hitachi, Ltd. Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards
WO2000004752A1 (en) * 1998-07-15 2000-01-27 Systems & Electronics, Inc. Modular heat sink stack

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4700272A (en) * 1986-06-26 1987-10-13 Digital Equipment Corporation Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
US4938279A (en) * 1988-02-05 1990-07-03 Hughes Aircraft Company Flexible membrane heat sink
JPH0330399A (en) * 1989-06-27 1991-02-08 Mitsubishi Electric Corp Electronic cooling device
US4994937A (en) * 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
JPH0474494A (en) * 1990-07-17 1992-03-09 Mitsubishi Electric Corp Electronic equipment
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
US5205348A (en) * 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
JPH06260782A (en) * 1993-03-02 1994-09-16 Mitsubishi Electric Corp Electronic apparatus
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
JPH08264981A (en) * 1995-03-20 1996-10-11 Mitsubishi Electric Corp Electronic equipment
US5740018A (en) * 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
JP2901943B2 (en) * 1997-10-17 1999-06-07 三菱電機株式会社 Cooling system
US6690578B2 (en) * 2000-02-02 2004-02-10 Rittal Gmbh & Co. Kg Cooling device
KR20040006636A (en) * 2002-07-13 2004-01-24 천기완 The soft cooling jacket for water cooling of the electronics and buffer jacket using of it
US7167366B2 (en) * 2002-09-11 2007-01-23 Kioan Cheon Soft cooling jacket for electronic device
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
FR2860947B1 (en) * 2003-10-10 2005-12-23 Thales Sa ELECTRONIC PRINTED CIRCUIT COOLING DEVICE AND EMBODIMENT.
US20050262871A1 (en) * 2004-05-27 2005-12-01 Valerie Bailey-Weston Portable cooling system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504924A (en) * 1990-11-28 1996-04-02 Hitachi, Ltd. Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards
DE4102350A1 (en) * 1991-01-26 1992-07-30 Macrotek Gmbh Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink
WO2000004752A1 (en) * 1998-07-15 2000-01-27 Systems & Electronics, Inc. Modular heat sink stack

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"INFLATABLE INTERNAL COMPUTER STRUCTURE", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 39, no. 1, January 1996 (1996-01-01), pages 309 - 312, XP000556414, ISSN: 0018-8689 *

Also Published As

Publication number Publication date
EP2033502B1 (en) 2011-07-27
JP2009542031A (en) 2009-11-26
US7952873B2 (en) 2011-05-31
US20070297137A1 (en) 2007-12-27
ATE518415T1 (en) 2011-08-15
TWI411382B (en) 2013-10-01
KR101510093B1 (en) 2015-04-08
TW200814917A (en) 2008-03-16
WO2008002380A2 (en) 2008-01-03
KR20090025363A (en) 2009-03-10
JP5395661B2 (en) 2014-01-22
EP2033502A2 (en) 2009-03-11

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