DE4102350A1 - Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink - Google Patents

Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink

Info

Publication number
DE4102350A1
DE4102350A1 DE19914102350 DE4102350A DE4102350A1 DE 4102350 A1 DE4102350 A1 DE 4102350A1 DE 19914102350 DE19914102350 DE 19914102350 DE 4102350 A DE4102350 A DE 4102350A DE 4102350 A1 DE4102350 A1 DE 4102350A1
Authority
DE
Germany
Prior art keywords
heat sink
chip
heat
thermal conductivity
transfer element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19914102350
Other languages
German (de)
Inventor
Karl Michael Marks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MACROTEK GmbH
Original Assignee
MACROTEK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MACROTEK GmbH filed Critical MACROTEK GmbH
Priority to DE19914102350 priority Critical patent/DE4102350A1/en
Publication of DE4102350A1 publication Critical patent/DE4102350A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The heat transfer element acts between integrated circuits and heat sinks in multi-chip modules, or chip-on-board units. It contains an enclosed casing of thin, elastic plastics of good thermal conductivity, temp.-resistant and ageing proof up to 150 deg.C. The casing is filled with a liquid coolant of good thermal conductivity. The heat transfer element is fitted between the surface of a substrate and chip and the underside of the heat sink. The casing may be a plastics bag which also provides planar equalisation between the contact faces of the integrated circuit, or within the heat sink surface. It can also equalise different thermal expansion coeffts. of concerned components without any adhesive. ADVANTAGE - Simplifies mounting of chips on carrier. No adhesive is required between rear side of chip and heat sink.

Description

Die Erfindung ist im Bereich der Verpackungs- und Anschlußtechnik für mikro­ elektronische Bauelemente (Chips, Hybride) angesiedelt. Die Erfindung ist ein Element, das eine gute Wärmeabfuhr zwischen integrierten Schaltungen eines Multi-Chip-Moduls und einem auf dem Modul angebrachten Kühlkörper gewähr­ leistet ohne besondere Anforderungen an die Planarität des Kühlkörpers oder der Chiprückseiten zu stellen. Dadurch wird der Prozeß zum Aufbringen der Chips auf den Träger vereinfacht. Dies senkt die Aufbringungskosten und erhöht die Ausbeute beim Aufbringungsprozeß. Darüber hinaus wird keine Klebverbindung mit einem Wärmeleitkleber zwischen den Chip-Rückseiten und dem Kühlkörper benötigt. Dadurch wir die Reparaturfähigkeit der Module deutlich erhöht. Darüber hinaus kompensiert das Element auch unterschiedliche Ausdehnungs­ temperaturkoeffizienten von Chips und Kühlkörper.The invention is in the field of packaging and connection technology for micro electronic components (chips, hybrids). The invention is a Element that has good heat dissipation between an integrated circuit Multi-chip module and a heat sink attached to the module performs without any special requirements on the planarity of the heat sink or the To put chip backs. This will make the process of applying the chips simplified on the carrier. This lowers the application costs and increases them Yield in the application process. In addition, there is no adhesive bond with a thermal adhesive between the back of the chip and the heat sink needed. This significantly increases the repairability of the modules. The element also compensates for different expansion temperature coefficients of chips and heat sinks.

Stand der Technik zur Kühlung von Multi-Chip-Modulen sind folgende Verfahren:The following methods are state of the art for cooling multi-chip modules:

  • - Abfuhr der Wärme durch eine Klebverbindung zwischen Chip und Kühlkörper.- Dissipation of the heat through an adhesive connection between the chip and Heatsink.
  • - Gleitpreßkontakt zwischen Chip-Rückseite und Kühlkörper. Der Druck wird z. B. bei TAB durch einen Gummipuffer zwischen Chip und Substrat hergestellt, wenn der Kühlkörper auf den Modulträger aufgeschraubt wird und die Chips gegen die Gummipuffer drückt /SIE01/.- Sliding press contact between the back of the chip and the heat sink. The pressure z. B. at TAB by a rubber buffer between the chip and substrate manufactured when the heat sink is screwed onto the module carrier and presses the chips against the rubber buffers / SIE01 /.
  • - Die Chips liegen mit der Rückseite am Substrat (meist Befestigung durch Wärmeleitkleber). Thermische Vias (Durchkontaktierungen) sorgen für eine gute Wärmeabfuhr durch Substrat und Modulträger.- The back of the chips is on the substrate (usually attached by Thermal adhesive). Thermal vias provide for good heat dissipation through the substrate and module carrier.

Bild 1 zeigt ein Multi-Chip-Modul bestehend aus einem Modulträger mit den Chips, dem Element zum Wärmetransfer und einem Kühlkörper. Bei dem Element für den Wärmetransfer handelt es sich um einen geschlossenen Kunststoffbeutel, der mit einer Flüssigkeit mit sehr guter Wärmeleitfähigkeit gefüllt ist. Der für den Beutel gewählte Kunststoff soll ebenfalls eine gute Wärmeleitfähigkeit besitzen, beständig gegen Temperaturen bis mindestens 150°C sein und eine gute Elastizität aufweisen. Der Beutel ist derart geformt, daß er alle Chips überdeckt. Am Rand muß Raum für eine horizontale Ausdehnung des Beutels zur Verfügung stehen. Der Beutel wird auf den Träger mit den Chips gelegt. Der Kühlkörper wird auf den Beutel gesetzt und mit dem Träger verschraubt. Durch den Andruck liegt die Oberseite des Beutels flächig direkt am Kühlkörper und die Unterseite des Beutels an der Oberfläche der Chips fest an. Durch den vertikalen Druck dehnt sich der Beutel in horizontaler Richtung leicht aus und nutzt einen Teil des horizontalen Spielraums. Der Rest des Spielraums wird für die Erweiterung der horizontalen Ausdehnung in Folge der Temperaturerhöhung beim Betrieb des Moduls benötigt. Figure 1 shows a multi-chip module consisting of a module carrier with the chips, the element for heat transfer and a heat sink. The element for heat transfer is a closed plastic bag that is filled with a liquid with very good thermal conductivity. The plastic chosen for the bag should also have good thermal conductivity, be resistant to temperatures up to at least 150 ° C and have good elasticity. The pouch is shaped to cover all of the chips. There must be space at the edge for horizontal expansion of the bag. The bag is placed on the carrier with the chips. The heat sink is placed on the bag and screwed to the carrier. Due to the pressure, the top of the bag lies flat directly on the heat sink and the bottom of the bag on the surface of the chips. Due to the vertical pressure, the bag expands slightly in the horizontal direction and uses part of the horizontal scope. The rest of the scope is required for the expansion of the horizontal expansion as a result of the temperature increase during operation of the module.

Quellenangaben:Sources:

SIE01: Computer Packaging; Wessely, Türk, Schmidt, Nagel; Siemens Forsch.- u. Entwickl.-Ber. Bd.17 (1987) Nr. 5 Springer Verlag 1988.SIE01: Computer Packaging; Wessely, Türk, Schmidt, Nagel; Siemens research and Develop area Vol. 17 (1987) No. 5 Springer Verlag 1988.

Claims (1)

Element zum Wärmetransfer zwischen integrierten Schaltungen und Kühl­ körpern in Multi-Chip-Modulen oder Chip-On-Board-Einheiten, gekennzeichnet durch folgende Merkmale
  • - eine geschlossene Hülle aus dünnem, elastischem, gut wärmeleitendem und bis 150°C temperatur- und alterungsbeständigem Kunststoffmaterial
  • - eine Füllung der Hülle mit einem gut wärmeleitendem, flüssigen Kühlmittel
  • - Anordnung zwischen der Oberfläche von Substrat und Chip und der Unter­ seite des Kühlkörpers
Element for heat transfer between integrated circuits and heat sinks in multi-chip modules or chip-on-board units, characterized by the following features
  • - A closed cover made of thin, elastic, good heat-conducting and up to 150 ° C temperature and aging-resistant plastic material
  • - A filling of the shell with a good heat-conducting, liquid coolant
  • - Arrangement between the surface of the substrate and chip and the underside of the heat sink
DE19914102350 1991-01-26 1991-01-26 Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink Withdrawn DE4102350A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19914102350 DE4102350A1 (en) 1991-01-26 1991-01-26 Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19914102350 DE4102350A1 (en) 1991-01-26 1991-01-26 Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink

Publications (1)

Publication Number Publication Date
DE4102350A1 true DE4102350A1 (en) 1992-07-30

Family

ID=6423799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19914102350 Withdrawn DE4102350A1 (en) 1991-01-26 1991-01-26 Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink

Country Status (1)

Country Link
DE (1) DE4102350A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4410467A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Heat sink arrangement with a thermally conductive plate for a plurality of integrated circuits on a substrate
DE4410029A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Spring-loaded heat sink arrangement for a plurality of integrated circuits on a substrate
EP0895286A2 (en) * 1997-07-30 1999-02-03 Asea Brown Boveri AG Semiconductor power componant with pressure compensating contact plate
WO2008002380A2 (en) * 2006-06-26 2008-01-03 Raytheon Company Passive conductive cooling module
DE102007041419A1 (en) * 2007-08-31 2009-03-12 Sew-Eurodrive Gmbh & Co. Kg Device, particularly electrical device, comprises printed circuit board, where three-dimensionally shaped breaker is provided between power semiconductors and heat sink or cooling plate for heat dissipation

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4410467A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Heat sink arrangement with a thermally conductive plate for a plurality of integrated circuits on a substrate
DE4410029A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Spring-loaded heat sink arrangement for a plurality of integrated circuits on a substrate
DE4410467C2 (en) * 1993-07-06 1999-03-25 Hewlett Packard Co Heat sink arrangement with a thermally conductive plate for a plurality of integrated circuits on a substrate
EP0895286A2 (en) * 1997-07-30 1999-02-03 Asea Brown Boveri AG Semiconductor power componant with pressure compensating contact plate
EP0895286A3 (en) * 1997-07-30 1999-11-03 Asea Brown Boveri AG Semiconductor power componant with pressure compensating contact plate
WO2008002380A2 (en) * 2006-06-26 2008-01-03 Raytheon Company Passive conductive cooling module
WO2008002380A3 (en) * 2006-06-26 2008-03-13 Raytheon Co Passive conductive cooling module
US7952873B2 (en) 2006-06-26 2011-05-31 Raytheon Company Passive conductive cooling module
DE102007041419A1 (en) * 2007-08-31 2009-03-12 Sew-Eurodrive Gmbh & Co. Kg Device, particularly electrical device, comprises printed circuit board, where three-dimensionally shaped breaker is provided between power semiconductors and heat sink or cooling plate for heat dissipation
DE102007041419B4 (en) 2007-08-31 2022-03-31 Sew-Eurodrive Gmbh & Co Kg Arrangement for cooling electrical components and converter and compact drive with it

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