ATE314700T1 - Elektronischer datenträger - Google Patents

Elektronischer datenträger

Info

Publication number
ATE314700T1
ATE314700T1 AT01983732T AT01983732T ATE314700T1 AT E314700 T1 ATE314700 T1 AT E314700T1 AT 01983732 T AT01983732 T AT 01983732T AT 01983732 T AT01983732 T AT 01983732T AT E314700 T1 ATE314700 T1 AT E314700T1
Authority
AT
Austria
Prior art keywords
electronic data
main side
recess
storage medium
data carrier
Prior art date
Application number
AT01983732T
Other languages
English (en)
Inventor
Pascal Billebaud
Yves Reignoux
Original Assignee
Axalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axalto Sa filed Critical Axalto Sa
Application granted granted Critical
Publication of ATE314700T1 publication Critical patent/ATE314700T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07724Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT01983732T 2000-11-28 2001-11-19 Elektronischer datenträger ATE314700T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0015323A FR2817374B1 (fr) 2000-11-28 2000-11-28 Support electronique d'informations
PCT/IB2001/002203 WO2002045010A1 (en) 2000-11-28 2001-11-19 Electronic data storage medium

Publications (1)

Publication Number Publication Date
ATE314700T1 true ATE314700T1 (de) 2006-01-15

Family

ID=8856938

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01983732T ATE314700T1 (de) 2000-11-28 2001-11-19 Elektronischer datenträger

Country Status (7)

Country Link
US (1) US20080245877A1 (de)
EP (1) EP1346316B1 (de)
CN (1) CN1333368C (de)
AT (1) ATE314700T1 (de)
DE (1) DE60116378T2 (de)
FR (1) FR2817374B1 (de)
WO (1) WO2002045010A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100371948C (zh) * 2002-10-15 2008-02-27 雅斯拓股份有限公司 用支承带制造数据载体的方法以及该方法中使用的支承带
WO2004036648A2 (en) * 2002-10-15 2004-04-29 Axalto Sa Method of manufacturing a data carrier
ATE551668T1 (de) * 2006-11-17 2012-04-15 Oberthur Technologies Verfahren zur herstellung einer entität und entsprechende vorrichtung
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
WO2015116611A1 (en) 2014-01-31 2015-08-06 3M Innovative Properties Company Aqueous composition suitable for cleaning and protection comprising silica nanoparticles, copolymer of acrylamide and acrylic acd, nonionic and anionic surfactant
US10414941B2 (en) 2015-03-13 2019-09-17 3M Innovative Properties Company Composition suitable for protection comprising copolymer and hydrophilic silane
JP6605011B2 (ja) * 2017-12-04 2019-11-13 株式会社バンダイ 情報保持媒体及び情報処理システム
KR102440366B1 (ko) * 2018-01-04 2022-09-05 삼성전자주식회사 메모리 카드 및 이를 포함하는 전자 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
FR2736453B1 (fr) * 1995-07-07 1997-08-08 Gemplus Card Int Support portable a microcircuit, notamment carte a puce, et procede de fabrication dudit support
DE19609636C1 (de) * 1996-03-12 1997-08-14 Siemens Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
DE19621044A1 (de) * 1996-05-24 1997-11-27 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines kartenförmigen Datenträgers
ES2149000T3 (es) * 1996-08-02 2000-10-16 Schlumberger Systems & Service Tarjeta de circuito integrado con conexion mixta.

Also Published As

Publication number Publication date
CN1333368C (zh) 2007-08-22
EP1346316A1 (de) 2003-09-24
DE60116378T2 (de) 2006-08-24
FR2817374A1 (fr) 2002-05-31
WO2002045010A1 (en) 2002-06-06
CN1554070A (zh) 2004-12-08
FR2817374B1 (fr) 2003-02-21
DE60116378D1 (de) 2006-02-02
EP1346316B1 (de) 2005-12-28
US20080245877A1 (en) 2008-10-09

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties