ATE396790T1 - Direkter auftrag von metallischen leitermustern auf isolierflächen - Google Patents
Direkter auftrag von metallischen leitermustern auf isolierflächenInfo
- Publication number
- ATE396790T1 ATE396790T1 AT03770492T AT03770492T ATE396790T1 AT E396790 T1 ATE396790 T1 AT E396790T1 AT 03770492 T AT03770492 T AT 03770492T AT 03770492 T AT03770492 T AT 03770492T AT E396790 T1 ATE396790 T1 AT E396790T1
- Authority
- AT
- Austria
- Prior art keywords
- direct application
- insulating surfaces
- metallic particles
- gas jet
- metal conduct
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulated Conductors (AREA)
- Inorganic Insulating Materials (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43414102P | 2002-12-17 | 2002-12-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE396790T1 true ATE396790T1 (de) | 2008-06-15 |
Family
ID=32713014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03770492T ATE396790T1 (de) | 2002-12-17 | 2003-09-26 | Direkter auftrag von metallischen leitermustern auf isolierflächen |
Country Status (6)
Country | Link |
---|---|
US (1) | US7208193B2 (de) |
EP (1) | EP1572377B1 (de) |
AT (1) | ATE396790T1 (de) |
AU (1) | AU2003278982A1 (de) |
DE (1) | DE60321381D1 (de) |
WO (1) | WO2004060579A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004047357A1 (de) * | 2004-09-29 | 2006-04-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung |
US20080102225A1 (en) * | 2005-03-23 | 2008-05-01 | Braun Christopher P | Method for Manufacturing a Device Using Imprint Lithography and Direct Write Technology |
CN100413598C (zh) * | 2006-06-30 | 2008-08-27 | 华中科技大学 | 一种电子浆料雾化沉积直写装置 |
WO2009020804A1 (en) * | 2007-08-06 | 2009-02-12 | Olzak James M | Method of depositing electrically conductive material onto a substrate |
US20090214772A1 (en) * | 2008-02-27 | 2009-08-27 | Seoul National University Industry Foundation | Method and apparatus for coating powder material on substrate |
JP2010047825A (ja) * | 2008-08-25 | 2010-03-04 | Mitsubishi Heavy Ind Ltd | 金属皮膜の形成方法及び航空宇宙構造部材 |
WO2010137286A1 (ja) * | 2009-05-28 | 2010-12-02 | パナソニック株式会社 | 焼成装置 |
US9023423B2 (en) * | 2009-10-07 | 2015-05-05 | General Electric Company | Method of deposition of metallic coatings using atomized spray |
EP2596152B1 (de) * | 2010-07-15 | 2019-12-18 | Commonwealth Scientific and Industrial Research Organisation | Oberflächenbehandlung |
CN102011123B (zh) * | 2010-11-26 | 2012-07-04 | 华中科技大学 | 一种激光微熔覆专用设备 |
US8635767B2 (en) | 2011-01-05 | 2014-01-28 | Thoe Boeing Company | System for depositing microwire |
KR20140127802A (ko) * | 2012-01-27 | 2014-11-04 | 엔디에스유 리서치 파운데이션 | 인쇄 마이크로 전자를 위한 마이크로 콜드 스프레이 직접 기록 시스템 및 방법 |
US9346550B2 (en) * | 2012-12-05 | 2016-05-24 | Mesoscribe Technologies, Inc. | Ice detection and mitigation device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931322A (en) * | 1986-04-01 | 1990-06-05 | Honda Giken Kogyo Kabushiki | Method and apparatus for painting object |
JP4248037B2 (ja) * | 1997-02-04 | 2009-04-02 | 株式会社不二機販 | 金属被膜の形成方法 |
WO2001081648A1 (en) * | 2000-04-20 | 2001-11-01 | Vanderbilt University | Method and system for thick-film deposition of ceramic materials |
US6673386B2 (en) * | 2000-06-29 | 2004-01-06 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for forming pattern onto panel substrate |
US6592935B2 (en) * | 2001-05-30 | 2003-07-15 | Ford Motor Company | Method of manufacturing electromagnetic devices using kinetic spray |
-
2003
- 2003-09-26 DE DE60321381T patent/DE60321381D1/de not_active Expired - Lifetime
- 2003-09-26 WO PCT/US2003/030425 patent/WO2004060579A1/en not_active Application Discontinuation
- 2003-09-26 US US10/504,343 patent/US7208193B2/en not_active Expired - Lifetime
- 2003-09-26 AU AU2003278982A patent/AU2003278982A1/en not_active Abandoned
- 2003-09-26 AT AT03770492T patent/ATE396790T1/de not_active IP Right Cessation
- 2003-09-26 EP EP03770492A patent/EP1572377B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1572377A1 (de) | 2005-09-14 |
US7208193B2 (en) | 2007-04-24 |
EP1572377A4 (de) | 2006-03-15 |
US20060068087A1 (en) | 2006-03-30 |
AU2003278982A1 (en) | 2004-07-29 |
DE60321381D1 (de) | 2008-07-10 |
WO2004060579A1 (en) | 2004-07-22 |
EP1572377B1 (de) | 2008-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |