ATE341749T1 - Kalorimetrischer durchflussmesser - Google Patents
Kalorimetrischer durchflussmesserInfo
- Publication number
- ATE341749T1 ATE341749T1 AT04725444T AT04725444T ATE341749T1 AT E341749 T1 ATE341749 T1 AT E341749T1 AT 04725444 T AT04725444 T AT 04725444T AT 04725444 T AT04725444 T AT 04725444T AT E341749 T1 ATE341749 T1 AT E341749T1
- Authority
- AT
- Austria
- Prior art keywords
- lead frame
- channel
- integrated circuit
- holes
- flow meter
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6847—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow where sensing or heating elements are not disturbing the fluid flow, e.g. elements mounted outside the flow duct
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Volume Flow (AREA)
- Paper (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0307616.3A GB0307616D0 (en) | 2003-04-02 | 2003-04-02 | Calorimetric flow meter |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE341749T1 true ATE341749T1 (de) | 2006-10-15 |
Family
ID=9956050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04725444T ATE341749T1 (de) | 2003-04-02 | 2004-04-02 | Kalorimetrischer durchflussmesser |
Country Status (7)
Country | Link |
---|---|
US (1) | US7691652B2 (de) |
EP (1) | EP1623190B1 (de) |
AT (1) | ATE341749T1 (de) |
DE (1) | DE602004002690T2 (de) |
ES (1) | ES2274443T3 (de) |
GB (1) | GB0307616D0 (de) |
WO (1) | WO2004088255A2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007063407A2 (en) * | 2005-12-02 | 2007-06-07 | Melexis Nv | Thermal mass flow meter |
US7261003B2 (en) * | 2006-01-03 | 2007-08-28 | Freescale Semiconductor, Inc. | Flowmeter and method for the making thereof |
US7755466B2 (en) * | 2006-04-26 | 2010-07-13 | Honeywell International Inc. | Flip-chip flow sensor |
US7513149B1 (en) * | 2007-11-30 | 2009-04-07 | Honeywell International Inc. | Robust MEMS flow die with integrated protective flow channel |
EP2154713B1 (de) * | 2008-08-11 | 2013-01-02 | Sensirion AG | Verfahren zur Herstellung einer Messvorrichtung mit einer Spannungsverminderungsschicht |
US7765872B2 (en) * | 2008-11-19 | 2010-08-03 | Honeywell International Inc. | Flow sensor apparatus and method with media isolated electrical connections |
EP2224218B1 (de) * | 2009-02-25 | 2018-11-28 | Sensirion Automotive Solutions AG | Sensor in einer geformten Verpackung und Herstellungsverfahren dafür |
US8356514B2 (en) | 2011-01-13 | 2013-01-22 | Honeywell International Inc. | Sensor with improved thermal stability |
US8640552B2 (en) | 2011-09-06 | 2014-02-04 | Honeywell International Inc. | MEMS airflow sensor die incorporating additional circuitry on the die |
JP5743922B2 (ja) * | 2012-02-21 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式空気流量測定装置 |
JP5632881B2 (ja) * | 2012-06-15 | 2014-11-26 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
US8833384B2 (en) | 2012-08-06 | 2014-09-16 | Schneider Electric Buildings, Llc | Advanced valve actuation system with integral freeze protection |
US9534795B2 (en) | 2012-10-05 | 2017-01-03 | Schneider Electric Buildings, Llc | Advanced valve actuator with remote location flow reset |
US10295080B2 (en) | 2012-12-11 | 2019-05-21 | Schneider Electric Buildings, Llc | Fast attachment open end direct mount damper and valve actuator |
US10007239B2 (en) | 2013-03-15 | 2018-06-26 | Schneider Electric Buildings Llc | Advanced valve actuator with integral energy metering |
WO2014143922A1 (en) | 2013-03-15 | 2014-09-18 | Schneider Electric Buildings, Llc | Advanced valve actuator with true flow feedback |
GB2553681B (en) | 2015-01-07 | 2019-06-26 | Homeserve Plc | Flow detection device |
US10107662B2 (en) | 2015-01-30 | 2018-10-23 | Honeywell International Inc. | Sensor assembly |
GB201501935D0 (en) | 2015-02-05 | 2015-03-25 | Tooms Moore Consulting Ltd And Trow Consulting Ltd | Water flow analysis |
US20160370809A1 (en) * | 2015-06-19 | 2016-12-22 | Hni Technologies Inc. | Fluid flow system |
US10139256B2 (en) * | 2015-08-03 | 2018-11-27 | Aceinna, Inc. | MEMS flow sensor |
US20170115149A1 (en) * | 2015-10-27 | 2017-04-27 | Memsic, Inc. | Removable high flow impedance module in flow sensor bypass circuit |
CN111033186B (zh) * | 2017-09-05 | 2022-01-07 | 日立安斯泰莫株式会社 | 热式流量计 |
JP2021139861A (ja) * | 2020-03-10 | 2021-09-16 | オムロン株式会社 | パッケージ型フローセンサ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4542650A (en) * | 1983-08-26 | 1985-09-24 | Innovus | Thermal mass flow meter |
DE19511687A1 (de) * | 1995-03-30 | 1996-10-02 | Cms Mikrosysteme Gmbh Chemnitz | Durchflußmengenaufnehmer |
NL1003315C2 (nl) * | 1996-06-11 | 1997-12-17 | Europ Semiconductor Assembly E | Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling. |
AT410727B (de) | 2000-03-14 | 2003-07-25 | Austria Mikrosysteme Int | Verfahren zum unterbringen von sensoren in einem gehäuse |
-
2003
- 2003-04-02 GB GBGB0307616.3A patent/GB0307616D0/en not_active Ceased
-
2004
- 2004-04-02 DE DE602004002690T patent/DE602004002690T2/de not_active Expired - Lifetime
- 2004-04-02 AT AT04725444T patent/ATE341749T1/de not_active IP Right Cessation
- 2004-04-02 US US10/551,514 patent/US7691652B2/en active Active
- 2004-04-02 WO PCT/IB2004/001012 patent/WO2004088255A2/en active IP Right Grant
- 2004-04-02 ES ES04725444T patent/ES2274443T3/es not_active Expired - Lifetime
- 2004-04-02 EP EP04725444A patent/EP1623190B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1623190B1 (de) | 2006-10-04 |
GB0307616D0 (en) | 2003-05-07 |
WO2004088255A3 (en) | 2005-01-20 |
US7691652B2 (en) | 2010-04-06 |
EP1623190A2 (de) | 2006-02-08 |
DE602004002690T2 (de) | 2007-08-23 |
WO2004088255A2 (en) | 2004-10-14 |
US20060234414A1 (en) | 2006-10-19 |
DE602004002690D1 (de) | 2006-11-16 |
ES2274443T3 (es) | 2007-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |