ATE376264T1 - Integriertes mikrowellenmodul und entsprechendes verfahren zu dessen herstellung - Google Patents

Integriertes mikrowellenmodul und entsprechendes verfahren zu dessen herstellung

Info

Publication number
ATE376264T1
ATE376264T1 AT01440107T AT01440107T ATE376264T1 AT E376264 T1 ATE376264 T1 AT E376264T1 AT 01440107 T AT01440107 T AT 01440107T AT 01440107 T AT01440107 T AT 01440107T AT E376264 T1 ATE376264 T1 AT E376264T1
Authority
AT
Austria
Prior art keywords
microwave module
integrated microwave
conductive
substrate
corresponding method
Prior art date
Application number
AT01440107T
Other languages
English (en)
Inventor
Philippe Poire
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Application granted granted Critical
Publication of ATE376264T1 publication Critical patent/ATE376264T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
AT01440107T 2001-04-17 2001-04-17 Integriertes mikrowellenmodul und entsprechendes verfahren zu dessen herstellung ATE376264T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01440107A EP1251580B1 (de) 2001-04-17 2001-04-17 Integriertes Mikrowellenmodul und entsprechendes Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
ATE376264T1 true ATE376264T1 (de) 2007-11-15

Family

ID=8183214

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01440107T ATE376264T1 (de) 2001-04-17 2001-04-17 Integriertes mikrowellenmodul und entsprechendes verfahren zu dessen herstellung

Country Status (4)

Country Link
US (1) US6917262B2 (de)
EP (1) EP1251580B1 (de)
AT (1) ATE376264T1 (de)
DE (1) DE60130969T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9270003B2 (en) * 2012-12-06 2016-02-23 Anaren, Inc. Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
US9786975B2 (en) 2015-08-04 2017-10-10 Raytheon Company Transmission line formed of printed self-supporting metallic material
GB2546794B (en) 2016-01-29 2020-01-08 Teraview Ltd A transmission line
US10651526B2 (en) * 2016-08-16 2020-05-12 Samsung Electronics Co., Ltd. Flexible flat cable comprising stacked insulating layers covered by a conductive outer skin and method for manufacturing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801905A (en) * 1987-04-23 1989-01-31 Hewlett-Packard Company Microstrip shielding system
JP2772739B2 (ja) * 1991-06-20 1998-07-09 いわき電子株式会社 リードレスパッケージの外部電極構造及びその製造方法
US5436405A (en) * 1993-02-12 1995-07-25 Alcatel Network Systems, Inc. Electromagnetically shielded microstrip circuit and method of fabrication
JPH0923107A (ja) * 1995-07-10 1997-01-21 Nippon Telegr & Teleph Corp <Ntt> シールド型コプレーナガイド伝送線路
US6175287B1 (en) * 1997-05-28 2001-01-16 Raytheon Company Direct backside interconnect for multiple chip assemblies
US5939784A (en) * 1997-09-09 1999-08-17 Amkor Technology, Inc. Shielded surface acoustical wave package
FR2776435B1 (fr) 1998-03-19 2000-04-28 Alsthom Cge Alcatel Amplificateur a grand gain
JP2001077608A (ja) * 1999-09-06 2001-03-23 Toyota Motor Corp 伝送線路

Also Published As

Publication number Publication date
DE60130969D1 (de) 2007-11-29
EP1251580A1 (de) 2002-10-23
EP1251580B1 (de) 2007-10-17
US6917262B2 (en) 2005-07-12
US20020149039A1 (en) 2002-10-17
DE60130969T2 (de) 2008-02-28

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Legal Events

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