ATE315327T1 - Fassung für bga-packungen - Google Patents

Fassung für bga-packungen

Info

Publication number
ATE315327T1
ATE315327T1 AT01301095T AT01301095T ATE315327T1 AT E315327 T1 ATE315327 T1 AT E315327T1 AT 01301095 T AT01301095 T AT 01301095T AT 01301095 T AT01301095 T AT 01301095T AT E315327 T1 ATE315327 T1 AT E315327T1
Authority
AT
Austria
Prior art keywords
socket
frame
contact assembly
alignment
package
Prior art date
Application number
AT01301095T
Other languages
English (en)
Inventor
Jonathan W Goodwin
Stephen Delprete
Steven Wakefield
Original Assignee
Thomas & Betts Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas & Betts Int filed Critical Thomas & Betts Int
Application granted granted Critical
Publication of ATE315327T1 publication Critical patent/ATE315327T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
AT01301095T 2000-02-08 2001-02-07 Fassung für bga-packungen ATE315327T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/499,772 US6293810B1 (en) 2000-02-08 2000-02-08 Socket for BGA packages

Publications (1)

Publication Number Publication Date
ATE315327T1 true ATE315327T1 (de) 2006-02-15

Family

ID=23986637

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01301095T ATE315327T1 (de) 2000-02-08 2001-02-07 Fassung für bga-packungen

Country Status (5)

Country Link
US (1) US6293810B1 (de)
EP (1) EP1124407B1 (de)
JP (1) JP4791639B2 (de)
AT (1) ATE315327T1 (de)
DE (1) DE60116437T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6945788B2 (en) * 2003-07-31 2005-09-20 Tyco Electronics Corporation Metal contact LGA socket
US6881073B2 (en) * 2003-08-12 2005-04-19 Cinch Connectors, Inc. Electrical connector
US7059869B2 (en) * 2004-02-27 2006-06-13 Tyco Electronics Corporation Metal contact LGA socket
KR100602442B1 (ko) * 2004-05-18 2006-07-19 삼성전자주식회사 매개 기판을 갖는 볼 그리드 어레이 패키지용 테스트 소켓
US7442049B2 (en) * 2005-02-09 2008-10-28 International Business Machines Corporation Electrical connecting device and method of forming same
US7331796B2 (en) * 2005-09-08 2008-02-19 International Business Machines Corporation Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
KR100974586B1 (ko) 2007-12-31 2010-08-06 이성재 비지에이형 반도체 소자 검사용 소켓
JP1618359S (de) * 2018-04-23 2018-11-19
JP1618358S (de) * 2018-04-23 2018-11-19
DE102020005363A1 (de) * 2019-09-12 2021-03-18 Sew-Eurodrive Gmbh & Co Kg Elektrogerät und Verfahren zum Herstellen eines ersten und zweiten Elektrogeräts aus einem Baukasten
USD949799S1 (en) * 2020-06-09 2022-04-26 Yamaichi Electronics Co., Ltd. Mezzanine connector housing

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239312A (en) * 1978-11-29 1980-12-16 Hughes Aircraft Company Parallel interconnect for planar arrays
FR2669149B1 (fr) * 1990-11-12 1994-09-02 Souriau & Cie Connecteur intermediaire entre carte de circuit imprime et substrat a circuits electroniques actifs.
US5155905A (en) * 1991-05-03 1992-10-20 Ltv Aerospace And Defense Company Method and apparatus for attaching a circuit component to a printed circuit board
US5163837A (en) * 1991-06-26 1992-11-17 Amp Incorporated Ordered area array connector
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
US5344334A (en) * 1993-06-11 1994-09-06 The Whitaker Corporation Hinged cover for an electrical socket
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
US5713744A (en) * 1994-09-28 1998-02-03 The Whitaker Corporation Integrated circuit socket for ball grid array and land grid array lead styles
NL9401658A (nl) * 1994-10-07 1996-05-01 Framatome Connectors Belgium Connector voor een substraat met een elektronische schakeling.
JPH0935789A (ja) * 1995-07-21 1997-02-07 Shin Etsu Polymer Co Ltd 異方導電性シートおよびその製造方法
US5730620A (en) * 1995-09-08 1998-03-24 International Business Machines Corporation Method and apparatus for locating electrical circuit members
TW383951U (en) * 1996-01-23 2000-03-01 Whitaker Corp Electrical connector for connecting electronic package to circuit board
US5738531A (en) * 1996-09-09 1998-04-14 International Business Machines Corporation Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer
US5919050A (en) * 1997-04-14 1999-07-06 International Business Machines Corporation Method and apparatus for separable interconnecting electronic components
JPH11176545A (ja) * 1997-12-12 1999-07-02 Pfu Ltd Ｂｇａソケットアダプタ
JPH11271392A (ja) * 1998-03-25 1999-10-08 Machine Active Contact:Kk キャリアソケット構造体
US6114757A (en) * 1999-09-27 2000-09-05 Thomas & Betts International, Inc. Leadless IC socket

Also Published As

Publication number Publication date
JP2001257050A (ja) 2001-09-21
US6293810B1 (en) 2001-09-25
DE60116437T2 (de) 2006-08-03
DE60116437D1 (de) 2006-03-30
EP1124407A2 (de) 2001-08-16
EP1124407B1 (de) 2006-01-04
JP4791639B2 (ja) 2011-10-12
EP1124407A3 (de) 2003-05-14

Similar Documents

Publication Publication Date Title
ES2141200T3 (es) Aparato para interconectar contactos electricos.
PT817319E (pt) Sistema de contactos de interligacao electrica
DE60204640D1 (de) Koaxialverbinder zum Verbinden von Leiterplatten
KR950010190A (ko) 전자식 카드 및 그와함께 사용하기 위한 커넥터 조립체
DE60019527D1 (de) Electrischer Steckverbinder mit Zugentlastungvorrichtung
ATE315327T1 (de) Fassung für bga-packungen
ATE267474T1 (de) Mikroelektronische kontakte und zusammenbauten
CA2197143A1 (en) Printed circuit board connector
KR850000144A (ko) 간이 전기스위치
DE60304749D1 (de) Verbinder mit Kugelmatrixgehäuse
ATE418114T1 (de) Chipkartenverbinder und schaltkontaktelemente dafür
JP2001244599A (ja) Ｉｃの実装構造及びｂｇａ形ｉｃ用位置固定シート
ATE307399T1 (de) Kugelmatrix-verbinder
DE69905129D1 (de) Elektrischer Kontakt und Gurtanordnung
ATE224109T1 (de) Leiterplattenoberflächenmontierbarer elektrischer verbinder mit vorgespannten kontakten
ATE385352T1 (de) Klemmenblock und kabelverbinder
TW200601624A (en) Land grid array socket
DE60104271D1 (de) Verbinder
WO2002067322A3 (en) Semiconductor device having signal contacts and high current power contacts
WO2000004585A3 (de) Chipträgeranordnung sowie verfahren zur herstellung einer chipträgeranordnung mit elektrischem test
DE60030665D1 (de) Selbsteinstellende metallische Befestigungsvorrichtung
DE60002933D1 (de) Verbinderkontakt
DE50205421D1 (de) Federblech zum Kontaktieren eines Bauteils auf einer Leiterplatte
TW428349B (en) Socket for printed circuit boards
JP2005038700A (ja) コネクタ

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties