ATE286261T1 - Datenoptimierungsverfahren für sondenkartenanalyse und riebmarkanalyse - Google Patents
Datenoptimierungsverfahren für sondenkartenanalyse und riebmarkanalyseInfo
- Publication number
- ATE286261T1 ATE286261T1 AT00112260T AT00112260T ATE286261T1 AT E286261 T1 ATE286261 T1 AT E286261T1 AT 00112260 T AT00112260 T AT 00112260T AT 00112260 T AT00112260 T AT 00112260T AT E286261 T1 ATE286261 T1 AT E286261T1
- Authority
- AT
- Austria
- Prior art keywords
- analysis
- probe card
- optimization methods
- data optimization
- mark
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/327,106 US6414477B1 (en) | 1999-06-07 | 1999-06-07 | Method for optimizing probe card analysis and scrub mark analysis data |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE286261T1 true ATE286261T1 (de) | 2005-01-15 |
Family
ID=23275190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00112260T ATE286261T1 (de) | 1999-06-07 | 2000-06-07 | Datenoptimierungsverfahren für sondenkartenanalyse und riebmarkanalyse |
Country Status (5)
Country | Link |
---|---|
US (2) | US6414477B1 (de) |
EP (2) | EP1519200B1 (de) |
JP (1) | JP3800394B2 (de) |
AT (1) | ATE286261T1 (de) |
DE (2) | DE60017016T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6414477B1 (en) * | 1999-06-07 | 2002-07-02 | Applied Precision, Inc. | Method for optimizing probe card analysis and scrub mark analysis data |
US20020097062A1 (en) * | 2000-10-30 | 2002-07-25 | Strom John Timothy | Method and process of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing analysis, and manufacture |
US8466703B2 (en) | 2003-03-14 | 2013-06-18 | Rudolph Technologies, Inc. | Probe card analysis system and method |
JP5089166B2 (ja) | 2003-03-14 | 2012-12-05 | ルドルフテクノロジーズ インコーポレイテッド | プローブカードアナライザにおける部品のたわみの影響を軽減する方法 |
WO2004084124A1 (en) * | 2003-03-14 | 2004-09-30 | Applied Precision, Llc | System and method of point matching measured positions to template positions |
US6911814B2 (en) * | 2003-07-01 | 2005-06-28 | Formfactor, Inc. | Apparatus and method for electromechanical testing and validation of probe cards |
KR20070075589A (ko) * | 2006-01-13 | 2007-07-24 | 삼성전자주식회사 | 프로브 카드 이상 확인 방법 |
US8311758B2 (en) | 2006-01-18 | 2012-11-13 | Formfactor, Inc. | Methods and apparatuses for dynamic probe adjustment |
JP2007200934A (ja) * | 2006-01-23 | 2007-08-09 | Fujitsu Ltd | プローブカードのプローブ針の針跡評価方法 |
WO2009048618A1 (en) * | 2007-10-11 | 2009-04-16 | Veraconnex, Llc | Probe card test apparatus and method |
JP4997127B2 (ja) * | 2008-01-23 | 2012-08-08 | 東京エレクトロン株式会社 | 検査方法及びこの検査方法を記録したプログラム記録媒体 |
JP5433266B2 (ja) * | 2009-03-19 | 2014-03-05 | 東京エレクトロン株式会社 | 針跡の判定方法及び針跡判定用プログラム |
EP2652544B1 (de) | 2010-12-14 | 2020-08-19 | Alcon Inc. | Gefärbte kontaktlinse |
US10295591B2 (en) * | 2013-01-02 | 2019-05-21 | Texas Instruments Incorporated | Method and device for testing wafers |
US9768134B2 (en) | 2015-01-29 | 2017-09-19 | Micron Technology, Inc. | Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects |
TWI652484B (zh) | 2018-03-06 | 2019-03-01 | 均豪精密工業股份有限公司 | 探針卡線上調針維修系統及其方法 |
TWI744805B (zh) * | 2020-02-24 | 2021-11-01 | 頎邦科技股份有限公司 | 電路板 |
DE102021129067A1 (de) * | 2020-11-13 | 2022-05-19 | Mpi Corporation | Verfahren zur halbleiterinspektion |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4583298A (en) * | 1984-03-07 | 1986-04-22 | Hewlett-Packard Company | Auto calibration method suitable for use in electron beam lithography |
US4864227A (en) | 1987-02-27 | 1989-09-05 | Canon Kabushiki Kaisha | Wafer prober |
US4918374A (en) | 1988-10-05 | 1990-04-17 | Applied Precision, Inc. | Method and apparatus for inspecting integrated circuit probe cards |
JP3723232B2 (ja) * | 1992-03-10 | 2005-12-07 | シリコン システムズ インコーポレーテッド | プローブ針調整ツール及びプローブ針調整法 |
US5657394A (en) * | 1993-06-04 | 1997-08-12 | Integrated Technology Corporation | Integrated circuit probe card inspection system |
US5644245A (en) | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
JP2632136B2 (ja) * | 1994-10-17 | 1997-07-23 | 日本電子材料株式会社 | 高温測定用プローブカード |
US6414477B1 (en) * | 1999-06-07 | 2002-07-02 | Applied Precision, Inc. | Method for optimizing probe card analysis and scrub mark analysis data |
-
1999
- 1999-06-07 US US09/327,106 patent/US6414477B1/en not_active Expired - Fee Related
-
2000
- 2000-06-07 DE DE60017016T patent/DE60017016T2/de not_active Expired - Lifetime
- 2000-06-07 AT AT00112260T patent/ATE286261T1/de not_active IP Right Cessation
- 2000-06-07 JP JP2000210553A patent/JP3800394B2/ja not_active Expired - Lifetime
- 2000-06-07 DE DE60032953T patent/DE60032953D1/de not_active Expired - Lifetime
- 2000-06-07 EP EP04030715A patent/EP1519200B1/de not_active Expired - Lifetime
- 2000-06-07 EP EP00112260A patent/EP1061381B1/de not_active Expired - Lifetime
-
2002
- 2002-07-02 US US10/191,039 patent/US6621262B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60017016D1 (de) | 2005-02-03 |
EP1061381A2 (de) | 2000-12-20 |
EP1519200B1 (de) | 2007-01-10 |
JP2001118890A (ja) | 2001-04-27 |
JP3800394B2 (ja) | 2006-07-26 |
DE60017016T2 (de) | 2005-05-25 |
EP1061381A3 (de) | 2001-09-26 |
US6414477B1 (en) | 2002-07-02 |
DE60032953D1 (de) | 2007-02-22 |
EP1061381B1 (de) | 2004-12-29 |
US6621262B2 (en) | 2003-09-16 |
US20020171414A1 (en) | 2002-11-21 |
EP1519200A1 (de) | 2005-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |