ATE425841T1 - Chemisch-mechanische planarisierungsprozesssteuerung mit einem in-situ-aufbereitungsprozess - Google Patents

Chemisch-mechanische planarisierungsprozesssteuerung mit einem in-situ-aufbereitungsprozess

Info

Publication number
ATE425841T1
ATE425841T1 AT05711983T AT05711983T ATE425841T1 AT E425841 T1 ATE425841 T1 AT E425841T1 AT 05711983 T AT05711983 T AT 05711983T AT 05711983 T AT05711983 T AT 05711983T AT E425841 T1 ATE425841 T1 AT E425841T1
Authority
AT
Austria
Prior art keywords
process control
chemical
control signal
conditioning
mechanical planarization
Prior art date
Application number
AT05711983T
Other languages
English (en)
Inventor
Stephen Benner
Yuzhuo Li
Original Assignee
Tbw Ind Inc
Benner Stephen J
Yuzhuo Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tbw Ind Inc, Benner Stephen J, Yuzhuo Li filed Critical Tbw Ind Inc
Application granted granted Critical
Publication of ATE425841T1 publication Critical patent/ATE425841T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Catalysts (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Treatment Of Metals (AREA)
AT05711983T 2004-01-26 2005-01-25 Chemisch-mechanische planarisierungsprozesssteuerung mit einem in-situ-aufbereitungsprozess ATE425841T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53916304P 2004-01-26 2004-01-26
US11/042,999 US7166014B2 (en) 2004-01-26 2005-01-25 Chemical mechanical planarization process control utilizing in-situ conditioning process

Publications (1)

Publication Number Publication Date
ATE425841T1 true ATE425841T1 (de) 2009-04-15

Family

ID=34798227

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05711983T ATE425841T1 (de) 2004-01-26 2005-01-25 Chemisch-mechanische planarisierungsprozesssteuerung mit einem in-situ-aufbereitungsprozess

Country Status (8)

Country Link
US (1) US7166014B2 (de)
EP (1) EP1708848B1 (de)
JP (1) JP2007520083A (de)
CN (1) CN1910011B (de)
AT (1) ATE425841T1 (de)
DE (1) DE602005013356D1 (de)
IL (1) IL177027A (de)
WO (1) WO2005072332A2 (de)

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CN102343553B (zh) * 2011-09-28 2015-06-17 上海华虹宏力半导体制造有限公司 修整器装置及其检测方法
CN103381575A (zh) * 2012-05-03 2013-11-06 旺宏电子股份有限公司 平坦化修正臂、应用其的平坦化系统及平坦化方法
US20140024293A1 (en) * 2012-07-19 2014-01-23 Jimin Zhang Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
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WO2014149676A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus
US9452506B2 (en) * 2014-07-15 2016-09-27 Applied Materials, Inc. Vacuum cleaning systems for polishing pads, and related methods
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JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
CN107914213B (zh) * 2016-10-10 2020-06-05 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨方法
US11923208B2 (en) * 2017-05-19 2024-03-05 Illinois Tool Works Inc. Methods and apparatuses for chemical delivery for brush conditioning
US10286517B2 (en) * 2017-08-08 2019-05-14 Micron Technology, Inc. Polishing apparatuses
CN109664162B (zh) * 2017-10-17 2020-02-07 长鑫存储技术有限公司 在金属栓塞的化学机械研磨中的制程动态优化方法及系统
DE102018106086A1 (de) * 2018-03-15 2019-09-19 Ferrobotics Compliant Robot Technology Gmbh Drehzahlsteuerung beim robotergestützten schleifen
CN110328561A (zh) * 2018-03-30 2019-10-15 长鑫存储技术有限公司 化学机械研磨方法、系统及金属插塞的制备方法
US11244834B2 (en) * 2018-07-31 2022-02-08 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry recycling for chemical mechanical polishing system
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
US20230191554A1 (en) * 2020-04-27 2023-06-22 Konica Minolta, Inc. Polishing system
US12017325B2 (en) * 2021-03-04 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for removing debris during chemical mechanical planarization
CN112908871B (zh) * 2021-04-08 2025-05-06 江阴长电先进封装有限公司 一种晶圆级层压塑封圆片的裁切成型方法

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Also Published As

Publication number Publication date
WO2005072332B1 (en) 2006-06-22
CN1910011A (zh) 2007-02-07
US7166014B2 (en) 2007-01-23
IL177027A (en) 2010-06-16
US20050164606A1 (en) 2005-07-28
WO2005072332A2 (en) 2005-08-11
WO2005072332A3 (en) 2006-03-16
JP2007520083A (ja) 2007-07-19
IL177027A0 (en) 2006-12-10
DE602005013356D1 (de) 2009-04-30
EP1708848A4 (de) 2007-05-30
EP1708848B1 (de) 2009-03-18
CN1910011B (zh) 2010-12-15
EP1708848A2 (de) 2006-10-11

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