ATE434265T1 - Kondensatorstruktur mit einer vielzahl von anschlüssen - Google Patents

Kondensatorstruktur mit einer vielzahl von anschlüssen

Info

Publication number
ATE434265T1
ATE434265T1 AT02008769T AT02008769T ATE434265T1 AT E434265 T1 ATE434265 T1 AT E434265T1 AT 02008769 T AT02008769 T AT 02008769T AT 02008769 T AT02008769 T AT 02008769T AT E434265 T1 ATE434265 T1 AT E434265T1
Authority
AT
Austria
Prior art keywords
capacitor structure
providing
electrode layer
terminals
film electrode
Prior art date
Application number
AT02008769T
Other languages
English (en)
Inventor
David R Brown
Original Assignee
Paratek Microwave Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Paratek Microwave Inc filed Critical Paratek Microwave Inc
Application granted granted Critical
Publication of ATE434265T1 publication Critical patent/ATE434265T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT02008769T 2001-04-19 2002-04-18 Kondensatorstruktur mit einer vielzahl von anschlüssen ATE434265T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/838,412 US6549396B2 (en) 2001-04-19 2001-04-19 Multiple terminal capacitor structure

Publications (1)

Publication Number Publication Date
ATE434265T1 true ATE434265T1 (de) 2009-07-15

Family

ID=25277033

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02008769T ATE434265T1 (de) 2001-04-19 2002-04-18 Kondensatorstruktur mit einer vielzahl von anschlüssen

Country Status (5)

Country Link
US (1) US6549396B2 (de)
EP (1) EP1251559B1 (de)
AT (1) ATE434265T1 (de)
CA (1) CA2381117C (de)
DE (1) DE60232619D1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
DE10260352A1 (de) * 2002-12-20 2004-07-15 Infineon Technologies Ag Verfahren zum Herstellen einer Kondensatoranordnung und Kondensatoranordnung
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
DE10326087B4 (de) * 2003-06-10 2008-03-20 Infineon Technologies Ag Bauelement mit einer Nutzstruktur und einer Hilfsstruktur
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US20060157792A1 (en) * 2005-01-19 2006-07-20 Kyocera Corporation Laminated thin film capacitor and semiconductor apparatus
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US20060274476A1 (en) * 2005-04-13 2006-12-07 Andrew Cervin-Lawry Low loss thin film capacitor and methods of manufacturing the same
DE102005052637A1 (de) * 2005-11-04 2007-05-24 Atmel Duisburg Gmbh Monolithisch integrierte Schaltung
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
JP5000660B2 (ja) * 2006-09-27 2012-08-15 京セラ株式会社 コンデンサ装置、電子部品、フィルタ装置、通信装置、およびコンデンサ装置の製造方法
US8169772B2 (en) 2007-05-01 2012-05-01 Avx Corporation Precision laser adjustable thin film capacitors
US20080304202A1 (en) * 2007-06-04 2008-12-11 Taiyo Yuden Co., Ltd. Multi-layer capacitor and integrated circuit module
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US20090230446A1 (en) * 2008-03-17 2009-09-17 Technology Alliance Group, Inc. Semiconductor device and bypass capacitor module
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US20110007488A1 (en) * 2009-07-07 2011-01-13 Chin-Wei Liu Power supply current circuit structure
US9648727B2 (en) 2015-01-22 2017-05-09 Harris Corporation Fault detection optimized electronic circuit and method
US20210020587A1 (en) * 2019-06-11 2021-01-21 Skyworks Solutions, Inc. Moisture barrier for metal insulator metal capacitors and integrated circuit having the same
US11990470B2 (en) * 2021-09-24 2024-05-21 International Business Machines Corporation Ferroelectric and paraelectric stack capacitors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916576A (en) 1989-02-27 1990-04-10 Fmtt, Inc. Matrix capacitor
US5530722A (en) 1992-10-27 1996-06-25 Ericsson Ge Mobile Communications Inc. Quadrature modulator with integrated distributed RC filters
US5745335A (en) * 1996-06-27 1998-04-28 Gennum Corporation Multi-layer film capacitor structures and method
US5910879A (en) * 1996-06-27 1999-06-08 Herbert; Edward 3- and 4-terminal capacitors with "Faraday-shielded" connections
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US6266229B1 (en) * 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
JP2000183286A (ja) * 1998-12-10 2000-06-30 Nec Corp 半導体集積回路

Also Published As

Publication number Publication date
CA2381117C (en) 2006-11-14
US20020163769A1 (en) 2002-11-07
CA2381117A1 (en) 2002-10-19
EP1251559B1 (de) 2009-06-17
US6549396B2 (en) 2003-04-15
EP1251559A2 (de) 2002-10-23
EP1251559A3 (de) 2005-03-09
DE60232619D1 (de) 2009-07-30

Similar Documents

Publication Publication Date Title
ATE434265T1 (de) Kondensatorstruktur mit einer vielzahl von anschlüssen
FI950608A0 (fi) Laite sähköisen liikenneportin sovittamiseksi optiseen liikenneporttiin
ATE533178T1 (de) Integrierter schaltkreis mit kondensator und diesbezügliches herstellungsverfahren
ES2177881T3 (es) Electrodo exterior para un actuador monolitico multicapa.
KR840006885A (ko) 고주파수 dc-dc 변환장치
EP1308990A3 (de) Ferroelektrischer Kondensator und Halbleiteranordnung
DE69333211D1 (de) Elektrische Bauelemente
EP1229649A3 (de) Ausgangsschaltung, Eingangsschaltung und Eingangs/Ausgangsschaltung
DK0994494T3 (da) Kondensator til lavinduktiv indsættelse i en mellemkreds
ATE533229T1 (de) Elektronische vorrichtung
ATE339780T1 (de) Breitband-impedanzwandler
EP1471566A3 (de) Halbleiterbauelement und dessen Herstellungsverfahren
DE50014127D1 (de) Piezoaktor mit einer elektrisch leitenden Mehrschichtfolie
EP0949682A3 (de) Ferroelektrische Speicheranordnung mit verbesserten Kondensatoreigenschaften
EP0841699A3 (de) Filmkapazität und Halbleiterpackung oder Anordnung damit
EP1942549A3 (de) Bandpassfilter mit Dualmodus
SG66275A1 (en) Semiconductor device containing electrostatic capacitive element and method for manufacturing same
ATE143175T1 (de) Dünnschicht-halbleiterbauelement
SE0001504L (sv) Elektronisk komponent och radioterminal där denna andvänds
KR960009209A (ko) 반도체 집적회로
CN213368265U (zh) 一种防噪声的电子光学元器件
ATE304738T1 (de) Nichtreziproke schaltungsvorrichtung und kommunikationsvorrichtung
ATE533177T1 (de) Dielektrischer film
JPS58150823U (ja) 積み重ね形セラミツクコンデンサ
KR19980035060A (ko) 캐패시터

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties