ATE337614T1 - Wärmeableitung von einer leiterplatte mit blossen chips - Google Patents

Wärmeableitung von einer leiterplatte mit blossen chips

Info

Publication number
ATE337614T1
ATE337614T1 AT00926149T AT00926149T ATE337614T1 AT E337614 T1 ATE337614 T1 AT E337614T1 AT 00926149 T AT00926149 T AT 00926149T AT 00926149 T AT00926149 T AT 00926149T AT E337614 T1 ATE337614 T1 AT E337614T1
Authority
AT
Austria
Prior art keywords
circuit board
chips
heat dissipation
bare chips
compression modulus
Prior art date
Application number
AT00926149T
Other languages
German (de)
English (en)
Inventor
Paul G Schoenstein
Benjamin L Sitler
Robert H Reamey
Christine E Vogdes
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of ATE337614T1 publication Critical patent/ATE337614T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT00926149T 1999-04-20 2000-04-19 Wärmeableitung von einer leiterplatte mit blossen chips ATE337614T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/295,081 US6162663A (en) 1999-04-20 1999-04-20 Dissipation of heat from a circuit board having bare silicon chips mounted thereon

Publications (1)

Publication Number Publication Date
ATE337614T1 true ATE337614T1 (de) 2006-09-15

Family

ID=23136132

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00926149T ATE337614T1 (de) 1999-04-20 2000-04-19 Wärmeableitung von einer leiterplatte mit blossen chips

Country Status (9)

Country Link
US (1) US6162663A (enExample)
EP (1) EP1171914B1 (enExample)
JP (2) JP5084987B2 (enExample)
KR (1) KR100742521B1 (enExample)
AT (1) ATE337614T1 (enExample)
DE (1) DE60030267T2 (enExample)
MX (1) MXPA01010665A (enExample)
TW (1) TW549011B (enExample)
WO (1) WO2000063968A1 (enExample)

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US7443671B2 (en) * 2005-10-31 2008-10-28 Hewlett-Packard Development Company, L.P. Axial duct cooling fan
US7326032B2 (en) * 2005-10-31 2008-02-05 Hewlett-Packard Development Company, L.P. Cooling fan with adjustable tip clearance
US7558061B2 (en) * 2006-08-04 2009-07-07 Hewlett-Packard Development Company, L.P. Cooling fan module
US20080067669A1 (en) * 2006-09-18 2008-03-20 Buttel Nicole A Systems, devices and methods for controlling thermal interface thickness in a semiconductor die package
US20080068803A1 (en) * 2006-09-18 2008-03-20 Shyh-Ming Chen Heat dissipating device holder structure with a thin film thermal conducting medium coating
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8076773B2 (en) * 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
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CA2770719C (en) 2009-08-12 2017-12-12 Jonathan Bergin Fully-cured thermally or electrically-conductive form-in-place gap filler
JP5614909B2 (ja) * 2012-03-02 2014-10-29 富士高分子工業株式会社 パテ状伝熱材及びその製造方法
JPWO2014136503A1 (ja) * 2013-03-07 2017-02-09 日産自動車株式会社 回転電機
US20150092352A1 (en) * 2013-09-29 2015-04-02 International Business Machines Corporation Thermal Interface Solution With Reduced Adhesion Force
US11121125B2 (en) 2018-12-12 2021-09-14 Micron Technology, Inc. Thermal chamber for a thermal control component
USD893484S1 (en) 2018-12-12 2020-08-18 Micron Technology, Inc. Thermal control component
TWI896542B (zh) 2019-07-23 2025-09-11 德商漢高股份有限及兩合公司 高熱通量多元件總成之熱管理
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Also Published As

Publication number Publication date
US6162663A (en) 2000-12-19
EP1171914B1 (en) 2006-08-23
KR20020005694A (ko) 2002-01-17
JP5084987B2 (ja) 2012-11-28
WO2000063968A1 (en) 2000-10-26
EP1171914A1 (en) 2002-01-16
JP2012054578A (ja) 2012-03-15
TW549011B (en) 2003-08-21
JP2002542626A (ja) 2002-12-10
MXPA01010665A (es) 2002-07-02
DE60030267T2 (de) 2007-07-05
KR100742521B1 (ko) 2007-08-02
DE60030267D1 (de) 2006-10-05

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