ATE417352T1 - Magnetische einrichtung - Google Patents

Magnetische einrichtung

Info

Publication number
ATE417352T1
ATE417352T1 AT04718897T AT04718897T ATE417352T1 AT E417352 T1 ATE417352 T1 AT E417352T1 AT 04718897 T AT04718897 T AT 04718897T AT 04718897 T AT04718897 T AT 04718897T AT E417352 T1 ATE417352 T1 AT E417352T1
Authority
AT
Austria
Prior art keywords
circuit board
thermally conductive
winding
thermally
covered
Prior art date
Application number
AT04718897T
Other languages
English (en)
Inventor
Nigel Springett
Original Assignee
Det Int Holding Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Det Int Holding Ltd filed Critical Det Int Holding Ltd
Application granted granted Critical
Publication of ATE417352T1 publication Critical patent/ATE417352T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Liquid Crystal (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
AT04718897T 2004-03-10 2004-03-10 Magnetische einrichtung ATE417352T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CH2004/000141 WO2005086185A1 (en) 2004-03-10 2004-03-10 Magnetic device

Publications (1)

Publication Number Publication Date
ATE417352T1 true ATE417352T1 (de) 2008-12-15

Family

ID=34916967

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04718897T ATE417352T1 (de) 2004-03-10 2004-03-10 Magnetische einrichtung

Country Status (6)

Country Link
US (1) US7468648B2 (de)
EP (1) EP1723657B1 (de)
CN (1) CN1926646A (de)
AT (1) ATE417352T1 (de)
DE (1) DE602004018393D1 (de)
WO (1) WO2005086185A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8164406B2 (en) * 2006-05-26 2012-04-24 Delta Electronics, Inc. Transformer
CN101795539B (zh) * 2010-01-13 2011-11-09 深南电路有限公司 埋电感电路板的加工方法
JP5527121B2 (ja) * 2010-09-09 2014-06-18 株式会社豊田自動織機 誘導機器の放熱構造
CN101980589B (zh) * 2010-10-27 2012-10-17 华为技术有限公司 一种电源模块电路板的制作方法、电源模块及其磁芯
JP5703744B2 (ja) * 2010-12-24 2015-04-22 株式会社豊田自動織機 誘導機器
US9263177B1 (en) * 2012-03-19 2016-02-16 Volterra Semiconductor LLC Pin inductors and associated systems and methods
US8824161B2 (en) * 2012-06-15 2014-09-02 Medtronic, Inc. Integrated circuit packaging for implantable medical devices
US8944148B2 (en) 2012-07-23 2015-02-03 King Fahd University Of Petroleum And Minerals Add-on heat sink
US9281739B2 (en) 2012-08-29 2016-03-08 Volterra Semiconductor LLC Bridge magnetic devices and associated systems and methods
US9083332B2 (en) 2012-12-05 2015-07-14 Volterra Semiconductor Corporation Integrated circuits including magnetic devices
US9253910B2 (en) * 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
JP6084079B2 (ja) * 2013-03-15 2017-02-22 オムロンオートモーティブエレクトロニクス株式会社 磁気デバイス
JP5751293B2 (ja) * 2013-08-13 2015-07-22 Tdk株式会社 プリント基板及び電源装置
US10141107B2 (en) * 2013-10-10 2018-11-27 Analog Devices, Inc. Miniature planar transformer
US9959967B2 (en) 2014-05-15 2018-05-01 Analog Devices, Inc. Magnetic devices and methods for manufacture using flex circuits
US9773588B2 (en) * 2014-05-16 2017-09-26 Rohm Co., Ltd. Chip parts
CN105163490B (zh) * 2015-08-17 2017-11-07 广东欧珀移动通信有限公司 一种多功能元器件
WO2017221476A1 (ja) * 2016-06-24 2017-12-28 三菱電機株式会社 絶縁型コンバータ
GB201612032D0 (en) 2016-07-11 2016-08-24 High Speed Trans Solutions Ltd Isolating transformer
US10959319B2 (en) * 2016-10-25 2021-03-23 Telefonaktiebolaget Lm Ericsson (Publ) Cooling package and power module
DE112017006217T5 (de) * 2016-12-09 2019-08-29 Mitsubishi Electric Corporation Elektronische Leiterplatte und Enrgie-Umwandlungseinrichtung
CN107610903A (zh) * 2017-09-27 2018-01-19 联合汽车电子有限公司 集成供电装置
US11594361B1 (en) 2018-12-18 2023-02-28 Smart Wires Inc. Transformer having passive cooling topology
WO2021108463A1 (en) * 2019-11-25 2021-06-03 Electronic Theatre Controls, Inc. Light module aperture for printed circuit board integration
EP3905859B1 (de) * 2020-04-01 2023-08-30 Hamilton Sundstrand Corporation Thermische verwaltung von wicklungen und kernen planarer transformatoren
FR3109837B1 (fr) 2020-05-04 2023-12-22 Mbda France Transformateur planaire équipé de composants, carte mère comprenant un tel transformateur planaire et procédé d’assemblage d’une telle carte mère.
CN113707433B (zh) * 2021-10-28 2021-12-21 广东力王高新科技股份有限公司 微小化平面变压器
WO2024116850A1 (ja) * 2022-11-30 2024-06-06 三菱電機株式会社 コイル装置および電力変換装置
EP4498763A1 (de) * 2023-07-25 2025-01-29 Mitsubishi Electric R&D Centre Europe B.V. Verfahren zur herstellung einer leiterplatte mit eingebettetem kühlhohlraum

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0507360B1 (de) 1991-01-30 1996-05-08 The Boeing Company Bus-Ankoppler in Strombetriebsart mit flachen Spulen und Abschirmungen
EP0735551B1 (de) * 1995-03-29 2002-02-27 Valeo Electronique Transformatoreinrichtung, insbesondere für eine Versorgungseinrichtung von Entladungslampen in Kraftfahrzeugen
EP0741395A1 (de) 1995-05-04 1996-11-06 AT&T IPM Corp. Anschluss-montierbare planare magnetischen Vorrichtung und ihr Herstellungsverfahren
FI962803A0 (fi) 1996-07-10 1996-07-10 Nokia Telecommunications Oy Planartransformator
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
GB9620356D0 (en) 1996-09-27 1996-11-13 Lucas Ind Plc Electromagnetic structure
US6466454B1 (en) * 1999-05-18 2002-10-15 Ascom Energy Systems Ag Component transformer
DE10065420C2 (de) * 2000-12-27 2003-08-07 Siemens Ag Flusspumpe mit Hochtemperatursupraleiter und damit zu betreibender supraleitender Elektromagnet
WO2004040599A1 (en) 2002-10-31 2004-05-13 Delta Energy Systems (Switzerland) Ag A circuit board with a planar magnetic element

Also Published As

Publication number Publication date
WO2005086185A1 (en) 2005-09-15
EP1723657B1 (de) 2008-12-10
EP1723657A1 (de) 2006-11-22
CN1926646A (zh) 2007-03-07
US7468648B2 (en) 2008-12-23
DE602004018393D1 (de) 2009-01-22
US20070296533A1 (en) 2007-12-27

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