ATE428531T1 - Laserbohrsystem und -verfahren unter verwendung einer kontinuierlich optimierten schärfentiefe - Google Patents

Laserbohrsystem und -verfahren unter verwendung einer kontinuierlich optimierten schärfentiefe

Info

Publication number
ATE428531T1
ATE428531T1 AT03709364T AT03709364T ATE428531T1 AT E428531 T1 ATE428531 T1 AT E428531T1 AT 03709364 T AT03709364 T AT 03709364T AT 03709364 T AT03709364 T AT 03709364T AT E428531 T1 ATE428531 T1 AT E428531T1
Authority
AT
Austria
Prior art keywords
field
drilling system
laser drilling
continuously optimized
optimized depth
Prior art date
Application number
AT03709364T
Other languages
English (en)
Inventor
Xinbing Liu
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/266,999 external-priority patent/US6787734B2/en
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of ATE428531T1 publication Critical patent/ATE428531T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
AT03709364T 2002-07-25 2003-02-26 Laserbohrsystem und -verfahren unter verwendung einer kontinuierlich optimierten schärfentiefe ATE428531T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39846902P 2002-07-25 2002-07-25
US10/266,999 US6787734B2 (en) 2002-07-25 2002-10-08 System and method of laser drilling using a continuously optimized depth of focus
PCT/US2003/005909 WO2004011187A1 (en) 2002-07-25 2003-02-26 System and method of laser drilling using a continuously optimized depth of focus

Publications (1)

Publication Number Publication Date
ATE428531T1 true ATE428531T1 (de) 2009-05-15

Family

ID=30772609

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03709364T ATE428531T1 (de) 2002-07-25 2003-02-26 Laserbohrsystem und -verfahren unter verwendung einer kontinuierlich optimierten schärfentiefe

Country Status (6)

Country Link
EP (1) EP1525069B1 (de)
JP (1) JP2006503713A (de)
CN (1) CN1313239C (de)
AT (1) ATE428531T1 (de)
AU (1) AU2003212424A1 (de)
DE (1) DE60327206D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT2289708E (pt) * 2009-08-26 2012-01-24 Indaffil Holding Ag Processo de fabrico de uma estrutura de superfície de uma chapa estampada metálica, de uma banda sem-fim ou de um rolo de gofragem
CN101832759B (zh) * 2010-04-06 2012-06-27 清华大学 一种微纳米尺度散斑的制作方法
JP5808267B2 (ja) * 2012-02-20 2015-11-10 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
WO2015113302A1 (zh) * 2014-01-30 2015-08-06 西门子公司 用于激光钻孔工艺的仿真系统和方法
WO2022162768A1 (ja) * 2021-01-27 2022-08-04 ギガフォトン株式会社 レーザ加工方法、及びレーザ加工システム
CN113305448B (zh) * 2021-05-28 2022-05-27 苏州科韵激光科技有限公司 一种焦深自动补偿方法、装置和系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129603A4 (de) * 1982-12-17 1985-06-10 Inoue Japax Res Zerspanungsvorrichtung mit laser.
FR2547519B1 (fr) * 1983-06-15 1987-07-03 Snecma Procede et dispositif de percage par laser
JPH0798274B2 (ja) * 1986-12-22 1995-10-25 大成建設株式会社 レ−ザ−照射による固形材の切断方法及びその装置
US5063280A (en) * 1989-07-24 1991-11-05 Canon Kabushiki Kaisha Method and apparatus for forming holes into printed circuit board
JPH0366488A (ja) * 1989-08-02 1991-03-22 Mitsubishi Electric Corp レーザ穴明け方法
JPH05208288A (ja) * 1992-01-16 1993-08-20 Hitachi Ltd レーザ加工方法及びその装置
JP3185580B2 (ja) * 1995-01-31 2001-07-11 三菱電機株式会社 レーザ加工装置および加工方法
AU7633596A (en) * 1995-11-21 1997-06-11 Loughborough University Innovations Limited Control methods and apparatus
JPH09253877A (ja) * 1996-03-25 1997-09-30 Sumitomo Electric Ind Ltd エキシマレーザ加工方法及び加工された基板
JP3474774B2 (ja) * 1998-05-29 2003-12-08 リコーマイクロエレクトロニクス株式会社 インクジェットヘッドのノズルプレートの製造方法
JP3407715B2 (ja) * 2000-06-06 2003-05-19 松下電器産業株式会社 レーザ加工装置
JP2002001563A (ja) * 2000-06-27 2002-01-08 Toshiba Tec Corp レーザ加工装置およびその方法
KR100852155B1 (ko) * 2001-07-02 2008-08-13 버텍 비젼 인터내셔널 인코포레이티드 경질의 비금속 기판 내의 오프닝 어블레이팅 방법

Also Published As

Publication number Publication date
CN1658997A (zh) 2005-08-24
EP1525069A4 (de) 2006-05-24
EP1525069B1 (de) 2009-04-15
DE60327206D1 (de) 2009-05-28
AU2003212424A1 (en) 2004-02-16
EP1525069A1 (de) 2005-04-27
CN1313239C (zh) 2007-05-02
JP2006503713A (ja) 2006-02-02

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