ATE405602T1 - Polyarylen mit verminderter wärmeausdehung - Google Patents
Polyarylen mit verminderter wärmeausdehungInfo
- Publication number
- ATE405602T1 ATE405602T1 AT03789983T AT03789983T ATE405602T1 AT E405602 T1 ATE405602 T1 AT E405602T1 AT 03789983 T AT03789983 T AT 03789983T AT 03789983 T AT03789983 T AT 03789983T AT E405602 T1 ATE405602 T1 AT E405602T1
- Authority
- AT
- Austria
- Prior art keywords
- thermal expansion
- polyarylene
- reduced thermal
- crosslinked polyarylene
- high temperatures
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
- C08G2261/312—Non-condensed aromatic systems, e.g. benzene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/40—Polymerisation processes
- C08G2261/46—Diels-Alder reactions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/90—Applications
- C08G2261/92—TFT applications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/334,413 US6818285B2 (en) | 2002-12-31 | 2002-12-31 | Composition and method to achieve reduced thermal expansion in polyarylene networks |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE405602T1 true ATE405602T1 (de) | 2008-09-15 |
Family
ID=32655041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03789983T ATE405602T1 (de) | 2002-12-31 | 2003-11-24 | Polyarylen mit verminderter wärmeausdehung |
Country Status (11)
Country | Link |
---|---|
US (1) | US6818285B2 (de) |
EP (1) | EP1581578B1 (de) |
JP (1) | JP2006512768A (de) |
KR (1) | KR101022181B1 (de) |
CN (1) | CN100575385C (de) |
AT (1) | ATE405602T1 (de) |
AU (1) | AU2003294498A1 (de) |
DE (1) | DE60323152D1 (de) |
HK (1) | HK1084405A1 (de) |
TW (1) | TWI340750B (de) |
WO (1) | WO2004060960A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004090018A1 (en) * | 2003-04-02 | 2004-10-21 | Dow Global Technologies Inc. | Multifunctional substituted monomers and polyarylene compositions therefrom |
JP2005142473A (ja) * | 2003-11-10 | 2005-06-02 | Semiconductor Leading Edge Technologies Inc | 半導体装置の製造方法 |
US20080090007A1 (en) * | 2004-06-10 | 2008-04-17 | Niu Q Jason | Method Of Forming A Nanoporous Dielectric Film |
CN101100420B (zh) * | 2006-07-06 | 2010-12-29 | 中国科学院化学研究所 | 合成3,3’-(氧联二-1,4-亚苯基)双(2,4,5-三苯基环戊二烯酮)的方法 |
US9868820B2 (en) * | 2014-08-29 | 2018-01-16 | Rohm And Haas Electronic Materials Llc | Polyarylene materials |
US9752051B2 (en) * | 2015-04-06 | 2017-09-05 | Rohm And Haas Electronic Materials Llc | Polyarylene polymers |
US20170009006A1 (en) * | 2015-07-06 | 2017-01-12 | Rohm And Haas Electronic Materials Llc | Polyarylene materials |
US11042093B2 (en) | 2017-11-15 | 2021-06-22 | Rohm And Haas Electronic Materials Llc | Gap-filling method |
GB202010228D0 (en) * | 2020-07-03 | 2020-08-19 | Sumitomo Chemical Co | Thermally conductive material for electronic devices |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4339526A (en) | 1981-06-24 | 1982-07-13 | International Business Machines Corporation | Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices |
US4400540A (en) * | 1982-04-08 | 1983-08-23 | The United States Of America As Represented By The Secretary Of The Air Force | Oxy and thioaryl-phenylated aromatic biscyclopentadienones |
US5093279A (en) * | 1991-02-01 | 1992-03-03 | International Business Machines Corporation | Laser ablation damascene process |
US5262354A (en) * | 1992-02-26 | 1993-11-16 | International Business Machines Corporation | Refractory metal capped low resistivity metal conductor lines and vias |
US5486493A (en) * | 1994-02-25 | 1996-01-23 | Jeng; Shin-Puu | Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators |
US5550405A (en) * | 1994-12-21 | 1996-08-27 | Advanced Micro Devices, Incorporated | Processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ICS |
US5959157A (en) * | 1995-06-26 | 1999-09-28 | Alliedsignal, Inc. | Process for making hydroxy-substituted ethynylated biphenyl compounds |
US5965679A (en) | 1996-09-10 | 1999-10-12 | The Dow Chemical Company | Polyphenylene oligomers and polymers |
JP2000191752A (ja) * | 1998-12-25 | 2000-07-11 | Dow Chem Co:The | ポリフェニレンオリゴマ―及びポリマ― |
EP1157059A1 (de) | 1999-01-08 | 2001-11-28 | The Dow Chemical Company | Polymere mit einer niedriegen dielektrischen konstante, guten haftung und zähigkeit, und die daraus hergestellten gegenstände |
US6107357A (en) * | 1999-11-16 | 2000-08-22 | International Business Machines Corporatrion | Dielectric compositions and method for their manufacture |
US6359091B1 (en) | 1999-11-22 | 2002-03-19 | The Dow Chemical Company | Polyarylene compositions with enhanced modulus profiles |
-
2002
- 2002-12-31 US US10/334,413 patent/US6818285B2/en not_active Expired - Fee Related
-
2003
- 2003-11-24 CN CN200380109350A patent/CN100575385C/zh not_active Expired - Lifetime
- 2003-11-24 AT AT03789983T patent/ATE405602T1/de not_active IP Right Cessation
- 2003-11-24 DE DE60323152T patent/DE60323152D1/de not_active Expired - Lifetime
- 2003-11-24 WO PCT/US2003/037535 patent/WO2004060960A1/en active Application Filing
- 2003-11-24 EP EP03789983A patent/EP1581578B1/de not_active Expired - Lifetime
- 2003-11-24 AU AU2003294498A patent/AU2003294498A1/en not_active Abandoned
- 2003-11-24 JP JP2004565094A patent/JP2006512768A/ja active Pending
- 2003-11-24 KR KR1020057012365A patent/KR101022181B1/ko active IP Right Grant
- 2003-11-27 TW TW092133362A patent/TWI340750B/zh not_active IP Right Cessation
-
2006
- 2006-04-03 HK HK06104079A patent/HK1084405A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN100575385C (zh) | 2009-12-30 |
KR20050091042A (ko) | 2005-09-14 |
TWI340750B (en) | 2011-04-21 |
EP1581578B1 (de) | 2008-08-20 |
DE60323152D1 (de) | 2008-10-02 |
KR101022181B1 (ko) | 2011-03-17 |
JP2006512768A (ja) | 2006-04-13 |
CN1745120A (zh) | 2006-03-08 |
WO2004060960A1 (en) | 2004-07-22 |
HK1084405A1 (en) | 2006-07-28 |
EP1581578A1 (de) | 2005-10-05 |
AU2003294498A1 (en) | 2004-07-29 |
US6818285B2 (en) | 2004-11-16 |
TW200427724A (en) | 2004-12-16 |
US20040126586A1 (en) | 2004-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1084405A1 (en) | Composition and method to achieve reduced thermal expansion in polyarylene networks | |
TW200613388A (en) | Oriented polyester film | |
DE60108576D1 (de) | Wärmeleitfähige Polymerzusammensetzung und wärmeleitfähiger geformter Gegenstand | |
WO2003087221A3 (en) | Thermally conductive phase change materials | |
MXPA03004772A (es) | Composiciones adhesivas sensibles a presion reticuladas y articulos adhesivos basados en las mismas, utiles en aplicaciones a alta temperatura. | |
DE60234558D1 (de) | Brennkammerhemd mit hybrider Filmkühlung | |
DE69934653D1 (de) | Brennkammerhemd mit Filmkühlung | |
DE60110180D1 (de) | Wärmeleitfähige Polymerfolie | |
AU2003247766A1 (en) | Thermally insulating products for footwear and other apparel | |
WO2001065626A3 (en) | Thermal management of battery systems | |
DE60312358D1 (de) | Photovoltaisches modul mit einstellbarem kühlkörper und herstellungsverfahren | |
SE9901831L (sv) | Bärare för elektronikkomponenter | |
BR9917095A (pt) | Material compósito termicamente condutivo | |
CA2232425A1 (en) | Functionally gradient material and its use in a semiconductor circuit substrate | |
TW200501458A (en) | High powered light emitter packages with compact optics | |
WO2005115742A3 (en) | Improved thermal interface material | |
GB0413079D0 (en) | Electronic thermal management utilising device with deflectable, two leg conductive member; and with elastic, thermally-conductive material therebetween | |
DE60219739D1 (de) | Kühlkreislauf mit Ejektor | |
DE60043923D1 (de) | Turbinenbeschaufelung mit geschlossenem Kühlkreislauf | |
DE60334049D1 (de) | Glas- und Bandzusammensetzung mit hoher Wärmeausdehnung | |
ATE504069T1 (de) | Hochleistungswiderstand mit verbessertem betriebstemperaturbereich und herstellungsverfahren dafür | |
DE50113270D1 (de) | Integrierte schaltung mit temperatursensor | |
ATE460126T1 (de) | Thermische kaustikvorrichtungen mit verbesserten heizprofilen | |
ATE363131T1 (de) | Schnell aufheizende kathode | |
DE60321498D1 (de) | Gegen Temperatur-, Spannungs- und Herstellungsschwankungen kompensierte Logikschaltung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |