JPS63208254A - Cooling structure for lsi - Google Patents

Abstract

PURPOSE:To obtain efficient cooling at less thermal resistance without applying large force to LSIs and a printed board, by inserting fin parts into flexible tubes, in which refrigerant is made to flow, and fixing a plurality of blocks of good heat conducting material, which have flat parts directly coupled to the film fin parts, to the LSIs. CONSTITUTION:LSIs 2 are mounted on a printed board 1 in a grid pattern. Tubes 3 are provided along the upper parts of the LSIs. A block 4 of highly heat-conductive material has a flat part and is provided at a position corresponding to each LSI. A fin part 41 is provided uprightly on the upper surface of the block 4 and inserted in the inside of the tube 3. The boundary surface with the tube 3 is tightly sealed with a sealing material 5. The flat part of the block 4 is overlapped on the LSI 2 so as to hold an elastic sheet 6 having good heat conductivity. The facing two sides are fixed with clips 7. When a refrigerant 8 such as water is made to flow through the tube 3, heat generated in each LSI 2 is guided to the fin 41 in the tube 3 through the block 4 and cooled directly with the refrigerant 8. Thus efficient cooling is carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a cooling structure for LSIs that are densely mounted on glint substrates used in converters and the like, and particularly relates to a cooling structure for LSIs that uses a coolant such as water. be.

BACKGROUND ART Conventionally, as an example of a cooling structure using liquid cooling for this type of LSI, there is a cold grate system (for example, "5up").
ercornputers demand 1nn
ovation in packaging and
cooling' ElectronicsSep
22. 1982, P 142-P
143).

An example of the structure of this method is as shown in FIG. 4, in which a plurality of LS112s each having a heat smudge and a dazzle 13 on the top surface are mounted on a glint board 11, and a plurality of LS112s are mounted on a metal plate such as aluminum on the heat smears and dazzle 13. A cold grate 14 having a water channel 15 is pressed against the cold grate 14, and a refrigerant such as water is flowed into the water channel 15 to keep the temperature of the LS 112 low. In addition, the mounting height of the L8112 may not necessarily be on the same plane due to its dimensional accuracy, variations in mounting, the curvature of all glint bases, ridges, etc. A soft thermal paste 16 is sealed on the surface to be pressed by a film 17, and its softness is used to absorb variations in mounting.

In the example shown in FIG. 4, the cold grate 14 is provided between the circuit packages mounted on the two glint boards 11 and 11', respectively, by pressing the two glint boards 11 and 11' together. C, film 1
7 and the thermal paste 16 are deformed and come into contact with the heat sink 13, and the heat generated in the LSI 12 is dissipated from the cold grate 14 to a refrigerant such as water flowing through the water channel 15 via the film 17 and the thermal paste 16. It had become.

However, although this conventional cooling structure 1 uses a soft thermal paste 16, one metal cold grate 14 is attached to the LSI 12 by the press plate 11 or 1.
There is a disadvantage that a large force is applied to the thermal paste 1', and a particularly large force is generated at high temperatures due to thermal expansion of the thermal paste 16. Furthermore, LSI1
2, the thermal paste 16 has a large thickness, resulting in large thermal resistance and poor cooling characteristics.

In addition, the example Kj in Fig. 4? There are two glint boards 11
There is also a case where the cold grate 14 is arranged between the glint substrate 11' and the glint substrate 11';
j) In this case as well, there was a drawback that it worked in the same way and caused inconvenience.

Problems to be Solved by the Invention The purpose of the present invention is to solve the above-mentioned drawbacks, namely, that pressing the cold grate onto the LSI places a large force on the LSI and the glint board, and that the thickness of the thermal paste deteriorates the cooling characteristics. LS that solved the problem of decreasing
It is to provide a cooling structure for I.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a trap, a plurality of LSI
are arranged in a grid pattern on a glint substrate, and then placed on a cage.
A flexible chip is provided near the top surface of the LSI along the rows or columns of the LSI, a fin is inserted into the tube and the interface with the tube is sealed with a sealant, and this A plurality of blocks of highly thermally conductive material are made up of flat parts that are directly connected to the fin parts and are provided corresponding to the positions of each LSI, and the flat parts of these blocks are pressed against the top surface of the LSI at the corresponding position and fixed tightly. This system adopts a configuration consisting of a fixture for

Operation Since the present invention is configured as described above, the flat part of the block in which the fin part is inserted into the flexible tube is connected to the corresponding LS.
By fixing the LSI tightly on the top surface of the IC with the pressure of the fixing device, and flowing a coolant such as water inside the chip, the heat generated in the LSI passes through the block made of high heat conductive material and is radiated from the fins into the coolant. K becomes like that.

Example Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 showing an embodiment of the present invention in a plan view, A- in FIG.
Referring to FIG. 2, which is a longitudinal cross-sectional view taken along line A, and FIG. 3, which is shown in cross-sectional view taken along line B-B, the LSI cooling structure of the present invention is as follows.
A chip is placed along I and SI2 in each row of a package in which a plurality of LSIs 2 are mounted in a grid on a glint board 1.
3 is provided. Regarding this cheap 3, a fin portion 41 standing upright on the top surface of a block 4 made of a highly thermally conductive material such as metal having a flat portion at a position corresponding to each L812 is inserted into the inside of the tube 3, and the cheap 3 and The interface between the two is sealed with a sealing material 5. As shown in FIG. 3, the planar portion of the block 4 is superimposed on the LSI 2 with an elastic 7-piece 6 having good thermal conductivity in between, and two opposing sides are fixed with chestnut and gua.

Next, the operation of Honjitsuo will be explained using FIGS. 2 and 3. When a refrigerant 8 such as water is passed through Cheap 3, the LSI
The heat generated in the tube 2 is guided by the block 4 to the fins 41 in the tube 3, and the fins 41 are directly cooled by the refrigerant 8, so that efficient cooling is performed. Also Cheap 3
It has sufficient flexibility and can easily absorb variations in the mounting height of LSI2 and block 4.
The force of the clip 7 applied to the glint board IK is not transmitted to the glint board IK, and if approximately the same force is applied only to the sides of each LSI 2, it becomes K.

Effects of the Invention As explained above, according to the present invention, there is provided a flexible tube for flowing a refrigerant, and a plurality of flexible tubes each having a fin portion inserted into the tube and a flat portion directly connected to the fin portion. A block of good heat conductive material and the flat part of this block are connected to each LS.
In addition to providing a fixture for fixing the DC, there is an effect that thermal resistance is low and efficient cooling can be obtained without applying large force to the LSI or glint board.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view taken along the line A-A in FIG. 1, FIG. 3 is a cross-sectional view taken along the line B-B in FIG. 1, and FIG. FIG. 2 is a vertical cross-sectional view of an example of a conventional cold grating force type. 1... Glint board, 2... LSI,
3...Tube, 4...Block, 4
1...Fin, 5...Sealing material, 6.
...Note, 7...Cree, Gu, 8...
... Refrigerant. Figure 1

Claims (1)

[Claims] In an LSI cooling structure in which a plurality of LSIs arranged in a grid on a glint substrate are cooled with a coolant, the LSI
a flexible tube provided near the top surface of the LSI along the rows or columns; a fin portion that is inserted into the tube and whose interface with the tube is sealed with a sealing material; and the fin portion. a plurality of blocks of highly thermally conductive material, each of which is directly connected to the LSI and has a flat portion provided corresponding to the position of each LSI, and the flat portion of each of these blocks is pressed against each of the upper surfaces of the LSI and fixed in close contact with each other; 1. A cooling structure for an LSI, comprising a fixing means for cooling an LSI, and cooling by flowing a refrigerant into the tube.