ATE41067T1 - Vorrichtung um einen teil eines photoempfindlichen films auf wenigstens eine seite einer flachen platte aufzutragen, die eine groessere oberflaeche besitzt als der besagte teil. - Google Patents

Vorrichtung um einen teil eines photoempfindlichen films auf wenigstens eine seite einer flachen platte aufzutragen, die eine groessere oberflaeche besitzt als der besagte teil.

Info

Publication number
ATE41067T1
ATE41067T1 AT82201590T AT82201590T ATE41067T1 AT E41067 T1 ATE41067 T1 AT E41067T1 AT 82201590 T AT82201590 T AT 82201590T AT 82201590 T AT82201590 T AT 82201590T AT E41067 T1 ATE41067 T1 AT E41067T1
Authority
AT
Austria
Prior art keywords
plate
film
applying
flat plate
photosensitive film
Prior art date
Application number
AT82201590T
Other languages
English (en)
Inventor
Arcangelo Bruno Ceraso
Original Assignee
Thiokol Morton Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11258967&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE41067(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Thiokol Morton Ltd filed Critical Thiokol Morton Ltd
Application granted granted Critical
Publication of ATE41067T1 publication Critical patent/ATE41067T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1074—Separate cutting of separate sheets or webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/125—Plural severing means each acting on a different work piece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1741—Progressive continuous bonding press [e.g., roll couples]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AT82201590T 1982-02-10 1982-12-13 Vorrichtung um einen teil eines photoempfindlichen films auf wenigstens eine seite einer flachen platte aufzutragen, die eine groessere oberflaeche besitzt als der besagte teil. ATE41067T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT8246808A IT1210033B (it) 1982-02-10 1982-02-10 Macchina per applicare una porzione di film fotosensibile su almeno unafaccia di una lastra piana avente una estensione superficiale maggiore di detta porzione
EP82201590A EP0085793B1 (de) 1982-02-10 1982-12-13 Vorrichtung um einen Teil eines photoempfindlichen Films auf wenigstens eine Seite einer flachen Platte aufzutragen, die eine grössere Oberfläche besitzt als der besagte Teil

Publications (1)

Publication Number Publication Date
ATE41067T1 true ATE41067T1 (de) 1989-03-15

Family

ID=11258967

Family Applications (1)

Application Number Title Priority Date Filing Date
AT82201590T ATE41067T1 (de) 1982-02-10 1982-12-13 Vorrichtung um einen teil eines photoempfindlichen films auf wenigstens eine seite einer flachen platte aufzutragen, die eine groessere oberflaeche besitzt als der besagte teil.

Country Status (5)

Country Link
US (2) US4650536A (de)
EP (1) EP0085793B1 (de)
AT (1) ATE41067T1 (de)
DE (1) DE3279481D1 (de)
IT (1) IT1210033B (de)

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US4909890A (en) * 1988-05-06 1990-03-20 Bonnyman Arthur W Apparatus for protective film lamination
US4946524A (en) * 1989-03-02 1990-08-07 Morton International, Inc. Applicator and method for applying dry film solder mask on a board
AU650636B2 (en) * 1990-02-05 1994-06-30 Molins Plc Image applying method and apparatus
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US6159327A (en) * 1996-04-12 2000-12-12 Polaroid Corporation Apparatus and method for applying heat bondable lamina to a substrate
US5783024A (en) * 1996-04-12 1998-07-21 Nbs Imaging Systems, Inc. Apparatus for applying heat bondable lamina to a substrate
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US6176286B1 (en) 1998-07-16 2001-01-23 Somar Corporation Film applying apparatus
FR2804065B1 (fr) * 2000-01-24 2002-10-11 Haironville Sa Procede de fabrication de produits multicouches comprenant des reservations et dispositif de mise en oeuvre de ce procede
WO2002092343A2 (en) 2001-05-16 2002-11-21 Xyron, Inc. An article laminating apparatus with operation-adjusting cartridge detection and/or improved heating and/or improved cutting
ATE552120T1 (de) 2001-12-24 2012-04-15 L 1 Secure Credentialing Inc Verdeckte variableninformationen auf id- dokumenten und verfahren zu ihrer herstellung
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
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US7383999B2 (en) 2004-12-28 2008-06-10 Digimarc Corporation ID document structure with pattern coating providing variable security features
US7638012B2 (en) * 2005-11-10 2009-12-29 Datacard Corporation Lamination of patch films on personalized cards through heat transfer
EP1961578A1 (de) * 2007-02-26 2008-08-27 Kba-Giori S.A. Verfahren und Einrichtung zum Aufbringen von Folienmaterial auf aufeinanderfolgende Bogen
EP2100736A1 (de) * 2008-03-14 2009-09-16 Kba-Giori S.A. Verfahren und Einrichtung zum Aufbringen von Folienmaterial auf aufeinanderfolgende Bahnen
EP2141027A1 (de) 2008-07-03 2010-01-06 Kba-Giori S.A. Verfahren und Einrichtung zum Aufbringen von Folienmaterial auf aufeinander folgende Bahnen

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Also Published As

Publication number Publication date
IT1210033B (it) 1989-09-06
US4702789A (en) 1987-10-27
EP0085793B1 (de) 1989-03-01
IT8246808A0 (it) 1982-02-10
EP0085793A2 (de) 1983-08-17
EP0085793A3 (en) 1984-12-19
US4650536A (en) 1987-03-17
DE3279481D1 (en) 1989-04-06

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