ATE297817T1 - Gemusterte beschichtung mit komprimiertem kohlendioxid - Google Patents
Gemusterte beschichtung mit komprimiertem kohlendioxidInfo
- Publication number
- ATE297817T1 ATE297817T1 AT01999437T AT01999437T ATE297817T1 AT E297817 T1 ATE297817 T1 AT E297817T1 AT 01999437 T AT01999437 T AT 01999437T AT 01999437 T AT01999437 T AT 01999437T AT E297817 T1 ATE297817 T1 AT E297817T1
- Authority
- AT
- Austria
- Prior art keywords
- carbon dioxide
- compressed carbon
- patterned coating
- patterned
- solvent phase
- Prior art date
Links
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 title abstract 4
- 229910002092 carbon dioxide Inorganic materials 0.000 title abstract 2
- 239000001569 carbon dioxide Substances 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000000151 deposition Methods 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 230000008021 deposition Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000000725 suspension Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
- H01L21/0212—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/025—Processes for applying liquids or other fluent materials performed by spraying using gas close to its critical state
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
- B05D2401/90—Form of the coating product, e.g. solution, water dispersion, powders or the like at least one component of the composition being in supercritical state or close to supercritical state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Laminated Bodies (AREA)
- Magnetic Record Carriers (AREA)
- Carbon And Carbon Compounds (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0029673A GB0029673D0 (en) | 2000-12-06 | 2000-12-06 | Patterned deposition using compressed Co |
GB0115538A GB0115538D0 (en) | 2000-12-06 | 2001-06-26 | Patterned deposition using compressed CO2 |
PCT/GB2001/005402 WO2002045868A2 (en) | 2000-12-06 | 2001-12-06 | Patterned deposition using compressed carbon dioxide |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE297817T1 true ATE297817T1 (de) | 2005-07-15 |
Family
ID=26245382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01999437T ATE297817T1 (de) | 2000-12-06 | 2001-12-06 | Gemusterte beschichtung mit komprimiertem kohlendioxid |
Country Status (7)
Country | Link |
---|---|
US (2) | US20040052944A1 (de) |
EP (1) | EP1341616B1 (de) |
JP (1) | JP2004524948A (de) |
AT (1) | ATE297817T1 (de) |
AU (1) | AU2002220903A1 (de) |
DE (1) | DE60111564T2 (de) |
WO (1) | WO2002045868A2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7276184B2 (en) | 2001-07-12 | 2007-10-02 | Eastman Kodak Company | Surfactant assisted nanomaterial generation process |
US6595630B2 (en) * | 2001-07-12 | 2003-07-22 | Eastman Kodak Company | Method and apparatus for controlling depth of deposition of a solvent free functional material in a receiver |
US20030107614A1 (en) | 2001-12-06 | 2003-06-12 | Eastman Kodak Company | Method and apparatus for printing |
US20040043140A1 (en) * | 2002-08-21 | 2004-03-04 | Ramesh Jagannathan | Solid state lighting using compressed fluid coatings |
US20040043138A1 (en) * | 2002-08-21 | 2004-03-04 | Ramesh Jagannathan | Solid state lighting using compressed fluid coatings |
US20040108061A1 (en) * | 2002-12-06 | 2004-06-10 | Eastman Kodak Company | Apparatus and method for making a light-emitting display |
US6843556B2 (en) * | 2002-12-06 | 2005-01-18 | Eastman Kodak Company | System for producing patterned deposition from compressed fluid in a dual controlled deposition chamber |
US6927415B2 (en) | 2002-12-06 | 2005-08-09 | Eastman Kodak Company | Compressed fluid formulation containing electron transporting material |
US20040108060A1 (en) * | 2002-12-06 | 2004-06-10 | Eastman Kodak Company | System for producing patterned deposition from compressed fluids |
EP1427033A3 (de) * | 2002-12-06 | 2008-07-09 | Eastman Kodak Company | Formulierung einer kompremierten Flüssigkeit, die ein Elektrontransport-, Lochinjektions-, Lochleiter- und elektrolumineszierendes Material enthält |
US6780249B2 (en) * | 2002-12-06 | 2004-08-24 | Eastman Kodak Company | System for producing patterned deposition from compressed fluid in a partially opened deposition chamber |
US6896723B2 (en) | 2002-12-06 | 2005-05-24 | Eastman Kodak Company | Compressed fluid formulation containing hole transporting material |
US6896827B2 (en) | 2002-12-06 | 2005-05-24 | Eastman Kodak Company | Compressed fluid formulation containing electroluminescent polymeric material |
US6790483B2 (en) * | 2002-12-06 | 2004-09-14 | Eastman Kodak Company | Method for producing patterned deposition from compressed fluid |
US7153539B2 (en) | 2003-06-24 | 2006-12-26 | Eastman Kodak Company | Apparatus and method of color tuning a light-emitting display |
US20040263597A1 (en) | 2003-06-24 | 2004-12-30 | Eastman Kodak Company | Apparatus and method of producing multiple spectral deposits from a mixture of a compressed fluid and a marking material |
US7273643B2 (en) | 2003-06-24 | 2007-09-25 | Eastman Kodak Company | Article having multiple spectral deposits |
US7044376B2 (en) | 2003-07-23 | 2006-05-16 | Eastman Kodak Company | Authentication method and apparatus for use with compressed fluid printed swatches |
JP2005118984A (ja) * | 2003-09-25 | 2005-05-12 | Kagawa Industry Support Foundation | 微粒子の配列制御方法およびその装置 |
GB0406125D0 (en) | 2004-03-18 | 2004-04-21 | Univ Cambridge Tech | Methods of amination |
US20090020221A1 (en) * | 2005-05-27 | 2009-01-22 | Fujifilm Corporation | Method for Producing Self-Assembled Construction |
GB2461527B (en) * | 2008-07-01 | 2011-08-03 | Limited Cambridge Display Technology | Organic electronic device |
TW201043729A (en) * | 2009-06-15 | 2010-12-16 | Nat Univ Chung Cheng | Method and system of forming film by employing supercritical vapor deposition |
JP6140329B1 (ja) * | 2016-04-06 | 2017-05-31 | 長瀬産業株式会社 | 塗装装置及び塗装方法 |
WO2018012223A1 (ja) * | 2016-07-11 | 2018-01-18 | コニカミノルタ株式会社 | 塗布液、その製造方法、電子デバイス作製用インク、電子デバイス、有機エレクトロルミネッセンス素子、及び光電変換素子 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4737384A (en) * | 1985-11-01 | 1988-04-12 | Allied Corporation | Deposition of thin films using supercritical fluids |
DE3787533T2 (de) * | 1987-12-21 | 1994-01-20 | Union Carbide Corp | Verwendung von superkritischen Flüssigkeiten als Verdünner beim Aufsprühen von Überzügen. |
US5215253A (en) * | 1990-08-30 | 1993-06-01 | Nordson Corporation | Method and apparatus for forming and dispersing single and multiple phase coating material containing fluid diluent |
CA2082565A1 (en) * | 1991-11-12 | 1993-05-13 | John N. Argyropoulos | Polyester particularly suitable for use in coating compositions which are sprayed with compressed fluids as viscosity reducing diluents |
US5290603A (en) * | 1992-12-18 | 1994-03-01 | Union Carbide Chemicals & Plastics Technology Corporation | Method for spraying polymeric compositions with reduced solvent emission and enhanced atomization |
US5908721A (en) * | 1996-02-09 | 1999-06-01 | Sharp Kabushiki Kaisha | Using light-shading colored ink capable of changing from hydrophilic to hydrophobic |
US5789027A (en) * | 1996-11-12 | 1998-08-04 | University Of Massachusetts | Method of chemically depositing material onto a substrate |
JP3899566B2 (ja) * | 1996-11-25 | 2007-03-28 | セイコーエプソン株式会社 | 有機el表示装置の製造方法 |
AU735738B2 (en) * | 1997-10-10 | 2001-07-12 | Union Carbide Chemicals & Plastics Technology Corporation | Spray application of an additive composition to sheet materials |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
GB9808806D0 (en) * | 1998-04-24 | 1998-06-24 | Cambridge Display Tech Ltd | Selective deposition of polymer films |
US6090474A (en) * | 1998-09-01 | 2000-07-18 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
US6083565A (en) * | 1998-11-06 | 2000-07-04 | North Carolina State University | Method for meniscus coating with liquid carbon dioxide |
CA2394881A1 (en) * | 1999-12-21 | 2001-06-28 | Plastic Logic Limited | Solution processed devices |
JP3457655B2 (ja) * | 2000-10-10 | 2003-10-20 | 花王株式会社 | 複合化粒子の製造法 |
GB2371248A (en) * | 2000-12-04 | 2002-07-24 | Seiko Epson Corp | Fabrication of self-assembled monolayers |
US7276184B2 (en) * | 2001-07-12 | 2007-10-02 | Eastman Kodak Company | Surfactant assisted nanomaterial generation process |
JP4139663B2 (ja) * | 2002-09-27 | 2008-08-27 | ハリマ化成株式会社 | ナノ粒子の超臨界流体中分散液を用いる微細配線パターンの形成方法 |
-
2001
- 2001-12-06 DE DE60111564T patent/DE60111564T2/de not_active Expired - Lifetime
- 2001-12-06 WO PCT/GB2001/005402 patent/WO2002045868A2/en active IP Right Grant
- 2001-12-06 EP EP01999437A patent/EP1341616B1/de not_active Expired - Lifetime
- 2001-12-06 US US10/433,780 patent/US20040052944A1/en not_active Abandoned
- 2001-12-06 AU AU2002220903A patent/AU2002220903A1/en not_active Abandoned
- 2001-12-06 AT AT01999437T patent/ATE297817T1/de not_active IP Right Cessation
- 2001-12-06 JP JP2002547639A patent/JP2004524948A/ja active Pending
-
2007
- 2007-08-10 US US11/891,485 patent/US20080069734A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002045868A2 (en) | 2002-06-13 |
US20040052944A1 (en) | 2004-03-18 |
DE60111564T2 (de) | 2006-05-11 |
US20080069734A1 (en) | 2008-03-20 |
JP2004524948A (ja) | 2004-08-19 |
EP1341616A2 (de) | 2003-09-10 |
AU2002220903A1 (en) | 2002-06-18 |
EP1341616B1 (de) | 2005-06-15 |
WO2002045868A3 (en) | 2002-11-14 |
DE60111564D1 (de) | 2005-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |