ATE477258T1 - Kupfer (i) vorläufer für die chemische dampfphasenabscheidung von metallischem kupfer - Google Patents

Kupfer (i) vorläufer für die chemische dampfphasenabscheidung von metallischem kupfer

Info

Publication number
ATE477258T1
ATE477258T1 AT98914918T AT98914918T ATE477258T1 AT E477258 T1 ATE477258 T1 AT E477258T1 AT 98914918 T AT98914918 T AT 98914918T AT 98914918 T AT98914918 T AT 98914918T AT E477258 T1 ATE477258 T1 AT E477258T1
Authority
AT
Austria
Prior art keywords
copper
pct
precursor
vapor deposition
chemical vapor
Prior art date
Application number
AT98914918T
Other languages
English (en)
Inventor
Pascal Cnrs Doppelt
Original Assignee
Centre Nat Rech Scient
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Nat Rech Scient filed Critical Centre Nat Rech Scient
Application granted granted Critical
Publication of ATE477258T1 publication Critical patent/ATE477258T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/08Copper compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/0803Compounds with Si-C or Si-Si linkages

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Catalysts (AREA)
  • High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
  • Electrodes Of Semiconductors (AREA)
AT98914918T 1997-03-13 1998-03-13 Kupfer (i) vorläufer für die chemische dampfphasenabscheidung von metallischem kupfer ATE477258T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9703029A FR2760743B1 (fr) 1997-03-13 1997-03-13 Nouveaux precurseurs de cuivre(i) pour depot chimique en phase gazeuse de cuivre metallique
PCT/FR1998/000518 WO1998040387A1 (fr) 1997-03-13 1998-03-13 Nouveaux precurseurs de cuivre(i) pour depot chimique en phase gazeuse de cuivre metallique

Publications (1)

Publication Number Publication Date
ATE477258T1 true ATE477258T1 (de) 2010-08-15

Family

ID=9504731

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98914918T ATE477258T1 (de) 1997-03-13 1998-03-13 Kupfer (i) vorläufer für die chemische dampfphasenabscheidung von metallischem kupfer

Country Status (11)

Country Link
US (1) US6130345A (de)
EP (1) EP0966474B1 (de)
JP (1) JP4388604B2 (de)
KR (1) KR100542913B1 (de)
AT (1) ATE477258T1 (de)
AU (1) AU743343B2 (de)
CA (1) CA2283160C (de)
DE (1) DE69841824D1 (de)
FR (1) FR2760743B1 (de)
TW (1) TW514671B (de)
WO (1) WO1998040387A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002530520A (ja) * 1998-08-03 2002-09-17 アドバンスド.テクノロジー.マテリアルズ.インコーポレイテッド ミクロ電子工学素子構造体の製造のための銅前駆組成物及びその形成プロセス
JP2002128787A (ja) * 1999-12-15 2002-05-09 Mitsubishi Materials Corp 有機銅化合物及び該化合物を含む混合液並びにそれを用いて作製された銅薄膜
US6596344B2 (en) * 2001-03-27 2003-07-22 Sharp Laboratories Of America, Inc. Method of depositing a high-adhesive copper thin film on a metal nitride substrate
US6534666B1 (en) * 2001-12-27 2003-03-18 Air Products And Chemicals, Inc. Use of water and acidic water to purify liquid MOCVD precursors
FR2839982B1 (fr) 2002-05-22 2005-04-15 Centre Nat Rech Scient Composition de precurseur pour le depot de cuivre sur un support
WO2004006859A2 (en) * 2002-07-16 2004-01-22 Sonus Pharmaceuticals, Inc. Platinum compound
FR2845088B1 (fr) * 2002-09-30 2004-12-03 Centre Nat Rech Scient Nouveaux complexes metalliques exempts de fluor pour le depot chimique de metaux en phase gazeuse
DE10319454A1 (de) * 2003-04-29 2004-11-18 Merck Patent Gmbh Dikupfer(I)oxalat-Komplexe als Precursor zur metallischen Kupferabscheidung
US6838573B1 (en) * 2004-01-30 2005-01-04 Air Products And Chemicals, Inc. Copper CVD precursors with enhanced adhesion properties
US7129368B2 (en) * 2004-03-15 2006-10-31 Sonus Pharmaceuticals, Inc. Platinum carboxylate anticancer compounds

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1178290A (en) * 1981-07-13 1984-11-20 Gerald Doyle Copper or silver complexes with fluorinated diketonates and unsaturated hydrocarbons
US5096737A (en) 1990-10-24 1992-03-17 International Business Machines Corporation Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films
US5098516A (en) 1990-12-31 1992-03-24 Air Products And Chemicals, Inc. Processes for the chemical vapor deposition of copper and etching of copper
US5085731A (en) 1991-02-04 1992-02-04 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
US5144049A (en) * 1991-02-04 1992-09-01 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
US5187300A (en) 1991-02-04 1993-02-16 Air Products And Chemicals, Inc. Volatile precursors for copper CVD
JP2622671B2 (ja) * 1995-03-07 1997-06-18 株式会社トリケミカル研究所 銅のβ−ジケトネート錯体の製造方法

Also Published As

Publication number Publication date
CA2283160C (fr) 2009-11-03
WO1998040387A1 (fr) 1998-09-17
EP0966474A1 (de) 1999-12-29
FR2760743B1 (fr) 1999-07-23
JP2001514644A (ja) 2001-09-11
KR100542913B1 (ko) 2006-01-11
EP0966474B1 (de) 2010-08-11
DE69841824D1 (de) 2010-09-23
JP4388604B2 (ja) 2009-12-24
US6130345A (en) 2000-10-10
KR20000076244A (ko) 2000-12-26
TW514671B (en) 2002-12-21
CA2283160A1 (fr) 1998-09-17
AU743343B2 (en) 2002-01-24
FR2760743A1 (fr) 1998-09-18
AU6923398A (en) 1998-09-29

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