ATE46398T1 - Anordnung elektrischer zwischenverbindungen. - Google Patents

Anordnung elektrischer zwischenverbindungen.

Info

Publication number
ATE46398T1
ATE46398T1 AT86300441T AT86300441T ATE46398T1 AT E46398 T1 ATE46398 T1 AT E46398T1 AT 86300441 T AT86300441 T AT 86300441T AT 86300441 T AT86300441 T AT 86300441T AT E46398 T1 ATE46398 T1 AT E46398T1
Authority
AT
Austria
Prior art keywords
arrays
circuit board
array
pressure
arrangement
Prior art date
Application number
AT86300441T
Other languages
English (en)
Inventor
Frank Harry Jenner
Original Assignee
Marconi Instruments Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Instruments Ltd filed Critical Marconi Instruments Ltd
Application granted granted Critical
Publication of ATE46398T1 publication Critical patent/ATE46398T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Bipolar Transistors (AREA)
  • Surgical Instruments (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AT86300441T 1985-03-05 1986-01-23 Anordnung elektrischer zwischenverbindungen. ATE46398T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08505566A GB2172150B (en) 1985-03-05 1985-03-05 Probe arrays for testing circuit boards
EP86300441A EP0196149B1 (de) 1985-03-05 1986-01-23 Anordnung elektrischer Zwischenverbindungen

Publications (1)

Publication Number Publication Date
ATE46398T1 true ATE46398T1 (de) 1989-09-15

Family

ID=10575423

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86300441T ATE46398T1 (de) 1985-03-05 1986-01-23 Anordnung elektrischer zwischenverbindungen.

Country Status (4)

Country Link
EP (1) EP0196149B1 (de)
AT (1) ATE46398T1 (de)
DE (1) DE3665631D1 (de)
GB (1) GB2172150B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3781979D1 (de) * 1986-08-07 1992-11-05 Siemens Ag Pruefeinrichtung fuer beidseitige, zweistufige kontaktierung bestueckter leiterplatten.
GB8622878D0 (en) * 1986-09-23 1986-10-29 Marconi Instruments Ltd Electrical interface arrangement
DE4335841C1 (de) * 1993-10-20 1995-06-01 Siemens Nixdorf Inf Syst Vakuumadapter
DE102004007696B4 (de) 2004-02-16 2009-01-02 Infineon Technologies Ag Testvorrichtung zum Prüfen eines Halbleiterbauteils mit Kontaktflächen auf seiner Oberseite und seiner Unterseite und Verfahren zum Prüfen des Halbleiterbauteils

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2918648A (en) * 1956-06-15 1959-12-22 Philco Corp Testing apparatus
GB1151833A (en) * 1968-01-22 1969-05-14 Cossor Ltd A C A Clip for Facilitating the Testing of Micro-Electronic Packages.
GB1503927A (en) * 1975-08-14 1978-03-15 Continental Specialties Corp Electrical test clips
US4012097A (en) * 1975-10-17 1977-03-15 Everett/Charles, Inc. Combined test clip and component extraction tool
GB1530350A (en) * 1976-10-23 1978-10-25 Marconi Instruments Ltd Electrical test jigs

Also Published As

Publication number Publication date
GB2172150B (en) 1988-06-08
GB8505566D0 (en) 1985-04-03
EP0196149A1 (de) 1986-10-01
GB2172150A (en) 1986-09-10
EP0196149B1 (de) 1989-09-13
DE3665631D1 (en) 1989-10-19

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