ATE460771T1 - Thermomanagement-verfahren und system für verstärker - Google Patents

Thermomanagement-verfahren und system für verstärker

Info

Publication number
ATE460771T1
ATE460771T1 AT06008798T AT06008798T ATE460771T1 AT E460771 T1 ATE460771 T1 AT E460771T1 AT 06008798 T AT06008798 T AT 06008798T AT 06008798 T AT06008798 T AT 06008798T AT E460771 T1 ATE460771 T1 AT E460771T1
Authority
AT
Austria
Prior art keywords
amplifier
controller
unit
amplifier unit
temperature
Prior art date
Application number
AT06008798T
Other languages
English (en)
Inventor
Gerhard Pfaffinger
Andreas Suess
Original Assignee
Harman Becker Automotive Sys
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harman Becker Automotive Sys filed Critical Harman Becker Automotive Sys
Application granted granted Critical
Publication of ATE460771T1 publication Critical patent/ATE460771T1/de

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03GCONTROL OF AMPLIFICATION
    • H03G3/00Gain control in amplifiers or frequency changers
    • H03G3/20Automatic control
    • H03G3/30Automatic control in amplifiers having semiconductor devices
    • H03G3/3005Automatic control in amplifiers having semiconductor devices in amplifiers suitable for low-frequencies, e.g. audio amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/52Circuit arrangements for protecting such amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/447Indexing scheme relating to amplifiers the amplifier being protected to temperature influence
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03GCONTROL OF AMPLIFICATION
    • H03G2201/00Indexing scheme relating to subclass H03G
    • H03G2201/70Gain control characterized by the gain control parameter
    • H03G2201/708Gain control characterized by the gain control parameter being temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Amplifiers (AREA)
  • Control Of Amplification And Gain Control (AREA)
AT06008798T 2006-04-27 2006-04-27 Thermomanagement-verfahren und system für verstärker ATE460771T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06008798A EP1850474B1 (de) 2006-04-27 2006-04-27 Thermomanagement-Verfahren und System für Verstärker

Publications (1)

Publication Number Publication Date
ATE460771T1 true ATE460771T1 (de) 2010-03-15

Family

ID=36952445

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06008798T ATE460771T1 (de) 2006-04-27 2006-04-27 Thermomanagement-verfahren und system für verstärker

Country Status (5)

Country Link
US (2) US8385564B2 (de)
EP (1) EP1850474B1 (de)
JP (1) JP5242074B2 (de)
AT (1) ATE460771T1 (de)
DE (1) DE602006012806D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102804807B (zh) * 2009-06-29 2015-11-25 诺基亚公司 电子设备、电子装置、移动终端装置以及用于处理电子信号的方法
GB2536973B (en) * 2015-04-02 2018-10-10 Entotem Ltd Processing an input analog audio signal derived from a vinyl record
US9774952B2 (en) 2015-04-02 2017-09-26 Entotem Limited Processing analog audio signals
GB201617409D0 (en) 2016-10-13 2016-11-30 Asio Ltd A method and system for acoustic communication of data
US12341931B2 (en) 2016-10-13 2025-06-24 Sonos Experience Limited Method and system for acoustic communication of data
GB201617408D0 (en) 2016-10-13 2016-11-30 Asio Ltd A method and system for acoustic communication of data
GB201704636D0 (en) 2017-03-23 2017-05-10 Asio Ltd A method and system for authenticating a device
US10264355B2 (en) * 2017-06-02 2019-04-16 Apple Inc. Loudspeaker cabinet with thermal and power mitigation control effort
GB2570634A (en) 2017-12-20 2019-08-07 Asio Ltd A method and system for improved acoustic transmission of data
WO2021195658A1 (en) 2020-03-25 2021-09-30 Sonos, Inc. Thermal control of audio playback devices

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JPS58176416U (ja) * 1982-05-20 1983-11-25 パイオニア株式会社 発熱部品の過熱防止機能を備えた増幅装置
JPS61195110A (ja) 1985-02-26 1986-08-29 Nippon Shokubai Kagaku Kogyo Co Ltd ウレタン(メタ)アクリレートプレポリマーの製造法
JPS61195110U (de) * 1985-04-10 1986-12-05
JPS6231210A (ja) * 1985-08-02 1987-02-10 Nec Corp 温度自動利得制御方式
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JPH06231210A (ja) 1993-01-29 1994-08-19 Toyota Motor Corp 透視図作成装置
US5519886A (en) * 1994-09-26 1996-05-21 Motorola, Inc. Method and apparatus for controlling device temperature during transmissions
US5533132A (en) 1995-01-23 1996-07-02 Jbl Incorporated Loudspeaker thermal management structure
US6029119A (en) 1996-01-16 2000-02-22 Compaq Computer Corporation Thermal management of computers
KR100319275B1 (ko) * 1999-03-20 2002-01-09 윤종용 무선 단말기에서 온도보상에 따른 전력제어를 위한 코드 값 계산 방법
JP2001168646A (ja) * 1999-12-14 2001-06-22 Teac Corp ファンモータ制御装置
JP3444837B2 (ja) * 2000-03-28 2003-09-08 株式会社ケンウッド オーディオ装置
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JP2004112707A (ja) * 2002-09-20 2004-04-08 Sony Corp 音声再生装置
US6879929B2 (en) * 2002-10-31 2005-04-12 Sun Microsystems Sense amplifier thermal correction scheme
KR100975059B1 (ko) * 2003-11-25 2010-08-11 삼성전자주식회사 오디오 앰프의 온도 제어 장치
JP2005167519A (ja) * 2003-12-01 2005-06-23 Sony Ericsson Mobilecommunications Japan Inc 携帯通信端末装置及び利得可変回路
JP4336968B2 (ja) 2004-02-20 2009-09-30 日本電気株式会社 移動体通信機器および送信電力制御方法
JP4514485B2 (ja) * 2004-03-19 2010-07-28 パナソニック株式会社 高周波電力増幅器
JP2006013566A (ja) * 2004-06-22 2006-01-12 Renesas Technology Corp 高周波電力増幅用電子部品
KR100573217B1 (ko) * 2004-10-06 2006-04-24 삼성전자주식회사 이동 통신 단말 송신부의 이득 제어회로 및 방법
JP4424514B2 (ja) * 2006-10-05 2010-03-03 ソニー株式会社 音響機器の冷却装置および冷却方法
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JP5029428B2 (ja) * 2008-02-29 2012-09-19 富士通株式会社 温度制御装置、温度制御プログラムおよび情報処理装置

Also Published As

Publication number Publication date
US8385564B2 (en) 2013-02-26
US20070262820A1 (en) 2007-11-15
EP1850474B1 (de) 2010-03-10
DE602006012806D1 (de) 2010-04-22
US20130113558A1 (en) 2013-05-09
US8610505B2 (en) 2013-12-17
JP5242074B2 (ja) 2013-07-24
JP2007300609A (ja) 2007-11-15
EP1850474A1 (de) 2007-10-31

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties