WO2015113302A1 - 用于激光钻孔工艺的仿真系统和方法 - Google Patents

用于激光钻孔工艺的仿真系统和方法 Download PDF

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Publication number
WO2015113302A1
WO2015113302A1 PCT/CN2014/071838 CN2014071838W WO2015113302A1 WO 2015113302 A1 WO2015113302 A1 WO 2015113302A1 CN 2014071838 W CN2014071838 W CN 2014071838W WO 2015113302 A1 WO2015113302 A1 WO 2015113302A1
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WIPO (PCT)
Prior art keywords
laser
laser pulse
workpiece
drilling
depth
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PCT/CN2014/071838
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English (en)
French (fr)
Inventor
李红涛
姜涛
汤禹成
Original Assignee
西门子公司
李红涛
姜涛
汤禹成
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Application filed by 西门子公司, 李红涛, 姜涛, 汤禹成 filed Critical 西门子公司
Priority to PCT/CN2014/071838 priority Critical patent/WO2015113302A1/zh
Publication of WO2015113302A1 publication Critical patent/WO2015113302A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B19/00—Teaching not covered by other main groups of this subclass
    • G09B19/24—Use of tools

Definitions

  • the present invention relates to a simulation system and method for laser drilling, and in particular to a visualization system and method. Furthermore, the invention relates to a simulation system and method for a laser drilling machine and a laser drilling machine equipped with the simulation system.
  • a turbine such as a gas turbine (GT) is a power machine that uses a continuously flowing fluid as a working fluid to drive the impeller to rotate at high speed for output power. It is widely used in many industrial fields, such as propulsion, power stations, petrochemicals, etc. . These gas turbines typically operate in high temperature and high pressure environments.
  • the blade 1 of a gas turbine typically has a plurality of cooling micropores 101 to form a cooling passage to the hollow interior of the blade, wherein to form an optimized cooling passage, the cooling microhole 101 Have different arrangement configurations, such as different tilt angles.
  • GT gas turbine
  • the publication WO 2007/027707 also discloses a method for energy monitoring of each through hole in a laser micromachining process, wherein in the micromachining process of one or more micromachining features, such as holes, in the workpiece, recording corresponding One or more parameters of the number of laser pulses, and correlating the specifications of the micromachined feature with the parameters of the recorded laser pulse beam to provide consistent or improved processing of such micromachined features later Processing quality.
  • the process requires that all specifications of the micromachined feature and all parameters of the laser pulse beam be associated with each of the different micromachined features, thereby requiring different micromachined features to be based on micromachined features. Specifications to determine and optimize all parameters of the laser pulse beam. This is very time consuming when processing the cooling micropores of a large number of gas turbine blades.
  • the present invention is directed to a simulation system and method for a laser drilling process that achieves critical processing parameters for precise laser drilling operations in a simple manner.
  • Another object of the present invention is to provide a control system and method for a laser drilling machine and a laser drilling machine having the same.
  • the present invention provides a laser drilling simulation system, comprising: an input unit for workpiece information, configured to input a material parameter of a workpiece to be drilled with at least one hole and a depth to be drilled on the workpiece; a laser pulse determining unit configured to determine a performance parameter of a laser pulse used for drilling; and a processing unit for using a parameter based on a material parameter of the workpiece to be drilled and a laser pulse performance from a plurality of relationship curves Selecting a relationship curve and calculating a number of pulses required to drill the depth of the hole based on the selected relationship curve, the plurality of relationship curves being laser pulses under specified conditions of workpiece material parameters and drilling laser pulse performance parameters The relationship between the number and the depth of the hole.
  • the laser pulse performance parameter relates to the self-property parameter of the laser pulse, excluding the number of laser pulses that vary with time.
  • the processing variables of all holes are only in the depth to be processed, and the corresponding number of laser pulses can be correspondingly generated, which is significantly reduced. Preparation before processing, and simple processing of the laser drilling machine.
  • the workpiece material parameter is a material type or a material hardness.
  • the laser pulse performance parameter is a unit energy level and/or frequency of the laser pulse, and more preferably, only a unit energy level of the laser pulse. Since the material type/hardness and the unit energy level and/or frequency of the laser pulse can be easily determined, the laser drilling simulation process according to the present invention is further simplified.
  • the simulation system may further comprise a database storing a plurality of pulses in relation to the depth of the borehole under specified conditions of the workpiece material and the specified laser pulse performance parameters for drilling.
  • the processing unit of the simulation system in accordance with the present invention may be configured to obtain a suitable pulse number versus bore depth from, for example, a cloud server.
  • the simulation system can include an output unit for outputting the depth of the aperture and the corresponding number of pulses.
  • the simulation system further includes a laser pulse generating device; and the laser pulse determining unit includes a laser pulse detecting device configured to detect a performance parameter and a pulse number of the laser pulse emitted by the laser pulse generating device, the simulation The system also includes a laser pulse transmission path disposed between the laser pulse generating device and the laser pulse detecting device, which further provides a physical simulation effect for the operator to more intuitively foresee the laser drilling process. Moreover, the laser pulse transmission path of the simulation system can effectively simulate the "real" laser pulse transmission path of the laser drilling machine.
  • the output unit comprises a laser drilling visualization unit for visually displaying the depth of the hole in the workpiece that varies with the detected number of laser pulses, which further increases the operator
  • the intuitive experience is especially beneficial for operators to speed up the machining planning of laser drilling of workpieces and reduce the cost of processing planning.
  • the simulation system further includes a laser input control unit configured to input laser pulse performance parameters generated by the laser pulse generating device, which facilitates an operator to control the simulation process.
  • the laser input control unit can be a software unit, a hardware unit, or a combination thereof.
  • the simulation system further includes signal control means in communication with the laser input control unit configured to control the laser pulses emitted by the laser pulse generating means.
  • the simulation system further comprises a laser input visualization unit configured to visually display laser pulses generated by the laser pulse generation device and a laser output visualization configured to visually display the laser pulses detected by the laser pulse detection device Unit, this further increases the intuitive feel of the operator.
  • the simulation system further includes data acquisition means configured to acquire laser pulse performance parameters and pulse numbers detected by the laser pulse detection means and to deliver to the processing unit.
  • the workpiece is a gas turbine blade, the gas turbine blade comprising a plurality of cooling holes having an aperture of 0.1 mm to 1 mm.
  • a simulation method of laser drilling includes: inputting a workpiece material parameter and a depth of a hole of at least one hole to be drilled; determining a laser pulse performance parameter for drilling; The material parameters of the workpiece to be drilled and the parameters of the laser pulse performance are selected from a plurality of relationship curves, and the number of pulses required to drill the depth of the hole is calculated based on the selected relationship curve, the plurality of relationships The curve is the relationship between the number of laser pulses and the drilling depth under the conditions of the specified workpiece material parameters and drilling laser pulse performance parameters.
  • the method further includes a step of detecting a number of pulses emitted by the laser pulse device, and a step of visually displaying a depth of the hole in the workpiece that varies with a change in the number of laser pulses, wherein the determining The steps of the laser pulse performance parameter include detecting performance parameters of the laser pulse.
  • a control system for a laser drilling machine comprising: an input unit for workpiece information, configured to input a workpiece material parameter and a depth of a hole of at least one hole to be drilled; configured to detect a laser pulse detecting device of a performance parameter and a pulse number of the laser pulse, which is disposed at a position of the workpiece in the laser drilling machine; and a processing unit configured to be based on the input material parameter of the workpiece to be drilled and by the laser
  • the laser pulse performance parameter detected by the pulse detecting device selects a relationship between the pulse number and the drilling depth and calculates the number of pulses required to drill the depth of the hole based on the relationship curve.
  • the simulation system can directly detect the laser pulse of the laser drilling machine for "real" processing, thereby further improving the accuracy of the simulation and facilitating the processing of the laser drilling machine.
  • the simulation system further includes data acquisition means for acquiring laser pulse performance parameters of the laser pulse generator of the laser drill; the processing unit is further configured to compare the lasers collected by the data acquisition device Pulse performance parameters (unit energy level) and laser pulse performance parameters (unit energy levels) detected by the laser pulse detecting device. This can advantageously monitor the energy loss of the laser pulse in the laser transmission path, thereby effectively indicating contamination in the laser transmission path, such as mirrors, lenses, and the like.
  • control system further comprises a database storing a plurality of pulse numbers under the condition of the specified workpiece material parameters and the specified laser pulse performance parameters for drilling, and the drilling depth. .
  • a laser drilling machine defining a workpiece position for mounting a workpiece to be processed and comprising: a laser pulse generating device; a laser conveying path; and a simulation system according to the present invention.
  • FIG. 1 shows a schematic view of a gas turbine (GT) blade having a plurality of cooling micropores
  • FIG. 2 shows a schematic diagram of one embodiment of a simulation system for a laser drilling process in accordance with the present invention
  • Figure 3 illustrates an embodiment of a software subsystem of the simulation system as shown in Figure 2;
  • Figure 4 shows a schematic view of an embodiment of a laser drilling machine equipped with a monitoring system according to the invention
  • Figure 5 shows a schematic view of still another embodiment of a simulation system for a laser drilling process according to the present invention
  • Figure 6 is a very schematic illustration of a visual simulation of a workpiece being drilled by a laser pulse as shown in an embodiment of a simulation system in accordance with the present invention
  • Figure 7A is a very schematic illustration of a visual simulation of laser pulses emitted by a laser pulse generating device, shown in an embodiment of a simulation system in accordance with the present invention
  • Figure 7B is a very schematic illustration of a visual simulation of the laser pulses detected by the laser pulse detecting device, shown in accordance with an embodiment of the simulation system of the present invention
  • Figure 8 is a schematic illustration of a user graphical interface of an embodiment of a simulation system in accordance with the present invention.
  • the embodiment of the simulation system according to the invention is particularly suitable for the cooling micro-hole machining of, in particular, gas turbine blades, which preferably have a diameter of from 0.1 mm to 1 mm, preferably from high-strength materials, in particular It is made of a high strength metal or alloy, including but not limited to, for example, a nickel based alloy, a cobalt based alloy, a titanium alloy, and the like.
  • the simulation system according to the invention can also be applied to laser drilling of holes of various types of workpieces, different uses and/or sizes and/or different materials, including but not limited to PCB boards, wafers, Laser drilling process for workpieces such as metal or non-metal workpieces, thin workpieces.
  • the illustrated embodiments of the simulation system in accordance with the present invention all involve simulated machining of through holes, but it is contemplated that embodiments of the present invention may be applicable to the simulation of countersinking.
  • a laser pulse drilling simulation system 10 for drilling at least one cooling microhole in a gas turbine blade, such as by a laser pulse drilling process is illustrated in accordance with the present invention.
  • the simulation system can include a hardware subsystem (not labeled) and a software subsystem 15, wherein the hardware subsystem can be used to physically simulate laser pulses from the laser drill for drilling, and the software subsystem It can be used to output the required information based on signals detected from the hardware subsystem, and preferably provides visualization of the laser drilling process.
  • the hardware subsystem can include a laser pulse generating device 11 having a laser beam generator 111 and a pulse modulator 112.
  • the laser pulse generator 11 is used to physically simulate a laser source in a laser drilling process.
  • the laser beam generator 111 is for emitting a continuous laser beam
  • the pulse modulator 112 is for modulating the continuous laser into laser pulses at a controlled frequency as needed.
  • a laser pulse is generated using a combination of a continuous laser beam generator 111 and a pulse modulator 112 in the illustrated embodiment, it is contemplated to provide a pulsed laser including, but not limited to, a solid state laser such as yttrium aluminum garnet (YAG). Lasers, ruby lasers, neodymium glass lasers, etc.; molecular lasers, such as nitrogen molecular lasers; excimer lasers.
  • YAG yttrium aluminum garnet
  • the hardware subsystem may also include a laser transmission device 12 or a laser transmission path.
  • the laser delivery device 12 can include one or more mirrors 121, lenses 122, and/or one or more optical attenuators (not shown).
  • the laser transmission device 12 is preferably used for simulating a laser radiation transmission path of a real laser drilling process, in particular a laser radiation transmission device of a real laser drilling machine.
  • the simulated laser transmission device 12 is configured to have the same or similar number and/or type as the mirror, lens and/or optical attenuator of the laser radiation delivery device of a real laser drill.
  • the hardware subsystem may also include a laser pulse detecting device 13 preferably in the form of a photodiode 131.
  • the laser pulse detecting means 13 corresponds to a "dummy" workpiece, and has real energy placed on the laser pulse detecting means 13.
  • the hardware subsystem can also include a data acquisition device 14.
  • the data acquisition device 14 may, for example, be in the form of a microcontroller and/or digital signal processor, but it is contemplated that any suitable data acquisition device may be utilized, which is within the scope of the invention.
  • the data acquisition device 14 can acquire signals from the laser pulse detection device 13 and convert it into data and/or information that the software subsystem 15 can process, for example, by an ADC and/or PC converter, or any suitable converter. .
  • the hardware subsystem may also include signal control means 15 for controlling performance parameters such as energy levels, pulse width times and/or frequencies of the laser pulses.
  • the signal control device 15 is, for example, a microcontroller and / Or a digital signal processor form.
  • the software subsystem 16 can be stored in a computer 19, such as a microcomputer, especially a PC, and can include a database 17, a processing unit 18, an input unit 20 for workpiece information, and laser input control. And visualization unit 21, laser output visualization unit 22 and laser drilling visualization unit 23.
  • a computer 19 such as a microcomputer, especially a PC
  • a processing unit 18 an input unit 20 for workpiece information, and laser input control.
  • visualization unit 21 laser output visualization unit 22 and laser drilling visualization unit 23.
  • the laser input control and visualization unit 21 is configured to define laser pulses emitted by the laser pulse generating device 11, for example, by data received from a user interface. Furthermore, the laser input control and visualization unit 21 can also be configured to visually display, for example, a laser pulse emitted by the laser pulse generating device 11 in a user graphical interface, as shown in Fig. 7A.
  • the laser output visualization unit 22 is configured to acquire signals from the laser pulse detecting device 13 in the form of a photodiode 131 through the data acquisition device 14. Alternatively, the laser output visualization unit 22 can also directly acquire signals from the laser pulse detecting means. Similarly, the laser output visualization unit 22 can also be configured to visually display the laser pulses received on the laser pulse detecting device 13 in a user graphical interface, as shown in Figure 7B.
  • the database 17 is configured to store a plurality of specified workpiece parameters (for example, workpiece material types in the illustrated embodiment) and specified laser pulse parameters (for example, a single pulse energy level and pulse in the illustrated embodiment). Information on the relationship between the number of pulses and the depth of the borehole under frequency conditions, such as the relationship curve.
  • Figure 6 shows a plot of pulse number versus bore depth in accordance with an exemplary embodiment of the present invention.
  • the input unit 20 for workpiece information can be configured to transmit, for example, workpiece information input by the user through the user graphical interface, the type of material of the workpiece and the thickness (depth) to be drilled in the illustrated embodiment to the processing unit 18.
  • the processing unit 18 can be configured to be based on workpiece information obtained from the input unit, ie, the type of workpiece material, and laser pulse drilling parameters obtained from the laser output visualization unit 22 or directly from the laser pulse detecting device 13, ie, a single pulse energy level and pulse. Frequency, selecting the relationship information of the appropriate pulse number and the drilling depth from the database 17, and calculating the number of laser pulses required to penetrate the hole based on the thickness (depth:) to be drilled from the input unit 19. . Furthermore, the processing unit 18 can also be configured to calculate the depth to be drilled in the respective workpiece based on the respective laser pulses received from the laser pulse detecting device 13.
  • the laser drilling visualization unit 23 can be configured to display the drilling depth as a function of the number of laser pulses in the visualization of the workpiece based on the number of laser pulses obtained from the processing unit 18 and the corresponding drilling depth, thereby enabling laser drilling Visualization.
  • the visualization process i.e., the drilling depth variation process, is preferably not the same as the pulse time detected by the laser pulse detecting device 13, but is adjusted to be suitable for the operator to observe. More preferably, the visual display speed of the laser drilling process is adjustable.
  • Figure 8 illustrates a user graphical interface of an embodiment of a simulation system in accordance with the present invention
  • the operation of the laser drilling simulation system as illustrated in Figures 2 and 3, such as displayed on computer 19, is described.
  • the user graphics interface may include a laser control portion; a material selection portion; an image display portion; a simulation result portion and a user guide.
  • the User guide section may include a laser control portion; a material selection portion; an image display portion; a simulation result portion and a user guide.
  • the operator can select the input power (Power), percentage (Percent), frequency (Frequency) and pulse width (Duration) through the laser control section for the laser input and visualization unit 21 to control the laser pulse generating device. 11 laser pulses emitted. Further, the operator can select section selects the type of material through the material, i.e., material 1 - Materials 5 (Mat e rial 1-5); and selecting a thickness CThickness), i.e., the intended drilling depth.
  • the operator can start the simulation process by clicking Start.
  • the signal control device 15 causes the laser pulse generating device 11 to emit a laser pulse according to the regulation, and reaches the laser through the laser transmission path.
  • Pulse detection device 13 is detected and collected by data acquisition device 14 and transmitted to software subsystem 16.
  • the change in the number of pulses can be displayed, and the depth of the hole (Depth) is displayed correspondingly by the processing of the processing unit 18 of the software subsystem 16 as described above.
  • the pulse frequency detected by the output pulse detecting means 13 is also displayed.
  • the Drilling Status is also displayed, which in the illustrated embodiment is "Broken through at 2501".
  • the change in the drilling depth is correspondingly displayed by the laser drilling visualization unit 23. It is also preferable to display the laser pulse waveform emitted from the laser pulse generating device 11 and the laser pulse waveform detected by the laser pulse detecting device 11 in the image display portion. Further, when the number of pulses to be emitted is sufficient to form a prescribed drill hole, that is, when the workpiece is broken, it is preferable to turn off the laser pulse generating means and record the number of pulses. Preferably, the operator can click (Stop) or pause (PauseM) and set the simulation parameters by clicking.
  • the simulation/monitoring system according to the present invention may be suitably configured for use as a control/monitoring system for a laser drill, as shown in Figure 4, a laser drill 30 having such a control system, preferably for use in gas turbine blades The processing of the cooling micropores 101 of 1.
  • the schematic construction of the laser drill 30 shown in Figure 4 is substantially similar to that of Figure 2, but it will be appreciated that the laser drill 30 includes laser pulses for laser-drilling the workpiece "real".
  • the generating device 31, and the corresponding laser transmitting device or path 32 As shown in Fig.
  • the laser pulse detecting means 33 of the control system is arranged to be arranged at the workpiece position 33' to detect the same actual laser pulse as the workpiece.
  • the data acquisition device 34 of the simulation/monitoring system can be configured to transmit "true" laser pulse information detected by the laser pulse detecting device 33 to the software subsystem 36 of the control system system.
  • the embodiment of the control system shown in Fig. 4 does not provide a signal control device for the laser pulse generating device 31, and the signal control of the laser pulse generating device 31 is controlled by the laser drilling machine.
  • the operating unit of 30 (not labeled) is implemented.
  • the control system can be integrated with the operating unit of the laser drilling machine 30.
  • the control system is provided with another data acquisition device 35 for acquiring the relevant parameters of the output laser pulse of the pulse generating device 31, the data acquisition device 35 transmitting the relevant parameters of the laser pulse to the software as previously described. Subsystem 36.
  • the number of pulses determined by the processing unit of the control system for the depth of the corresponding microhole can be used as a processing parameter of the laser drill to control the processing of the laser drill.
  • control system can also simulate and visualize the laser drilling process of the workpiece by means of an embodiment similar to the embodiment shown in FIGS. 2 and 3, ie the control system of the laser drilling machine according to the invention can also be configured to be associated with A laser drilling machine or a simulation system that uses a component of a laser drill to perform a "physical simulation". Furthermore, it is also preferred to compare the data collected by means of the data acquisition means 34, 35, i.e.
  • the control system can monitor the energy loss, contamination or other problems caused by the laser transmission path 32, so that the operation of the laser drilling machine 30 can be monitored very effectively.
  • FIG. 5 a laser drilling simulation system 40 in accordance with another embodiment of the present invention is illustrated.
  • Figures 2 and 3 illustrate a preferred simulation system configured to emit and detect laser pulses of physical simulation System, but one should think of a simulation system of laser pulses without physical simulation, as long as the relationship between the number of pulses and the depth of the borehole under the conditions of the specified workpiece parameters and laser pulse parameters according to the present invention is utilized, which falls within the scope of the present invention. Within the scope.
  • the laser drilling simulation system 40 includes an input unit 41, a processing unit 42, a database 43, and an output unit 44.
  • the input unit 41 can be configured to input relevant parameters of the workpiece, such as the material type and/or hardness of the workpiece, and the depth (thickness) to be drilled.
  • relevant parameters of the workpiece such as the material type and/or hardness of the workpiece, and the depth (thickness) to be drilled.
  • laser pulse parameters such as unit pulse energy and/or frequency, in a variety of ways, including but not limited to, by another input unit input, using a collection device to collect from the laser drill And selecting from a laser pulse generating device of the laser drilling machine and/or selecting a plurality of laser pulse parameters preset in the simulation system 40.
  • the processing unit 42 is configured to select a suitable pulse number and bore depth relationship curve based on the workpiece parameters and laser pulse parameter conditions and calculate the number of pulses required for the corresponding borehole and transmit to the output unit 43.
  • the output unit 43 can preferably be configured as a visualization unit as previously described, but in addition or in the alternative, it can be output in any suitable manner.
  • the waveform of the laser pulses is a square wave, but it is contemplated to select any suitable laser pulse waveform, which is within the scope of the present invention.
  • the relationship between the depth of the borehole and the number of pulses stored in the database is preferably based on an experimental design (DOE), and more preferably by a mathematical fitting method on a DOE basis,
  • DOE experimental design
  • a curve is fitted by a curve fitting method known in the prior art.
  • the DOE can be performed on the workpiece sample for a specified type of workpiece material, as well as the energy level and/or frequency of the laser pulse, the borehole depth corresponding to the different pulse numbers is measured, and the known curve is utilized based on the measured value.
  • the meshing method obtains a corresponding curve of the number of pulses and the depth of the hole, but the relationship curve can also be obtained by other suitable means.
  • the database stores a corresponding relationship for a selected plurality of different material types or different material hardness values or ranges, and different unit energy levels for the laser pulses. Since the type of workpiece material that is normally machined is limited (for example on the same gas turbine blade), and the unit energy level of the laser pulse used by the laser drill for machining can also be advantageously determined (eg the same is used for all microvia machining of the blade) The laser pulse energy level), therefore, the simulation system and laser drill of the present invention can particularly advantageously simulate and/or machine a large number of holes having different hole positions and orientations, and thus different depths, such as a large number of cooling micro holes.
  • the pulse energy output by the laser pulse generating device of the simulation system can be smaller than the laser pulse emitted by the "real" laser drilling machine, thereby being proportionally amplified by the laser pulse detecting device of the simulation system.
  • the laser pulse and based on the pulse energy of the amplified laser pulse, selects the appropriate relationship curve.
  • the depth to be drilled is a single input value, it is preferred to input a plurality of depths to be drilled, in particular an array of depths to be drilled, such as a depth array of all cooling microwells throughout the blade. Or a depth array of cooled microvias for laser drilling.
  • the borehole depth array is associated with the position of the respective borehole on the workpiece.
  • a realistic laser drilling process can be simulated/visualized in a simulation system, which is particularly preferably suitable for operator assisted manufacturing. More preferably, the simulation system according to the present invention can output a processing file readable by the laser processing machine, for example containing the sequence of holes to be processed, the corresponding position and the number of pulses.

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Abstract

一种激光钻孔仿真系统（10，40）、仿真方法以及用于激光钻孔的激光钻孔机，该激光钻孔仿真系统（10，40）包括：工件信息的输入单元（20，41），配置成输入待钻设至少一个孔的工件材料参数和孔的深度；激光脉冲确定单元，配置成确定用于钻孔的激光脉冲的性能参数；处理单元（18，42），用于基于所述待钻孔工件的材料参数和激光脉冲的性能参数从多个关系曲线中选用一关系曲线，并基于选用的该关系曲线计算钻设所述孔深度所需的脉冲数，所述多个关系曲线为在规定的工件材料参数和钻孔激光脉冲性能参数的条件下激光脉冲数与钻孔深度的关系曲线。

Description

用于激光钻孔工艺的仿真系统和方法
技术领域
本发明涉及一种用于激光钻孔的仿真系统和方法、 尤其是可视化系统和 方法。 此外， 本发明还涉及一种激光钻孔机的仿真系统和方法以及配设有该 仿真系统的激光钻孔机。
背景技术
轮机、 例如燃气轮机 (GT)是一种以连续流动的流体为工质带动叶轮高速 旋转以用于输出动力的动力机械， 被广泛应用于众多工业领域， 如运载工具 推进、 发电站、 石化领域等。 这些燃气轮机通常在高温高压环境下工作。 为 此， 例如图 1所示， 在燃气轮机的叶片 1通常具有众多的冷却微孔 101 以形 成通往叶片的空心内腔的冷却通道， 其中， 为形成优化的冷却通道， 所述冷 却微孔 101具有不同的排布配置， 例如不同的倾斜角度。
传统的用于这些冷却微孔的加工方法为使用机械式加工或者电火花加工 (EDM)钻孔工艺。但这些工艺在加工效率以及对工件、即叶片的材料影响方面 存在这不足。
随着激光技术的快速发展， 激光钻孔工艺被广泛应用于燃气轮机 (GT)叶 片的冷却微孔加工中， 如公开文献 WO2013/178950、 WO2013/079246、 WO2011/140229, CN102248306等所公开的那些。
随着加工质量要求的提高， 希望能精确控制激光钻孔工艺和 /或精确预见 加工结果。 例如， 希望能够以这样的方式控制激光钻孔工艺， 即在达到预定 钻孔深度后， 尽可能最快地关停激光， 这尤其对于燃气轮机叶片的冷却微孔 加工是重要的， 因为如果不及时关停， 激光会对通常是叶片的空心内腔造成 损害。
对此， 现有技术针对激光钻孔工艺进行了大量理论研究， 包括例如有限 元建模法， 分子动力学法以及参考工件材料性能、 材料熔点和激光钻孔过程 中造成的材料运动、 乃至蒸发等的理论建模法。 例如， 中国公开文献 CN 102737137A公开了一种激光精微钻孔工艺参数优化方法，要求根据目标孔型， 进行工艺参数预测， 并进行数值仿真， 其中， 该工艺参数预测和数值仿真是 利用有限元方法基于激光钻孔所产生的温度场建模来实现的。 但是， 考虑到 激光钻孔工艺的复杂度， 其涉及众多的激光参数 (能量级别、 脉冲宽度、 脉冲 数目等)、 材料性质 (材料类型、 材料的物理或化学性质等)、 工件几何参数 (工 件形状、 尺寸和空间位置等：)等， 这些方法往往不能实现对实际激光钻孔工艺 的准确仿真， 且它们也难以用作工业上适用的激光钻孔工艺控制方法， 尤其 是难以用于具有数目众多的冷却微孔的燃气轮机。
此外， 公开文献 WO2007/027707还公开一种激光微加工过程中对各通孔 进行能量监测的方法， 其中在对工件中一个或多个微加工特征结构、 如孔进 行微加工过程中， 记录相应的激光脉冲数的一项或多项参数， 并将该微加工 特征结构的规格与记录的激光脉冲束的参数相关联， 以在以后对此类微加工 特征结构进行加工提供一致的或改良的加工品质。 但该工艺需要针对每个不 同的微加工特征结构都分别关联该微加工特征结构的所有规格和激光脉冲束 的所有参数， 由此在加工不同的微加工特征结构都需要基于微加工结构特征 的规格来确定和优化激光脉冲束的所有参数。 在加工数目众多的燃气轮机叶 片的冷却微孔时， 这非常耗时。
因此， 仍希望提供简单、 但有效的手段来实现对激光钻孔工艺的控制和 / 或仿真。 发明内容
对此， 本发明旨在提供一种用于激光钻孔工艺的仿真系统和方法， 其能 够以简单的方式获得用于精确的激光钻孔加工的关键加工参数。
本发明的另一个目的是提供一种用于激光钻孔机的控制系统和方法以及 具有该控制系统的激光钻孔机。
为实现上述目的， 本发明提出了一种激光钻孔仿真系统， 包括： 工件信 息的输入单元， 用于配置成输入待钻设至少一个孔的工件的材料参数和工件 上待钻孔的深度； 激光脉冲确定单元， 用于配置成确定用来于钻孔的激光脉 冲的性能参数； 和处理单元， 用于基于所述待钻孔工件的材料参数和激光脉 冲性能的参数从多个关系曲线中选用一关系曲线,并基于选用的该关系曲线计 算钻设所述孔的深度所需的脉冲数， 所述多个关系曲线为规定的工件材料参 数和钻孔激光脉冲性能参数的条件下激光脉冲数与钻孔深度的关系曲线。 在本发明中， 激光脉冲性能参数涉及激光脉冲的自身性质参数， 不包括 随时间变化的激光脉冲数。
通过本发明的仿真系统， 对于特定的工件材料类型和激光脉冲性能参数， 所有孔、 如冷却微孔的加工变量只在于其待加工深度， 并可相应地生成对应 的激光脉冲数， 这显著降低进行加工前的准备工作， 并可实现激光钻孔机的 简单加工。 在例如对燃气轮机叶片的大量冷却微孔加工时， 只需在有限的材 料类型进行选择， 且所有的微孔通常利用同一激光钻孔机加工， 这保证了激 光脉冲性能参数的一致性， 从而只需简单确定各微孔的待加工深度， 即可得 到相应微孔的加工参数， 这相比于现有技术显著燃气轮机叶片加工前的仿真 和实验。 而且， 利用脉冲数和钻孔深度的关系曲线能够很好地对 "真实" 的 激光钻孔过程进行仿真。
优选地， 所述工件材料参数为材料类型或材料硬度。 更优选地， 所述激 光脉冲性能参数为激光脉冲的单位能量级别和 /或频率， 更优选地， 仅为激光 脉冲的单位能量级别。 由于材料类型 /硬度以及激光脉冲的单位能量级别和 / 或频率可以容易地确定， 根据本发明的激光钻孔仿真过程得到了进一歩简化。
根据一个优选实施例， 该仿真系统还可包括数据库， 存储有多个在规定 的工件材料参数和规定的用于钻孔的激光脉冲性能参数条件下的脉冲数与钻 孔深度的关系曲线。 但作为替代实施例， 根据本发明的仿真系统的处理单元 可以配置成从例如云端服务器获取合适的脉冲数与钻孔深度的关系曲线。
根据一个优选实施例， 该仿真系统可包括用于输出所述孔的深度和相应 的脉冲数的输出单元。
根据一个优选实施例， 该仿真系统还包括激光脉冲发生装置； 且所述激 光脉冲确定单元包括配置成检测由激光脉冲发生装置发出的激光脉冲的性能 参数和脉冲数的激光脉冲检测装置， 该仿真系统还包括设置在所述激光脉冲 发生装置和激光脉冲检测装置之间的激光脉冲传输路径， 这进一歩提供了物 理仿真效果， 便于操作人员更直观地预见激光钻孔过程。 而且， 该仿真系统 的激光脉冲传输路径能够有效地对激光钻孔机的 "真实" 的激光脉冲传输路 径进行仿真。
优选地， 所述输出单元包括激光钻孔可视化单元， 用于可视化地显示工 件中随检测到激光脉冲数变化而变化的钻孔深度， 这进一歩增加了操作人员 的直观感受， 特别有利于操作人员加快工件进行激光钻孔的加工规划， 且降 低加工规划成本。
根据一个实施例， 该仿真系统还包括激光输入控制单元， 配置成用于输 入由所述激光脉冲发生装置所发生的激光脉冲性能参数， 这便于操作人员控 制仿真过程。 该激光输入控制单元可以为软件单元、 硬件单元或其结合。
根据另一实施例， 该仿真系统还包括与所述激光输入控制单元通信的信 号控制装置， 配置成控制激光脉冲发生装置发出的激光脉冲。
根据又一实施例， 该仿真系统还包括配置成可视化显示由激光脉冲发生 装置发生的激光脉冲的激光输入可视化单元和配置成可视化显示由所述激光 脉冲检测装置检测到的激光脉冲的激光输出可视化单元， 这进一歩增加了操 作人员的直观感受。
根据一个实施例， 该仿真系统还包括数据采集装置， 配置成采集由所述 激光脉冲检测装置检测到的激光脉冲性能参数和脉冲数并输送至处理单元。
根据一个实施例， 所述工件为燃机轮机叶片， 所述燃机轮机叶片包括多 个具有 0.1 mm- lmm的孔径的冷却孔。
根据本发明的又一方案， 提供一种激光钻孔的仿真方法， 包括： 输入待 钻设至少一个孔的工件材料参数和孔的深度； 确定用于钻孔的激光脉冲性能 参数； 基于所述待钻孔工件的材料参数和激光脉冲性能的参数从多个关系曲 线中选用一关系曲线,并基于选用的该关系曲线计算钻设所述孔的深度所需的 脉冲数， 所述多个关系曲线为规定的工件材料参数和钻孔激光脉冲性能参数 的条件下激光脉冲数与钻孔深度的关系曲线。
根据本发明的另一实施例， 该方法还包括检测由激光脉冲装置发出的脉 冲数的歩骤， 和可视化显示工件中随激光脉冲数变化而变化的钻孔深度的歩 骤， 其中所述确定激光脉冲性能参数的歩骤包括检测激光脉冲的性能参数。
根据本发明的另一方案， 提供一种激光钻孔机的控制系统， 包括： 用于 工件信息的输入单元， 配置成输入待钻设至少一个孔的工件材料参数和孔的 深度； 配置成检测激光脉冲的性能参数和脉冲数的激光脉冲检测装置， 其布 置在所述激光钻孔机中工件位置处； 和处理单元， 配置成基于所输入的待钻 孔工件的材料参数以及由所述激光脉冲检测装置检测的激光脉冲性能参数选 用一脉冲数和钻孔深度的关系曲线并基于所述关系曲线计算钻设所述孔的深 度所需的脉冲数。 由此， 该仿真系统可以直接检测激光钻孔机的、 用于 "真实"加工的激 光脉冲， 从而进一歩提高了仿真的准确性， 且更便于该激光钻孔机的加工。
在一个实施例中， 该仿真系统还包括用于采集激光钻孔机的激光脉冲发 生装置的激光脉冲性能参数的数据采集装置； 所述处理单元还配置成对比由 所述数据采集装置采集的激光脉冲性能参数 (单位能量级别)和由所述激光脉 冲检测装置检测到的激光脉冲性能参数 (单位能量级别)。这能够有利地监控激 光脉冲在激光传输路径中的能量损失， 从而能够有效指示激光传输路径、 如 反射镜、 透镜等中的污染。
根据本发明的一个实施例， 所述控制系统还包括数据库， 存储有多个在 规定的工件材料参数和规定的用于钻孔的激光脉冲性能参数条件下的脉冲数 与钻孔深度的关系曲线。
根据本发明的又一方案， 提供一种激光钻孔机， 限定出用于安装待加工 工件的工件位置且包括： 激光脉冲发生装置； 激光输送路径； 和根据本发明 所述的仿真系统。
根据本发明的另一方案还提供执行根据本发明的方法的计算机程序和 /或 存储该计算机程序的存储介质。
本发明的一部分优点和特征将能由本领域技术人员在阅读本发明后明 白， 另一部分在下文的具体实施方式中进行说明。 附图说明
以下附图仅旨在于对本发明做示意性说明和解释， 并不限定本发明的范 围。 其中，
图 1示出具有许多冷却微孔的燃气轮机 (GT)叶片的示意图；
图 2示出根据本发明的用于激光钻孔工艺的仿真系统的一个实施例的示 意图；
图 3示出了如图 2所示的仿真系统的软件子系统的实施例；
图 4示出配设有根据本发明的监控系统的激光钻孔机的实施例的示意图； 图 5 示出根据本发明的用于激光钻孔工艺的仿真系统的再一实施例的示 意图；
图 6非常示意性示出根据本发明的仿真系统实施例所示的、 工件被激光 脉冲钻孔的可视化仿真图； 图 7A非常示意性地示出根据本发明的仿真系统实施例所示的、由激光脉 冲发生装置发出的激光脉冲的可视化仿真图；
图 7B非常示意性地示出根据本发明的仿真系统实施例所示的、 由激光脉 冲检测装置检测到的激光脉冲的可视化仿真图；
图 8示意性示出根据本发明的仿真系统实施例的用户图形接口。
附图标记列表
1- 叶片； 101-冷却微孔； 10-仿真系统； 11-激光脉冲发生装置； 111-激光束 发生器； 112-脉冲调制器； 12-激光传输装置 /激光传输路径； 121-反射镜； 122-透镜； 13-激光脉冲检测装置； 131-感光二极管； 14-数据采集装置； 15-信号控制装置； 16-软件子系统； 17-数据库； 18-处理单元； 19-计算 机； 20-用于工件信息的输入单元； 21-激光输入控制和可视化单元； 22- 激光输出可视化单元； 23-激光钻孔可视化单元； 30-激光钻孔机； 31- 激光脉冲发生装置； 32-激光传输装置 /激光传输路径； 33-激光脉冲检测 装置； 33'-工件位置； 34-数据采集装置； 35-数据采集装置； 36-软件子 系统； 39-计算机； 40-仿真系统； 41-输入单元； 42-处理单元； 43-数据 库； 44-输出单元。
具体实施方式
为了对本发明的技术特征、 目的和效果有更加清楚的理解， 现对照附图 说明本发明的具体实施方式。 在本发明的附图中相同或相似的附图标记将表 示相同或相似的特征。
优选地， 根据本发明的仿真系统的实施例中尤其适用于尤其是燃气轮机 叶片的冷却微孔加工，所述冷却微孔优选具有 0.1mm至 lmm的直径，所述叶 片优选由高强度材料、 尤其是高强度金属或合金制成， 包括但不限于例如镍 基合金、 钴基合金、 钛合金等。 但人们可以想到， 根据本发明的仿真系统也 可适用于多种不同类型工件、不同用途和 /或尺寸的孔以及 /或者不同材料的激 光钻孔加工， 包括但不限于 PCB板、 晶圆、 金属或非金属工件、 薄型工件等 工件的激光钻孔工艺。 此外， 在根据本发明的仿真系统的所示实施例均涉及 仿真加工通孔， 但人们可以想到， 本发明的实施例可以适用于沉孔加工的仿 真。 现参考图 2，示出根据本发明的例如通过激光脉冲钻孔工艺在燃气轮机叶 片中钻设至少一个冷却微孔的激光脉冲钻孔仿真系统 10的实施例。
在该实施例中， 该仿真系统可包括硬件子系统 (未标示)和软件子系统 15， 其中硬件子系统可用于物理仿真激光钻孔机发出的用于钻孔的激光脉冲， 而 软件子系统可用于根据从硬件子系统检测到的信号输出所需的信息， 且优选 地提供激光钻孔工艺的可视化。
该硬件子系统可包括具有激光束发生器 111和脉冲调制器 112的激光脉冲 发生装置 11。 该激光脉冲发生器 11用于物理仿真激光钻孔工艺中的激光源。 该激光束发生器 111用于发出连续激光束，而该脉冲调制器 112用于根据需要 以受控的频率将连续激光调制成激光脉冲。 尽管在所示的实施例中采用连续 的激光束发生器 111和脉冲调制器 112的组合来发生激光脉冲，但是人们可以 想到设置脉冲激光器，包括但不限于固体激光器，如钇铝石榴石 (YAG)激光器、 红宝石激光器、 钕玻璃激光器等； 分子激光器， 如氮分子激光器； 准分子激 光器等。
该硬件子系统还可包括激光传输装置 12或者说激光传输路径。 在所示的 实施例中， 该激光传输装置 12可包括一个或多个反射镜 121、 透镜 122和 /或 一个或多个光学衰减器 (未示出)。 该激光传输装置 12优选用于对真实的激光 钻孔工艺的激光辐射传输路径、 尤其是真实的激光钻孔机的激光辐射传输装 置进行仿真。 例如， 该仿真的激光传输装置 12构造成具有与真实的激光钻孔 机的激光辐射传输装置的例如反射镜、 透镜和 /或光学衰减器相同或相似的数 目和 /或类型。
该硬件子系统还可包括优选呈感光二极管 131 形式的激光脉冲检测装置 13。 该激光脉冲检测装置 13相当于一个 "虚设" 的工件， 并且具有真实能量 被置于所述激光脉冲检测装置 13上。
该硬件子系统还可包括数据采集装置 14。该数据采集装置 14例如可以呈 微控制器和 /或数字信号处理器形式， 但人们可想到， 可以使用任何适用的数 据采集装置， 这都落入发明的范围。 该数据采集装置 14可以获取来自于激光 脉冲检测装置 13的信号， 且例如通过 ADC和 /或 PC转换器、 或者任何合适 的转换器将其转化成软件子系统 15可处理的数据和 /或信息。
该硬件子系统还可以包括用于控制激光脉冲的能量级别、 脉宽时间和 /或 频率等性能参数的信号控制装置 15。 该信号控制装置 15例如呈微控制器和 / 或数字信号处理器形式。
参考图 2和图 3， 该软件子系统 16可存储在计算机 19、 例如微型计算机 中、 尤其是 PC中， 且可包括数据库 17、 处理单元 18、 用于工件信息的输入 单元 20、 激光输入控制和可视化单元 21、 激光输出可视化单元 22和激光钻 孔可视化单元 23。
该激光输入控制和可视化单元 21配置成例如通过从用户接口接收到的数 据限定激光脉冲发生装置 11所发出的激光脉冲。 此外， 该激光输入控制和可 视化单元 21还可配置成例如在用户图形接口中可视化显示所述激光脉冲发生 装置 11发出的激光脉冲， 如图 7A所示。
该激光输出可视化单元 22配置成通过数据采集装置 14获取来自呈感光 二极管 131形式的激光脉冲检测装置 13的信号。 作为替代， 该激光输出可视 化单元 22也可以直接获取来自激光脉冲检测装置的信号。 类似地， 该激光输 出可视化单元 22还可配置成例如在用户图形接口中可视化显示在所述激光脉 冲检测装置 13上接收到的激光脉冲， 如图 7B所示。
该数据库 17 配置成存储有多个在规定的工件参数 (在所示的实施例中例 如为工件材料类型)和规定的激光脉冲参数 (在所示的实施例中例如为单个脉 冲能量级别和脉冲频率)条件下的脉冲数和钻孔深度的关系信息，如关系曲线。 图 6示出了根据本发明的一个示例性实施例的脉冲数和钻孔深度的关系曲线。
该用于工件信息的输入单元 20可配置成将例如由用户通过用户图形接口 输入的工件信息、在所示的实施例中为工件的材料类型和待钻孔的厚度 (深度) 传输到处理单元 18。
该处理单元 18可配置成根据从输入单元得到的工件信息、 即工件材料类 型以及从激光输出可视化单元 22或者直接从激光脉冲检测装置 13得到的激 光脉冲钻孔参数、 即单个脉冲能量级别和脉冲频率， 从数据库 17中选择合适 的脉冲数和钻孔深度的关系信息， 并基于从该输入单元 19得到的待钻孔的厚 度 (深度:)计算出恰好穿透该孔所需的激光脉冲数。 此外， 该处理单元 18还可 以配置成基于从激光脉冲检测装置 13接收到的各激光脉冲计算在相应工件中 被钻孔的深度。
激光钻孔可视化单元 23可配置成基于从处理单元 18获得的激光脉冲数 和相应的钻孔深度， 在工件的可视化图形中显示钻孔深度随激光脉冲数变化 而变化， 从而实现激光钻孔加工的可视化。 人们将明白， 该激光钻孔加工的 可视化过程、 即钻孔深度变化过程优选不与激光脉冲检测装置 13检测的脉冲 时间同歩， 而被调节成适合操作人员观察。 更优选地， 该激光钻孔加工的可 视化显示速度是可调节的。
现参考示出了根据本发明的仿真系统实施例的用户图形接口的图 8描述 根据如图 2和 3所示的激光钻孔仿真系统的工作方式， 该用户图形接口例如 显示在计算机 19所配设的显示装置上。 在图 8所示的实施例中， 该用户图形 接口可包括激光控制 (Laser control)部分；材料选择 (Material selection)部分； 图 像显示 (Image display)部分； 仿真结果 (Stimulation result)部分和用户导弓 1 (User guide)部分。
在仿真开始之前， 操作人员可以通过激光控制部分选择输入的功率 (Power), 百分比 (Percent)、 频率 (Frequency)和脉冲宽度 (Duration), 以用于激 光输入和可视化单元 21控制激光脉冲发生装置 11发出的激光脉冲。 而且， 操作人员可以通过材料选择部分选择材料类型，即材料 1-材料 5(Material 1-5)； 以及选择厚度 CThickness), 即打算钻孔的深度。
在激光控制部分和材料选择部分设定好之后， 操作人员可以通过点击开 始 (Start)开始仿真过程， 此时信号控制装置 15使激光脉冲发生装置 11按照规 定发出激光脉冲， 经激光传输路径到达激光脉冲检测装置 13被检测， 并通过 数据采集装置 14被采集并传送至软件子系统 16。 由此， 在仿真结构部分中， 可以显示脉冲 (Pulse)数目变化， 并如上所述地经软件子系统 16的处理单元 18 的处理， 相应地显示钻孔深度 (Depth)。 此外， 还显示由输出脉冲检测装置 13 检测到的脉冲频率。 优选地， 还可显示钻孔状态 (Drilling Status), 在所示的实 施例中呈现为 "在第 2501个脉冲时则击穿 (Broken through at 2501)"。 相应地， 在图像显示部分中，通过激光钻孔可视化单元 23相应地显示钻孔深度的变化。 在图像显示部分中还优选显示由激光脉冲发生装置 11发出的激光脉冲波形， 和由激光脉冲检测装置 11检测到的激光脉冲波形。 此外， 当发出的脉冲数足 以形成规定的钻孔， 即击穿工件时， 优选关闭激光脉冲发生装置， 并记录该 脉冲数。优选地，操作人员可以通过点击来停止 (Stop)或暂停 (PauseM方真过程， 以及设置 (Set)仿真参数。
人们可想到， 在图 2和图 3所示的实施例中， 一些用硬件实现的装置或 单元可以用软件来实现， 或者反过来， 这都落入本发明的范围内。 此外， 人 们还可想到， 在图 2和图 3所示的实施例中， 一些单个装置 /单元可由多个单 元共同实现； 或者， 多个独立的装置 /单元可以由单个装置 /单元集成， 可以提 供集成的处理 /可视化单元来代替处理单元 18和激光钻孔可视化单元 23， 这 都落入本发明的范围内。
人们基于图 2和图 3所示的实施例， 还能想到多种变型或变换。 例如， 根据本发明的仿真 /监控系统可以经过合适配置用作激光钻孔机的控制 /监控 系统， 如图 4示出了具有这样的控制系统的激光钻孔机 30， 其优选用于燃气 轮机叶片 1的冷却微孔 101的加工。 图 4所显示的该激光钻孔机 30的示意性 结构基本类似于图 2， 但人们将明白， 该激光钻孔机 30包括用于发出 "真实" 地对工件进行激光钻孔加工的激光脉冲发生装置 31， 和相应的激光传输装置 或路径 32。如图 4所示， 该控制系统的激光脉冲检测装置 33配置成被布置在 工件位置 33'处， 从而检测与加工工件相同的实际激光脉冲。 类似地， 该仿真 /监控系统的数据采集装置 34可配置成将激光脉冲检测装置 33检测到的"真 实"的激光脉冲信息传输到该控制系统系统的软件子系统 36中。与图 2和图 3 实施例不同地， 图 4所示的控制系统的实施例不设置用于激光脉冲发生装置 31 的信号控制装置， 该激光脉冲发生装置 31 的信号控制由该激光钻孔机 30 的操作单元 (未标示)来实现。但人们可以想到， 该控制系统可以与激光钻孔机 30的操作单元集成。优选地， 该控制系统设有用于获取该脉冲发生装置 31的 输出激光脉冲的相关参数的另一数据采集装置 35，该数据采集装置 35可将激 光脉冲的相关参数如前所述地传输到软件子系统 36。
尽管图 4 中未示出， 该控制系统的处理单元针对相应微孔的深度所确定 的脉冲数可以被用作该激光钻孔机的加工参数， 以控制该激光钻孔机的加工。
此外， 借助类似于图 2和图 3所示实施例的手段， 该控制系统也可以仿 真并可视化工件的激光钻孔过程， 即根据本发明的激光钻孔机的控制系统也 可以构造成配属于激光钻孔机或者利用激光钻孔机的部件进行 "物理仿真" 的仿真系统。 此外， 还优选可以想到， 借助于数据采集装置 34、 35采集的数 据对比，即通过激光脉冲发生装置 31发出的激光脉冲与激光脉冲检测装置 34 检测到的激光脉冲之间的能量损耗和 /或频率峰值之间的区别， 该控制系统可 以监控到激光传输路径 32造成的能量损失、 存在污染或其他问题， 从而能够 非常有效地监控激光钻孔机 30的运行。
继续参考图 5， 示出了根据本发明另一实施例的激光钻孔仿真系统 40。 尽管图 2和 3示出了配置成可发出和检测物理仿真的激光脉冲的优选仿真系 统， 但人们应想到不具有物理仿真的激光脉冲的仿真系统， 只要利用根据本 发明的在规定工件参数和激光脉冲参数条件下的脉冲数和钻孔深度的关系曲 线， 这落入本发明的范围内。
如图 5所示， 该激光钻孔仿真系统 40包括输入单元 41、 处理单元 42、 数据库 43和输出单元 44。 该输入单元 41可配置成输入工件的相关参数， 例 如工件材料类型和 /或硬度、 以及待钻孔深度 (厚度)。 尽管图 5 中未示出， 但 可以想到以多种方式确定激光脉冲参数， 例如单位脉冲能量和 /或频率， 包括 但不限于， 通过另一输入单元输入， 利用采集装置从激光钻孔机采集， 与激 光钻孔机的激光脉冲发生装置通信和 /或在该仿真系统 40 内预设定的多种激 光脉冲参数中选择。 如前所述地， 处理单元 42配置成基于工件参数和激光脉 冲参数条件选定合适的脉冲数和钻孔深度的关系曲线并计算相应钻孔所需的 脉冲数， 并传输到输出单元 43。该输出单元 43优选可以配置成如前所述的可 视化单元， 但作为补充或替代， 还可以以任何合适的方式输出。
尽管附图示出了根据本发明的多个实施例， 但是本发明还可以具有多种 其他实施例和变型。
在所示的实施例中， 激光脉冲的波形为方波， 但可以想到选择任何合适 的激光脉冲波形， 这都落入本发明的范围中。
在本发明的一个实施例中， 在数据库中存储的钻孔深度和脉冲数的关系 曲线优选是基于实验设计 (DOE)而形成的， 且更优选地为在 DOE基础上通过 数学拟合方法、 尤其是现有技术已知的曲线拟合方法拟合而成的曲线。 例如， 可以针对规定的工件材料类型， 以及激光脉冲的能量级别和 /或频率， 对工件 样本执行 DOE, 测量得到在不同脉冲数下相对应的钻孔深度， 并基于测量值 利用已知的曲线啮合方法得到相应的脉冲数和钻孔深度的关系曲线， 但也可 通过其他合适手段获得关系曲线。
更优选地， 该数据库针对选定的多种不同材料类型或不同的材料硬度值 或范围、 以及激光脉冲不同的单位能量级别存储有相应的关系曲线。 由于通 常被加工的工件材料类型有限 (例如在同一燃气轮机叶片上)，且激光钻孔机用 于加工的激光脉冲的单位能量级别也可有利确定 (例如针对该叶片的所有微孔 加工采用同样的激光脉冲能量级别)， 因此本发明的仿真系统和激光钻孔机可 以特别有利地仿真和 /或加工具有不同的孔位置和取向、 进而具有不同的深度 的大量孔， 如大量冷却微孔。 在一个优选的实施例中， 仿真系统的激光脉冲发生装置输出的脉冲能量 可以小于"真实"的激光钻孔机发出的激光脉冲，由此可以按比例放大由仿真系 统的激光脉冲检测装置检测到的激光脉冲， 并基于放大后的激光脉冲的脉冲 能量选择合适的关系曲线。
例如， 尽管在所示的实施例中， 待钻孔的深度为单一输入值， 但优选输 入多个待钻孔深度、 尤其是待钻孔深度阵列， 例如整个叶片上所有冷却微孔 的深度阵列或者一次激光钻孔加工的冷却微孔的深度阵列。 优选地， 钻孔深 度阵列与各自的钻孔在工件上的位置相关联。 由此， 例如可在仿真系统中仿 真 /可视化逼真的激光钻孔加工过程， 这特别优选地适用于操作人员进行计算 机辅助制造。 更优选地， 根据本发明的仿真系统可以输出激光加工机可读取 的加工文件， 其中例如含有待加工的孔顺序、 相应位置和脉冲数。
以上所述仅为本发明示意性的具体实施方式， 并非用以限定本发明的范 围。 任何本领域的技术人员， 在不脱离本发明的构思和原则的前提下所作的 等同变化、 修改与结合， 均应属于本发明保护的范围。

Claims

权 利 要 求 书
1. 一种激光钻孔的仿真系统 (10,40：)， 包括：
工件信息的输入单元 (20,41)， 用于输入待钻孔工件的材料参数和工件上待 钻孔的深度；
激光脉冲确定单元， 用于确定用来钻孔的激光脉冲的性能参数； 和 处理单元 (18,42)， 用于基于所述待钻孔工件的材料参数和激光脉冲的性能 参数从多个关系曲线中选用一关系曲线,并基于选用的该关系曲线计 算钻设所述孔深度所需的脉冲数， 所述多个关系曲线为在规定的工件 材料参数和激光脉冲性能参数的条件下激光脉冲数与钻孔深度的关
2. 根据权利要求 1所述的仿真系统， 其特征是， 所述工件材料参数为材料 类型或材料硬度，和 /或所述激光脉冲性能参数为激光脉冲的单位能量 级别和 /或频率。
3. 根据权利要求 1或 2所述的仿真系统， 其特征是， 该仿真系统还包括数 据库 (17)， 所述数据库 （17) 中存储有所述多个关系曲线。
4. 根据权利要求 1或 2所述的仿真系统， 其特征是， 该仿真系统包括用于 输出所述孔的深度和相应的脉冲数的输出单元 (44)。
5. 根据权利要求 4的仿真系统， 其特征是， 该仿真系统还包括激光脉冲发 生装置 (11); 且所述激光脉冲确定单元包括配置成检测由激光脉冲发 生装置发出的激光脉冲的性能参数和脉冲数的激光脉冲检测装置 (13), 该仿真系统还包括设置在所述激光脉冲发生装置 （11 ) 和激光 脉冲检测装置 （13 ) 之间的激光脉冲传输路径 (12)。
6. 根据权利要求 5所述的仿真系统， 其特征是， 所述输出单元包括激光钻 孔可视化单元 (21)， 用于可视化地显示工件中随着检测到激光脉冲数 的变化而变化的钻孔深度。
7. 根据权利要求 5所述的仿真系统，其特征是，还包括激光输入控制单元， 配置成用于输入由所述激光脉冲发生装置所发生的激光脉冲性能参 数。
8. 根据权利要求 7所述的仿真系统，还包括与所述激光输入控制单元通信 的信号控制装置 (15)，配置成控制激光脉冲发生装置发出的激光脉冲。
9. 根据权利要求 5所述的仿真系统， 其特征是， 还包括用于可视化地显示 由所述激光脉冲发生装置 （11 ) 发生的激光脉冲的激光输入可视化单 元和配置成可视化地显示由所述激光脉冲检测装置 （13 )检测到的激 光脉冲的激光输出可视化单元 (22)。
10. 根据权利要求 1或 2所述的仿真系统， 其特征是， 所述工件为燃机轮 机叶片 (1)， 所述燃机轮机叶片 (1)包括多个具有 O. lmm-lmm的孔径的 冷却孔。
11. 一种激光钻孔的仿真方法， 包括：
输入待钻设至少一个孔的工件材料参数和孔的深度；
确定用于钻孔的激光脉冲的性能参数；
基于所输入的待钻孔工件的材料参数以及所确定的激光脉冲的性能参数 从多个关系曲线中选用一关系曲线,并基于选用的该关系曲线计算钻 设所述孔深度所需的脉冲数， 所述多个关系曲线为在规定的工件材料 参数和钻孔激光脉冲性能参数的条件下激光脉冲数与钻孔深度的关
12. 根据权利要求 11所述的方法， 其特征是， 还包括检测由激光脉冲装置 发出的脉冲数的歩骤， 和可视化显示工件中随激光脉冲数变化而变化 的钻孔深度的歩骤， 其中所述确定激光脉冲性能参数的歩骤包括检测 激光脉冲的性能参数。
13. 一种激光钻孔机 (30)的控制系统， 包括：
工件信息的输入单元， 配置成输入待钻设至少一个孔的工件材料参数和孔 的深度；
配置成检测激光脉冲的性能参数和脉冲数的激光脉冲检测装置 (33)， 其布 置在所述激光钻孔机中工件位置 (33')处； 和
处理单元， 配置成基于所输入的待钻孔工件的材料参数以及由所述激光脉 冲检测装置检测的激光脉冲的性能参数从多个关系曲线中选用一关 系曲线， 并基于选用的该关系曲线计算钻设所述孔深度所需的脉冲 数， 所述多个关系曲线为在规定的工件材料参数和钻孔激光脉冲的性 能参数的条件下激光脉冲数与钻孔深度的关系曲线。
14. 根据权利要求 13所述的控制系统， 其特征是， 还包括用于采集激光钻 孔机的激光脉冲发生装置的激光脉冲性能参数的数据采集装置 (35); 所述处理单元还配置成对比由所述数据采集装置 (35)采集的激光脉冲 性能参数和由所述激光脉冲检测装置 (33)检测到的激光脉冲性能参 数。
15. 根据权利要求 13或 14所述的控制系统， 其特征是， 所述控制系统还 包括数据库， 其存储有多个所述关系曲线。
16. 一种激光钻孔机， 限定用于安装待加工工件的工件位置 (33')且包括： 激光脉冲发生装置 (31);
激光输送路径 (32); 和
根据权利要求 13至 15中任一项所述的控制系统。
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