ATE332073T1 - Verfahren zur radiofrequenzabschirmung von elektronischen bauteilen - Google Patents

Verfahren zur radiofrequenzabschirmung von elektronischen bauteilen

Info

Publication number
ATE332073T1
ATE332073T1 AT02749080T AT02749080T ATE332073T1 AT E332073 T1 ATE332073 T1 AT E332073T1 AT 02749080 T AT02749080 T AT 02749080T AT 02749080 T AT02749080 T AT 02749080T AT E332073 T1 ATE332073 T1 AT E332073T1
Authority
AT
Austria
Prior art keywords
lamina
insulating
radio frequency
electronic components
shielding
Prior art date
Application number
AT02749080T
Other languages
English (en)
Inventor
Richard Paul Townsend
Original Assignee
Ubinetics Vpt Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ubinetics Vpt Ltd filed Critical Ubinetics Vpt Ltd
Application granted granted Critical
Publication of ATE332073T1 publication Critical patent/ATE332073T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Circuits Of Receivers In General (AREA)
  • Laminated Bodies (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
AT02749080T 2001-08-11 2002-07-30 Verfahren zur radiofrequenzabschirmung von elektronischen bauteilen ATE332073T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0119673A GB2378582B (en) 2001-08-11 2001-08-11 A method of providing radio frequency screening for electronic components

Publications (1)

Publication Number Publication Date
ATE332073T1 true ATE332073T1 (de) 2006-07-15

Family

ID=9920267

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02749080T ATE332073T1 (de) 2001-08-11 2002-07-30 Verfahren zur radiofrequenzabschirmung von elektronischen bauteilen

Country Status (5)

Country Link
EP (1) EP1415521B1 (de)
AT (1) ATE332073T1 (de)
DE (1) DE60212855T2 (de)
GB (1) GB2378582B (de)
WO (1) WO2003015487A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7161092B2 (en) 2002-04-15 2007-01-09 Visteon Global Technologies, Inc. Apparatus and method for protecting an electronic circuit
RU2284267C2 (ru) 2004-11-10 2006-09-27 Броня Цой Материал для компонентов радиоэлектронных приборов
EP2043149A1 (de) 2007-09-27 2009-04-01 Oticon A/S Anordnung mit einem elektromagnetischen abgeschirmten SMD-Bauelement, Herstellungsverfahren und Anwendung
JP2009212446A (ja) * 2008-03-06 2009-09-17 Smk Corp 電子部品筐体のシールド方法及びシールド部材
CN101800215B (zh) * 2009-02-11 2012-07-04 日月光半导体制造股份有限公司 无线通讯模组封装构造
JP2011018873A (ja) * 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
DE102011089639A1 (de) * 2011-12-22 2013-06-27 Siemens Aktiengesellschaft Schaltungsträger mit einer separaten HF-Schaltung und Verfahren zum Bestücken eines solchen Schaltungsträgers
CN105555018A (zh) * 2016-02-16 2016-05-04 广东欧珀移动通信有限公司 一种印刷电路板及电子终端

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1088408A (en) * 1966-07-15 1967-10-25 Standard Telephones Cables Ltd Electrical screening
EP0109505A3 (de) * 1982-10-25 1985-01-09 Allied Corporation Stanzbare Polymerverbindung mit einer Abschirmungsschicht gegen elektromagnetische Störungen
US4670347A (en) * 1986-03-12 1987-06-02 Topflight Corp. RFI/EMI shielding apparatus
GB2200321B (en) * 1987-02-03 1990-07-18 Pilkington Brothers Plc Electromagnetic shielding laminate
US5066937A (en) * 1990-06-24 1991-11-19 Barkley & Dexter Laboratories Search coil assembly with laminate frame members and method for making same
US5702994A (en) * 1991-10-05 1997-12-30 Besma Beschichtungsmassen Gmbh Moldable film for fastening to a base and shielding from radiation or for insulation of electrically conducting parts
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
US5545494A (en) * 1995-08-10 1996-08-13 Northern Telecom Limited Environmental protectors for electronics devices
FI956226A (fi) * 1995-12-22 1997-06-23 Nokia Mobile Phones Ltd Menetelmä ja järjestely elektronisen väliaineen sähkömagneettiseksi suojaamiseksi
US5800724A (en) * 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
TW355163B (en) * 1997-01-23 1999-04-01 Shiyouritsu Plast Kogyo Kk Sheet-like laminate and preparation thereof
JP3723338B2 (ja) * 1997-01-23 2005-12-07 株式会社クラレ シート状積層物及びその製造方法
US5867371A (en) * 1997-09-29 1999-02-02 Ericsson Inc. Cover member for sealed circuit board assembly
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures

Also Published As

Publication number Publication date
DE60212855D1 (de) 2006-08-10
GB0119673D0 (en) 2001-10-03
EP1415521A1 (de) 2004-05-06
WO2003015487A1 (en) 2003-02-20
GB2378582A (en) 2003-02-12
GB2378582B (en) 2005-03-16
DE60212855T2 (de) 2007-02-01
EP1415521B1 (de) 2006-06-28

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Legal Events

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